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1628results about "Multiple fixed capacitors" patented technology

Plated terminations

InactiveUS6960366B2Improved termination featureEliminate and greatly simplifyResistor terminals/electrodesFinal product manufactureTermination problemEngineering
Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on one or both of top and bottom surfaces of a monolithic structure can facilitate the formation of selective wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.
Owner:KYOCERA AVX COMPONENTS CORP

Supercapacitor with high energy density

The energy content of supercapacitor is determined by its capacitance value and working voltage. To attain a high capacitance and a high voltage, several pieces of electrodes and separators are spirally wound with edge sealing to form a bipolar supercapacitor in cylindrical, oval or square configuration. While the winding operation effectively provides a large surface area for high capacitance, the bipolar packaging instantly imparts a unitary roll a minimum working voltage of 5V on using an organic electrolyte. The bipolar roll is a powerful building block for facilitating the assembly of supercapacitor modules. Using containers with multiple compartments, as many bipolar rolls can be connected in series, in parallel or in a combination of the two connections to fabricate integrated supercapacitors with high energy density as required by applications.
Owner:GAINIA INTELLECTUAL ASSET SERVICES

Capacitor for multiple replacement applications

A capacitor provides a plurality of selectable capacitance values, by selective connection of six concentrically wound capacitor sections of a capacitive element each having a capacitance value. The capacitor sections each have a respective section element terminal at a first end of the capacitive element and the capacitor sections have a common element terminal at a second end of the capacitive element. A pressure interrupter cover assembly is sealingly secured to the open end a case for the element and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitive element to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals. Deformation of the cover caused by failure of the capacitor element breaks at least some of the frangible connections sufficient to disconnect the capacitive element from an electric circuit in which it is connected. A cover insulation barrier mounted on the deformable cover, has a barrier cup substantially surrounding the common cover terminal and a plurality of barrier fins each extending radially outwardly from the barrier cup, and deployed between adjacent section cover.
Owner:AMRAD MFG LLC

Low inductance, high rating capacitor devices

Methodologies and structures are disclosed for providing multilayer electronic devices having low inductance and high ratings, such as for capacitor devices for uses involving faster pulsing and higher currents. Plural layer devices are constructed for relatively lowered inductance by relatively altering typical orientation of capacitors such that their electrodes are placed into a vertical position relative to an associated circuit board. Optionally, individual leads may be formed so that the resulting structure can be used as an array. Internal electrodes may be arranged for reducing current loops for associated circuits on a circuit board, to correspondingly reduce the associated inductance of the circuit board mounted device. Leads associated with such devices may have added tab-like structures which serve to more precisely place the lead, to improve the lead to capacitor strength, and to promote lower resistance and inductance. Disclosed designs for reducing associated inductance may be practiced in conjunction with various electric devices, including capacitors, resistors, inductors, or varistors.
Owner:AVX CORP

Power capacitor

In a power capacitor with a plurality of round, wound elements accommodated in a common housing at least one wound element group consisting of three round, wound elements is accommodated in the housing, with the wound elements of the group being arranged in star-form alongside one another, with their axes parallel to one another. The housing has in cross-section in general the shape of a triangle having rounded corners, with a radius of curvature which corresponds at least substantially to the radius of the round, wound elements.
Owner:VISHAY ELECTRONICS

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

A capacitor comprising: a capacitor body including a plurality of laminated dielectric layers, a plurality of inner electrode layers which are respectively disposed between mutually adjacent ones of the dielectric layers, a first main surface located in a laminated direction of the dielectric layers, and a second main surface opposite to the first main surface; a first outer electrode formed on the first main surface of the capacitor body and electrically connected to the inner electrode layers; a second outer electrode formed on the second main surface of the capacitor body and electrically connected to the inner electrode layers; a first dummy electrode formed on the first main surface of the capacitor body; and a second dummy electrode formed on the second main surface of the capacitor body.
Owner:NGK SPARK PLUG CO LTD

Laminated capacitor

A laminated capacitor that can be made small in size, that can prevent flashover, has excellent dielectric strength performance and a large capacitance is disclosed. Each gap between internal electrodes in the same plane is set at 2.7 to 20 times a thickness (element thickness) of a dielectric layer positioned between first and second internal electrode groups which face each other and a distance between an edge of the external terminal and an edge of the floating internal electrode closest to the external terminal among floating internal electrodes of the internal electrode group of the outermost layer is set at 0.4 mm to 1.4 mm.
Owner:MURATA MFG CO LTD

