18030 results about "Bonding strength" patented technology

A method for determining conditions for forming a dielectric SiOCH film, includes: (i) forming a dielectric SiOCH film on a substrate under conditions; (ii) evaluating the conditions using a ratio of Si—CH3 bonding strength to Si—O bonding strength of the film as formed in step (i); (iii) if the ratio is 2.50 % or higher, confirming the conditions, and if the ratio is less than 2.50 %, changing the conditions by changing at least one of the susceptor temperature, the distance between upper and lower electrodes, the RF power, and the curing time; and (iv) repeating steps (i) to (iii) until the ratio is 2.50 % or higher.

A thin film device fabrication method in which a thin film device formed on a substrate are transferred to a primary destination-of-transfer part and then the thin film device is transferred to a secondary destination-of-transfer part. A first separation layer (120) made of such a material as amorphous silicon is provided on a substrate (100) which allows passage of laser. A thin film device (140) such as TFTs are formed on the substrate (100). Further, a second separation layer (160) such as a hot-melt adhesive layer is formed on the thin film devices (140), and a primary destination-of-transfer part (180) is mounted thereon. The bonding strength of the first separation layer is weakened by irradiation with light, and the substrate (100) is removed. Thus, the thin film device (140) is transferred to the primary destination-of-transfer part. Then, a secondary destination-of-transfer part (200) is attached onto the bottom of an exposed part of the thin film device (140) via an adhesive layer (190). Thereafter, the bonding strength of the second separation layer is weakened by such means as thermal fusion, and the primary destination-of-transfer part is removed. In this manner, the thin film device (140) can be transferred to the secondary destination-of-transfer part (200) while maintaining layering relationship with respect to the substrate (100).

A method of bonding includes using a bonding layer having a fluorinated oxide. Fluorine may be introduced into the bonding layer by exposure to a fluorine-containing solution, vapor or gas or by implantation. The bonding layer may also be formed using a method where fluorine is introduced into the layer during its formation. The surface of the bonding layer is terminated with a desired species, preferably an NH2 species. This may be accomplished by exposing the bonding layer to an NH4OH solution. High bonding strength is obtained at room temperature. The method may also include bonding two bonding layers together and creating a fluorine distribution having a peak in the vicinity of the interface between the bonding layers. One of the bonding layers may include two oxide layers formed on each other. The fluorine concentration may also have a second peak at the interface between the two oxide layers.

A particle (10) of ferromagnetic powder for use in preparation of soft magnetic core components has a core-shell structure. The particle includes a central core (12) and a shell (14) coated on the central core. The central core is made of magnetic material and is used for providing the necessary magnetic property for the magnetic core components made from the ferromagnetic powder. The shell has a higher electrical resistance than the central core so as to reduce an eddy current loss of the magnetic core component. The shell also functions to provide an excellent bonding strength between particles of the powder.

A golf club head includes a golf club head body and a weight member mounted in a recession of the golf club head body. The weight member includes at least one compartment for receiving a filling material. The weight member is mounted in the recession of the golf club head body before a brazing process for bonding the weight member with the golf club head body. During the brazing process, the filling material is melted and fills a gap between the weight member and walls delimiting the recession of the golf club head body to thereby increasing bonding strength between the weight member and the walls delimiting the recession of the golf club head body.

There are provided a flux cored wire for joining dissimilar materials with each other, capable of enhancing a bonding strength upon joining an aluminum-base material with a steel-base material, and excellent in bonding efficiency, a method for joining the dissimilar materials with each other, and a bonded joint obtained by the method. In particular, there is provided a method for joining dissimilar materials with each other, in the case of melt weld-bonding of high-strength dissimilar materials with each other, that is, the high-strength steel member with the high-strength 6000 series aluminum alloy member and in the case of the steel member being a galvanized steel member. In one mode, use is made of a flux cored wire wherein the interior of an aluminum alloy envelope is filled up with a flux, the flux has fluoride composition containing a given amount of AlF3 without containing chloride, and the aluminum alloy of the envelope contains Si in a range of 1 to 13 mass %. If such a flux cored wire is use, it is possible to obtain a high bonding strength in the case of melt weld-bonding of high-strength dissimilar materials with each other, that is, the high-strength steel member with the high-strength 6000 series aluminum alloy member.

