146 results about "Low dissipation" patented technology

The halogen-free resin composition comprises (A)100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

A wireless energy transfer system includes a primary and one (or more) secondary oscillators for transferring energy therebetween when resonating at the same frequency. The long range (up to and beyond 100 m) efficient (as high as and above 50%) energy transfer is achieved due to minimizing (or eliminating) losses in the system. Superconducting materials are used for all current carrying elements, dielectrics are either avoided altogether, or those are used with a low dissipation factor, and the system is operated at reduced frequencies (below 1 MHz). The oscillators are contoured as a compact flat coil formed from a superconducting wire material. The energy wavelengths exceed the coils diameter by several orders of magnitude. The reduction in radiative losses is enhanced by adding external dielectric-less electrical capacitance to each oscillator coil to reduce the operating frequency. The dielectric strength of the capacitor is increased by applying a magnetic cross-field to the capacitor to impede the electrons motion across an air gap defined between coaxial cylindrical electrodes.

The invention provides dielectric compositions and methods of forming the same. The dielectric compositions may be used to form dielectric layers in electronic devices such as multilayer ceramic capacitors (MLCCs) and, in particular, MLCCs which include base metal electrodes. The dielectric compositions include a barium titanate-based material and several dopants. The type and concentration of each dopant is selected to provide the dielectric composition with desirable electrical properties including a stable capacitance over a temperature range, a low dissipation factor, and a high capacitance. Preferably, MLCCs including dielectric layers formed with the composition satisfy X7R and / or X5R requirements.

Multilayer ceramic chip capacitors (MLCC's) which satisfy X7R TCC requirements and which are compatible with silver-palladium internal electrodes. The MLCC's exhibit desirable dielectric properties—high capacitance, low dissipation factor, high insulation resistance, stable TCC—and excellent performance on highly accelerated life testing, and good resistance to dielectric breakdown. The dielectric layers comprise a lead-free and cadmium-free barium titanate base material doped with other metal oxides such oxides of zinc, boron, bismuth, barium, titanium, praseodymium, cerium, tungsten, neodymium, tungsten, tin, niobium, copper, and / or manganese in various combinations. The dielectric ceramic materials herein can be fired at less than 1150° C. with an inner electrode having 70 wt % or more Ag and 30 wt % or less Pd to form an MLCC.

The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board.

Multilayer ceramic chip capacitors which satisfy X8R requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a barium titanate base material doped with other metal oxides such as BaO, Y2O3, ZrO2, SiO2, MgO, MnO, MoO3, CaO, Lu2O3, Yb2O3, or WO3 in various combinations.

The present invention relates to a laminate for a printed circuit board, which is manufactured by incorporating woven fabric or nonwoven fabric formed of liquid crystal polyester fibers into a liquid crystal polyester resin, thus having a low dielectric constant and a low dissipation factor, suitable for use in the high frequency range (GHz or more), and exhibiting excellent thermal properties and high reliability, resulting in high processability.

The present invention relates to a thermoplastic resin composition having a low dielectric constant, a low dissipation factor and excellent adhesiveness to a substrate film or a conductor wiring, an adhesive film and a wiring film using the same. The thermoplastic resin composition includes a polyphenylene ether-based polymer having hydroxyl groups in its chemical structure and having 2,6-dimethylphenylene ether as a repeating unit, an isocyanate compound having a plurality of isocyanate groups in its structure; or a reaction product of the polyphenylene ether-based polymer having 2,6-dimethylphenylene ether as a repeating unit and the isocyanate compound having a plurality of isocyanate groups in its structure; and a hydrogenated styrene-based elastomer. .

Multilayer ceramic chip capacitors which satisfy X8R requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as nickel and nickel alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a barium titanate base material doped with other metal oxides such as BaO, Y2O3, ZrO2, SiO2, MgO, MnO, MoO3, CaO, Lu2O3, Yb2O3, or WO3 in various combinations.

Multilayer ceramic chip capacitors which satisfy X7R and BX requirements and which are compatible with silver-palladium internal electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a lead-free and cadmium-free barium titanate base material doped with other metal oxides such oxides of zinc, boron, bismuth, cerium, tungsten, copper, manganese, neodymium, niobium, silver, barium, silicon and nickel in various combinations. The dielectric ceramic materials herein can be sintered together (fired) at less than 1000° C. with an inner electrode having more than 80 wt % Ag and less than 20 wt % Pd to form a multilayer ceramic capacitor (MLCC).

A single sided RF tag suitable for use for electronic article surveillance comprises a tuned circuit formed on one side of a substrate. Provided by a deposited first conducting layer which comprises an inductive coil, which behaves as an antenna and is electrically connected to a first capacitor plate and a connection means to connect to a second conducting layer. A low dissipation factor dielectric layer is deposited onto said first conducting layer. A second conducting layer comprising at least one capacitor and a connection means to electrically connect to the first conducting layer is deposited on the dielectric layer. The second capacitor plate is substantially co-located above the first capacitor plate, to form the capacitor. The capacitor and coil together form a resonant circuit. The circuit pattern for the first and second layer may be formed by known metal printing techniques, such as, for example the use of a catalytic seed layer which is deposited by a pattern transfer mechanism into the circuit pattern. Alternatively the circuit pattern may be formed by standard photo-lithography etch techniques to reveal a circuit pattern from a metallised surface. The tag will preferably incorporate known methods of fusing to deactivate or detune the tag, to permit removal of articles from an enclosed area. The substrate may further include a second RF tag tuned to an alternative frequency on the opposite side of the substrate. Alternatively a plurality of tags may be built up in successive layers on one or both sides of the tag.