Bonded structures with integrated passive component

In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface bonded to the element and a second surface opposite the first surface. The passive electronic component can comprise a first anode terminal bonded to a corresponding second anode terminal of the element and a first cathode terminal bonded to a corresponding second cathode terminal of the element. The first anode terminal and the first cathode terminal can be disposed on the first surface of the passive electronic component.
Owner:ADEIA SEMICON BONDING TECH INC

Integrated circuit substrate having embedded passive components and methods therefor

An integrated circuit substrate having embdedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.
Owner:AMKOR TECH SINGAPORE HLDG PTE LTD

Capacitor with multiple elements for multiple replacement applications

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal. A pressure interrupter cover assembly is sealingly secured to the open end of case for the elements and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitor section to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals. Deformation of the cover caused by failure of the capacitor element breaks at least some of the frangible connections sufficient to disconnect the capacitive element from an electric circuit in which it is connected. A cover insulation barrier mounted on the deformable cover, has a barrier cup substantially surrounding the common cover terminal and a plurality of barrier fins each extending radially outwardly from the barrier cup, and deployed between adjacent section cover terminals.
Owner:AMRAD MFG LLC

Methods and apparatuses for stacked capacitors for image sensors

Capacitive circuits and methods of forming capacitive circuits including a first capacitor and a second capacitor connected in parallel to the first capacitor, wherein the first capacitor is positioned at least partially above the second capacitor.
Owner:APTINA IMAGING CORP

C-shaped combination capacitor assembly

A C-shaped combination capacitor assembly has a C-shaped shell, multiple capacitors, two conducting wires, two lead wires and encapsulant. The capacitors are mounted in the C-shaped shell. The conducting wires connect the capacitors in parallel. The two lead wires connect respectively to the conducting wires and protrude from the C-shaped shell. The encapsulant fills the C-shaped shell and covers and seals the capacitors, the conducting wires and the lead wires inside the C-shaped shell.
Owner:HUANG SHOU HSIUNG

Ceramic electronic component and method for manufacturing the same

A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.
Owner:MURATA MFG CO LTD

Micro-electro-mechanical system (MEMS) variable capacitors and actuation components and related methods

Micro-electro-mechanical system (MEMS) variable capacitors and actuation components and related methods are provided. A MEMS variable capacitor can include first and second feed lines extending substantially parallel to one another. Further, MEMS variable capacitors can include first and second capacitive plates being spaced apart from the first and second feed lines. The first and second capacitive plates can be separately movable with respect to at least one of the first and second feed lines for varying the capacitance between the first and second feed lines over a predetermined capacitance range.
Owner:AAC TECH PTE LTD

High density metal-to-metal maze capacitor with optimized capacitance matching

InactiveUS7009832B1Increase capacitance densityImproves capacitance capacitance matchingTransistorMultiple fixed capacitorsCapacitanceHigh density
A capacitor including a first and second component capacitor structure disposed on a substrate. A component capacitor structure includes an upright arm, a transverse arm, and a via. The upright arm has a top end and a bottom end that extend at substantially right angles to a central axis of the upright arm. The transverse arm has a left and right end that extend at substantially right angles to a central axis of the transverse arm. The upright arm and the transverse arm intersect to form a cross-like pattern and the top, bottom, left and right ends all extend in the same rotary direction. The via is electrically coupled to an area of intersection of the upright and transverse arms.
Owner:AVAGO TECH WIRELESS IP SINGAPORE PTE

Wiring board construction including embedded ceramic capacitors(s)

A wiring board includes a substrate core, ceramic capacitors and a built-up layer. The substrate core has a housing opening portion therein which opens at a core main surface. The ceramic capacitors are accommodated in the housing opening portion and oriented such that the core main surface and a capacitor main surface of each capacitor face the same way. The built-up layer includes semiconductor integrated circuit element mounting areas at various locations on a surface thereof. In the substrate core, each ceramic capacitor is respectively disposed in an area corresponding to each semiconductor integrated circuit element mounting area.
Owner:NGK SPARK PLUG CO LTD

