163results about How to "Mechanical strength" patented technology

The invention provides a device for filtering emboli from blood flowing through a lumen defined by the walls of a vessel in a patient's body comprising a filter element. The filter element is expandable from a collapsed configuration when the filter element is restrained to an expanded configuration when the filter element is unrestrained. When the filter element is in the expanded configuration, the average pore size is from 30 to 300 microns and the standard deviation of the pore size is less than 20 percent of the average pore size. The filter element has two or more filtering layers, each filtering layer having pores, each filtering layer being adjacent to at least one other filtering layer, and at least one of the filtering layers being made of a self-expanding material.

A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

A semiconductor device includes a semiconductor element formed on a semiconductor substrate, a first interconnect formed over the semiconductor substrate so as to be electrically connected with the semiconductor element, and a second interconnect formed over the first interconnect with an interlevel insulation film made of an insulator having a lower dielectric constant than a dielectric constant of silicon oxide interposed between the first interconnect and the second interconnect. Furthermore, the semiconductor device includes a first dummy interconnect formed in part of the semiconductor substrate located in the vicinity of the first interconnect or the second interconnect.

A film comprising a blend of:i) a homopolymer of ethylene having a Mw / Mn of 3 or a copolymer of ethylene and up to 50% weight % of a C3 to C20 olefm, the copolymer having a CBDI of 50% or more;ii) a homopolymer of propylene or a copolymer of propylene and up to 50 weight % of a comonomer selected from the group consisting of ethylene and C4 to C20 alpha-olefms; andiii) a polymer produced in a high pressure process using a free radical initiator.

A backrest structure for a vehicle seat comprises two hydroformed, tubular, horizontal crosspieces and vertical uprights engaged without any clearance in orifices punched into these crosspieces during hydroforming.

A battery pack includes: a battery having a main surface; and a resin layer capable of being integrated with an armor member armoring the battery so that at least a part of the main surface of the battery is exposed and covering the main surface of the battery, wherein the resin layer is formed by curing a reaction curable resin having a viscosity of not less than 80 mPa·second to less than 1000 mPa·second and a thickness of the resin layer on the main surface of the battery ranges from 0.05 mm to smaller than 0.4 mm.

In a nonwoven fiber assembly which comprises a fiber comprising a thermal adhesive fiber under moisture and in which the fiber are entangled with each other, the fibers are bonded at contacting points of the fibers by melting the thermal adhesive fiber under moisture to distribute the bonded points approximately uniformly, thereby obtaining a buffer substrate. The buffer substrate may further comprises a conjugated fiber comprising a plurality of resins which are different in thermal shrinkage and form a phase separation structure, and the conjugated fibers may have an approximately uniform crimps having an average curvature radius of 20 to 200 μm and are entangled with the fibers constituting the nonwoven fiber assembly. The buffer substrate can be obtained by a method comprising the steps of: forming a web from the fiber comprising the thermal adhesive fiber under moisture; and subjecting the obtained fiber web to a heat and moisture treatment with a high-temperature water vapor to melt the thermal adhesive fiber under moisture for bonding the fibers. The buffer substrate has a high air-permeability, an excellent cushion property and softness.

A gypsum board which has a gypsum core having a first side and a second side and a facing sheet disposed on the first side, wherein the facing sheet is made of a sheet material and said sheet material has at least one surfactant, filler particles and at least one polymeric binder. Also, a process of making a gypsum board.

A socket body and a header body are respectively reinforced by inserted reinforcing members, so that a protruding table in a plug groove of the socket body is eliminated and a width dimension thereof is reduced. The socket body is formed in a flat rectangular parallelepiped shape by resin molding, and a pair of socket reinforcing members is inserted into both end portions in longitudinal direction, each having a pair of fixed portions respectively protruding outward from lower ends of side walls of the socket body and a coupling portion for coupling between a pair of the fixed portions. A plug groove of substantially rectangular shape is formed at center portion of the socket body, and plural pairs of socket contacts are respectively arranged in two lines on both side walls in longitudinal direction along the plug groove. Header reinforcing metal fittings formed on the same base metal and having substantially the same cross section as that of the header posts are integrally inserted into both end portions of the header body in the longitudinal direction.

