110 results about "Radiative transfer" patented technology

Processes are provided for depositing multiple color filter materials on a substrate to form color filters. In a first process, the surface characteristic of a substrate is modified by radiation so that a flowable form of a first color filter material will be deposited on a first area, and converted to a non-flowable form. A second color filter material can then be deposited on a second area of the substrate. In a second process, first and second color filter materials are deposited on separate donor sheets and transferred by radiation to separate areas of the substrate. A third process uses flexographic printing to transfer the first and second color filter materials to the substrate.

A system and method for assessing a condition of property for insurance purposes includes a sensor for acquiring a spectral image. In a preferred embodiment, the spectral image is post-processed to generate at least one spectral radiance plot, the plot used as input to a radiative transfer computer model. The output of the model establishes a spectral signature for the property. Over a period of time, spectral signatures can be compared to generate a spectral difference, the difference attributed to a change in the condition of the property, such as a fire or flood. In response to the change, an insurance company initiates an insurance-related action such as processing a claim.

A method for improving the operation of an OLED includes maximizing on-radiative transfer of excited state energy from the OLED's organic emissive material to surface plasmon polaritons in an enhancement layer by providing the enhancement layer no more than a threshold distance away from the organic emissive layer; and emitting light into free space from the enhancement layer by scattering the energy from the surface plasmon polaritons through an outcoupling layer that is provided proximate to the enhancement layer but opposite from the organic emissive layer.

Apparatus for dynamic surface annealing of a semiconductor wafer includes a source of laser radiation emitting at a laser wavelength and comprising an array of lasers arranged in rows and columns, the optical power of each the laser being individual adjustable and optics for focusing the radiation from the array of lasers into a narrow line beam in a workpiece plane corresponding to a workpiece surface, whereby the optics images respective columns of the laser array onto respective sections of the narrow line beam. A pyrometer sensor is provided that is sensitive to a pyrometer wavelength. An optical element in an optical path of the optics is tuned to divert radiation emanating from the workpiece plane to the pyrometry sensor. As a result, the optics images each of the respective section of the narrow line beam onto a corresponding portion of the pyrometer sensor. The apparatus further includes a controller responsive to the pyrometry sensor and coupled to adjust individual optical outputs of respective columns of the laser array in accordance with outputs of corresponding portions of the pyrometry sensor.

A reconstruction technique for reducing computation burden in the 3D image processes, wherein the reconstruction procedure comprises an inverse and a forward model. The inverse model uses a hybrid dual Fourier algorithm that combines a 2D Fourier inversion with a 1D matrix inversion to thereby provide high-speed inverse computations. The inverse algorithm uses a hybrid transfer to provide fast Fourier inversion for data of multiple sources and multiple detectors. The forward model is based on an analytical cumulant solution of a radiative transfer equation. The accurate analytical form of the solution to the radiative transfer equation provides an efficient formalism for fast computation of the forward model.

An EUV mask (10, 309) includes an opening (26) that helps to attenuate and phase shift extreme ultraviolet radiation using a subtractive rather than additive method. A first embedded layer (20) and a second embedded layer (21) may be provided between a lower multilayer reflective stack (14) and an upper multilayer reflective stack (22) to ensure an appropriate and accurate depth of the opening (26), while allowing for defect inspection of the EUV mask (10, 309) and optional defect repair. An optional ARC layer (400) may be deposited in region (28) to reduce the amount of reflection within dark region (28). Alternately, a single embedded layer of hafnium oxide, zirconium oxide, tantalum silicon oxide, tantalum oxide, or the like, may be used in place of embedded layers (20, 21). Optimal thicknesses and locations of the various layers are described.

A hybrid method is presented by which Monte Carlo techniques are combined with iterative relaxation techniques to solve the Radiative Transfer Equation in arbitrary one-, two- or three-dimensional optical environments. The optical environments are first divided into contiguous regions, or elements, with Monte Carlo techniques then being employed to determine the optical response function of each type of element. The elements are combined, and the iterative relaxation techniques are used to determine simultaneously the radiance field on the boundary and throughout the interior of the modeled environment. This hybrid model is capable of providing estimates of the under-water light field needed to expedite inspection of ship hulls and port facilities. It is also capable of providing estimates of the subaerial light field for structured, absorbing or non-absorbing environments such as shadows of mountain ranges within and without absorption spectral bands such as water vapor or CO2 bands.

A computer implemented method. The method includes obtaining, using a processor, reflectance data from a target coating and calculating, using the processor, a reflectance from the data, wherein calculating comprises performing a calculation using a radiative transfer equation. The method also includes generating, using the processor and based on the reflectance, a coating formulation that is the same or substantially similar in appearance to the target coating.

An antenna array comprises a surface comprising a replicated pattern of conductive tracks, the tracks defining a plurality of ports. A plurality of antennae are located at ports distributed about the surface. A plurality of radiative transceivers are electrically connected to a respective antenna. A plurality of reference transceivers are electrically connected to a non-radiative impedance located at a respective port so that each reference transceiver is surrounded by a group of antennae and electrically coupled to the group of antennae by the tracks. At least one antenna from at least one group of antennae belongs to one other group of antennae. Calibration circuitry includes a controller associated with each reference transceiver, each controller being arranged to transmit a calibration signal through an associated reference transceiver and to receive and store a received calibration signal from a selected transceiver for the group of antennae coupled to the reference transceiver. Each controller is further arranged to receive and store a calibration signal from the selected transceiver for the group of antennae coupled to the reference transceiver. The calibration circuitry further includes for each other transceiver for the group of antenna, circuitry for adjusting the phase and amplitude of signals transmitted and received by the radiative transceivers relative to the stored calibration signals for the selected radiative transceiver.