A solar cell module back veneer material comprises a base coat layer having high adhesive strength with EVA, two layers of fluororesin-containing weather resistance coating films and an intermediate polymer basilemma between the two layers of fluororesin-containing resin weather resistance coating films, wherein at least one layer of fluororesin-containing resin weather resistance coating film hashigh light reflection performance, the base coat layer having high adhesive strength with EVA and the weather resistance coating film having high light reflection performance in the coating film arearranged at the side close to a cell sheet in an encapsulated cell module, the fluororesin-containing resin masking liquid has good coating uniformity and good adhesive force with the polymer basilemma, and contains high reflection filler component with the constituents as the follows according to parts by weight: 100 parts of fluororesin-containing resin, 3-20 parts of curing agent, 10-30 parts of high reflection filler, 0.0003-0.0001 part of catalyst, and 50-200 parts of solvent.

The invention relates to a method for preparing graft modification protein adhesives, belonging to the adhesive technical field. The method obtains the graft modification protein adhesives by adopting redox system initiator to react for a period of time at a certain temperature and linking vinyl monomer branched chains on a protein trunk chain. During the production and use processes, substances such as formaldehydes and so on are not released, thereby the method is favorable for environmental protection; and simultaneously the method can increase the added value of protein products and has important economic value. Because more hydrophobic groups are linked on the protein trunk chain, the interaction between the graft modification protein adhesives obtained and molecular groups on the wood surface is stronger and the adhesives are difficult to damage by water molecules, thereby the graft modification protein adhesives have good bonding strength and superior water resistance. The method widens the application environment and solves the problem which disturbs actual application of the protein adhesives for a long time, consequently having obvious technical advance.

A wire-bonding method for chips with copper interconnects by introducing a thin layer is provided for solving the problem of oxidizing a copper bonding-pad during bonding processing in order not to deteriorate the bonding strength and yield rate thereof. The wire-bonding method of the present invention comprises: a step for providing a chip with a copper bonding-pad; another step for providing an aqueous solution to form a Cuprous oxide thin layer on the copper bonding-pad; and yet another step for setting a plurality of copper interconnects on the copper bonding-pad and providing an ultrasonic power for removing the Cuprous oxide layer to have the interconnects bonded on the copper bonding-pad.

The invention discloses a ceramic and polymer composite coated lithium ion diaphragm and a preparation method thereof. The ceramic and polymer composite coated lithium ion diaphragm comprises a polyolefin porous diaphragm, a ceramic coating coated on one side or the two sides of the diaphragm surface and a polymer coating coated on the ceramic surface or the diaphragm surface. The composite diaphragm prepared by the preparation method disclosed by the invention has the advantages that the heat resistance of the diaphragm is greatly improved, and the infiltration of an electrolyte is improved; the bonding strength of the diaphragm and a positive and negative pole piece is improved, so that the internal short-circuit caused by staggering between the diaphragm and an electrode is prevented; meanwhile, the hardness of a battery is improved, so that the safety performance of the battery is greatly improved. In the production process, the ceramic coating and the polymer coating are uniform in thickness and good in uniformity and facilitate continuous and large-scale production.

A bonding pad with high bonding strength to a solder ball and a bump includes a carrier, a wiring layer formed on the carrier, a protection layer formed on top of the wiring layer and a solder mask layer surrounded around the protection layer and the wiring layer to form a bonding pad opening. The protection layer is extended outside the bonding pad opening such that when solder are extended into the bonding pad opening, the solder balls engage with side faces defining the bump pad opening as well as the protection layer outside the bump pad opening and a bonding strength between the bonding pad and the solder performance is increased.

A membrane has a permeate channel including a 3D spacer fabric having an upper and a lower fabric surface (2,3) spaced apart by monofilament thread (4) at a predefined distance, the permeate channel being interposed between two membrane layers (12, 13), wherein the membrane layers are linked at a multitude of points with the upper and lower fabric surfaces to form an integral structure with a high bonding strength suitable for backflush operations. A method provides an integrated permeate channel membrane, including the steps of: —Providing a 3D spacer fabric having an upper and lower surface fabric (2,3) spaced apart by monofilament thread (4) at a predefined distance; and—Applying a membrane layer to both the upper and the lower surface fabric.