A transmission line transition includes a waveguide tube section having a waveguide tube, a waveguide tube section that is formed of at least a dielectric substrate and a line transition section formed of at least a dielectric substrate disposed adjacent the waveguide tube section to cover the hole, a transmission line for transmitting the electromagnetic wave, and an antenna pattern that is disposed in the hole to be electromagnetically coupled with the transmission line. Each of the dielectric substrates has a plurality. of via holes disposed to surround the hole at a distance δ=an integer n×wave length λg / 2 from the peripheral wall of the hole.

A socket body and a header body are respectively reinforced by inserted reinforcing members, so that a protruding table in a plug groove of the socket body is eliminated and a width dimension thereof is reduced. The socket body is formed in a flat rectangular parallelepiped shape by resin molding, and a pair of socket reinforcing members is inserted into both end portions in longitudinal direction, each having a pair of fixed portions respectively protruding outward from lower ends of side walls of the socket body and a coupling portion for coupling between a pair of the fixed portions. A plug groove of substantially rectangular shape is formed at center portion of the socket body, and plural pairs of socket contacts are respectively arranged in two lines on both side walls in longitudinal direction along the plug groove. Header reinforcing metal fittings formed on the same base metal and having substantially the same cross section as that of the header posts are integrally inserted into both end portions of the header body in the longitudinal direction.

A network (100) for replacement of a living tissue, said network is a scaffold-free artificial hollow biological tissue network comprising a plurality of longitudinal multicellular aggregates (11) arranged in a plurality of bioprinted layers (22) which are located on top of one another, further comprising an inner surface (20) and an outer surface (21), wherein at least one of said bioprinted layers (22) is in shape of a planar closed loop such that a conduit for conveying fluids is defined, and said longitudinal multicellular aggregate (11) is a mixture of at least two cell types. Also a method for obtaining said longitudinal multicellular aggregate, and a further method for biomodeling and planning said network are proposed.

Bone fixation or augmentation in a mammalian body to enhance the mechanical strength of a fracture is provided by reinforcement fixing bone ends together using the implant device. A resorbable device can be rendered anti-osteolytic by incorporating materials such as bisphosphonates. It can also be rendered osteoconductive by the incorporation of an osteoconductive material such as bioactive glass or TCP. The implant device has a matrix as one phase, where the matrix is made of a bioresorbable polymer. One phase of the implant is made from self-reinforcing elements and the matrix contains an antiosteolytic agent component. The implant contains further osteoconductive and / or osteoconductive material.

A gasification distributed temperature sensing system is disclosed. The sensing system includes a gasification vessel and a harsh environment fiber sensing cable package disposed within the gasification vessel, the sensing cable package includes a thermally conductive enclosure and at least one sensor cable including a distributed array of high-temperature fiber Bragg grating sensors, wherein the sensors are disposed and hermetically sealed within the thermally conductive enclosure.

A reduced weight and size shielded receptacle connector includes an internal insulative connector housing having top and bottom walls, without any sidewalls interconnecting the top and bottom walls together. A plurality of conductive terminals are supported within the connector. A receptacle portion of the connector is formed in cooperation with the top and bottom walls of the connector housing and with a pair of metal sidewalls formed by bending a shield member around parts of the connector housing. A metal retaining shield is provided that also overlies a portion of the connector housing and which is partially retained on the connector housing by the metal shell. The shield not only provides shielding, but also serves to retain the opposing connector in mating engagement with receptacle connector by way of three retention members that extend in and engaged the opposing connector in three different directions.

Poly(propylene fumarate) is copolymerized with poly(caprolactone) diol to produce a block copolymer of poly(propylene fumarate) and poly(ε-caprolactone). The biocompatible and bioresorbable block copolymer of poly(propylene fumarate) and poly(ε-caprolactone) is useful in the fabrication of injectable and in-situ hardening scaffolds for tissue and / or skeletal reconstruction. The block copolymer can be crosslinked by redox or photo-initiation, with or without an additional crosslinker. Thus, the copolymer is both self-crosslinkable (without the use of any crosslinkers) and photocrosslinkable (in the presence of UV light).

The invention relates to a work-hardened product, particularly a rolled, extruded or forged product, made of an alloy with the following composition (% by weight):Cu 3.8-4.3; Mg 1.25-1.45; Mn 0.2-0.5; Zn 0.4-1.3; Fe<0.15; Si<0.15; Zr≦0.05; Ag<0.01,other elements <0.05 each and <0.15 total, remainder Al treated by dissolution, quenching and cold strain-hardening, with a permanent deformation of between 0.5% and 15%, and preferably between 1.5% and 3.5%. Cold strain-hardening can be achieved by controlled tension and / or cold transformation, for example rolling, die forging or drawing. This cladded metal plate type product is a suitable element to be used as aircraft fuselage skin.

A circuit board includes a substrate, a nonconductive resin layer selectively formed on the substrate and containing fine metal particles, and a conductive metal layer formed on the resin layer, in contact with the fine metal particles which are exposed from the resin layer. A surface of the resin layer has irregularities, in an interface between the resin layer and the conductive metal layer. In a roughness curve of a section of the resin layer, in a case of an wavelength (λc) at the boundary of a roughness component and a waviness component is 1 μm, a maximum height (Rz) per reference length (1r) of 1 μm is 20 nm to 500 nm.

A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having,the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web. The moving foraminous surface is positioned about 10 to about 100 cm from the last gaseous source to contact the threadlines. The fibers have a mean fiber diameter in the range of about 0.1 to 30 mum and are substantially free of shot. The attenuating and drying steps are carried out under conditions of controlled macro scale turbulence.

A loudspeaker apparatus in which a diaphragm is reinforced easily and favorably. The loudspeaker apparatus includes a loudspeaker diaphragm formed by joining a domed diaphragm and an edge-like diaphragm and vibrated using a voice coil, and a reinforcement ring reinforcing a junctional flat portion or the vicinity of the junctional flat portion of the diaphragm. The reinforcement ring is formed of a permeable material, and the permeable reinforcement ring is stuck to the junctional flat portion or the vicinity of the junctional flat portion of the diaphragm.

According to typical inventive practice, an armor structure includes n≧1 highly-rate-sensitive elastomeric layers and n+1≧2 metallic layers, alternately configured. Each metallic layer is electrically connected to a power supply that includes, e.g., battery(ies) and / or supercapacitor(s). Each adjacent pair of metallic layers sandwiches a highly-rate-sensitive elastomeric layer and forms, with the power supply, an uncompleted electrical circuit. A high-velocity projectile that penetratively encroaches upon a highly-rate-sensitive elastomeric layer is subjected to electrical current by virtue of completion of the uncompleted circuit that includes the two sandwiching metallic layers. The circuit is completed by physical (and hence, electrical) contact, bridging the two sandwiching metallic layers, of the projectile and / or its plasma sheath (which at least partially surrounds the projectile's outside surface due to friction between the projectile and the highly-rate-sensitive elastomeric layer). The highly-rate-sensitive elastomeric layer's projectile-hindering mechanical influence temporally lengthens the projectile-hindering electrical influence.

A heat-shrinkable white polyester film is provided which has extremely satisfactory cuttability along a perforation and has light-shielding properties. Also provided are: a label; and a process for producing the film with high productivity. The heat-shrinkable white polyester film comprises a polyester resin constituted of ethylene terephthalate as a main constituent component and containing at least 13 mol % one or more monomer ingredients capable of serving as an amorphous component among all components of the polyester resin. This film has specific heat shrinkability, specific light-shielding properties, and specific mechanical properties. The process is excellent in the productivity of the film. The label is obtained from the heat-shrinkable white polyester film.

In order to eliminate a steering hanger beam and to take efficient advantage of the empty space within an instrument panel, an instrument panel construction includes a main instrument panel unit 50 which is formed with an open cross sectional shape, and which comprises a plate shaped upper surface member 51 which extends substantially in the horizontal direction of the body of the vehicle across its transverse direction, and a front surface member 52 which curves towards the passenger compartment of the vehicle from said upper surface member 51 and extends downwards substantially in the vertical direction; and in that this main instrument panel unit 50 is made as a single unit from magnesium alloy by a die casting process, and is fixed to left and right front pillars.

A vehicle seat assembly includes a seat cushion having a connector insertion hole for receiving therein a connector of a child seat for attachment of the child seat to the seat assembly, and a buckle insertion slit for allowing a buckle to be pulled out onto the seat cushion. The buckle insertion slit and the connector insertion hole are formed contiguously or otherwise integrally with each other.

An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from / to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.

Disclosed is a metal nanoparticle paste that uses the low-temperature sintering characteristics of metal nanoparticles to easily obtain a metal bond with excellent conductivity and mechanical strength, and which can form a wiring pattern with excellent conductivity. The metal nanoparticle paste is characterized by containing (A) metal nanoparticles, (B) a protective film that coats the surface of the metal nanoparticles, (C) a carboxylic acid, and (D) a dispersion medium.