Capacitor for multiple replacement applications

A capacitor provides a plurality of selectable capacitance values, by selective connection of six concentrically wound capacitor sections of a capacitive element each having a capacitance value. The capacitor sections each have a respective section element terminal at a first end of the capacitive element and the capacitor sections have a common element terminal at a second end of the capacitive element. A pressure interrupter cover assembly is sealingly secured to the open end a case for the element and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitive element to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals. Deformation of the cover caused by failure of the capacitor element breaks at least some of the frangible connections sufficient to disconnect the capacitive element from an electric circuit in which it is connected. A cover insulation barrier mounted on the deformable cover, has a barrier cup substantially surrounding the common cover terminal and a plurality of barrier fins each extending radially outwardly from the barrier cup, and deployed between adjacent section cover.
Owner:AMRAD MFG LLC

Capacitor with multiple elements for multiple replacement applications

A capacitor provides a plurality of selectable capacitance values, by selective connection of six capacitor sections of a capacitive element each having a capacitance value. The capacitor sections are provided in a plurality of wound cylindrical capacitive elements. Two vertically stacked wound cylindrical capacitance elements may each provide three capacitor sections. There may be six separately wound cylindrical capacitive elements each providing a capacitor section. The capacitor sections have a common element terminal. A pressure interrupter cover assembly is sealingly secured to the open end of case for the elements and has a deformable cover with a centrally mounted common cover terminal and a plurality of section cover terminals mounted at spaced apart locations. A conductor frangibly connects the common element terminal of the capacitor section to the common cover terminal and conductors respectively frangibly connect the capacitor section terminals to the section cover terminals. Deformation of the cover caused by failure of the capacitor element breaks at least some of the frangible connections sufficient to disconnect the capacitive element from an electric circuit in which it is connected. A cover insulation barrier mounted on the deformable cover, has a barrier cup substantially surrounding the common cover terminal and a plurality of barrier fins each extending radially outwardly from the barrier cup, and deployed between adjacent section cover terminals.
Owner:AMRAD MFG LLC

Monolithic capacitor

A monolithic capacitor includes a plurality of monolithic ceramic capacitor elements provided with external electrodes at both ends thereof, solder layers arranged on the entire surfaces of the external electrodes of the monolithic ceramic capacitor elements, and metal terminals electrically connected to the external electrodes of the monolithic ceramic capacitor elements. The monolithic ceramic capacitor elements are joined to each other by the solder layers and are stacked on each other. The external electrodes of the monolithic ceramic capacitor elements are electrically connected to each other by the solder layers.
Owner:MURATA MFG CO LTD

Film capacitor and method of manufacturing the same

The invention provides a film capacitor and its manufacturing method suited to car-mount application, excellent in heat cycle tolerance and humidity resistance, and high in productivity, while maintaining low heat generation and low inductance characteristic. A film capacitor comprises a film capacitor element 1, a bus bar 3 as metal terminal connected to electrode 2 of this film capacitor element 1, and a case 8 for containing them, in which the film capacitor element 1 and bus bar 3 are packed within the case 8 by plural layers of epoxy resin compositions 6, 7, and the plural layers of epoxy resin compositions 6, 7 are formed in layers, and are composed so that the coefficient of linear expansion may be smallest in the epoxy resin composition 7 disposed in the uppermost layer, and therefore resin cracks can be prevented at the time of heat cycle, and a film capacitor of high reliability excellent inhumidity resistance is obtained.
Owner:PANASONIC CORP

Thin film capacitors

A system that incorporates teachings of the present disclosure may include, for example, a first solid electrode, a second electrode separated into subsections, and a dielectric medium separating the subsections from the first solid electrode, where the subsections of the second electrode include a first group of subsections and a second group of subsections, where the first group of subsections are connectable with a first terminal for receiving an input signal, and where the second group of subsections is connectable with a second terminal for providing an output signal. Other embodiments are disclosed.
Owner:NXP USA INC

Ceramic multilayer capacitor array

A ceramic multilayer capacitor array having a plurality of capacitors in a surface mount compatible package. The array is constructed from a plurality of first dielectric plates, each of which has a first pattern of electrodes, and a plurality of second dielectric plates, each of which has a second pattern of electrodes. The second pattern of electrodes is substantially identical to the first pattern of electrodes, and is shifted with respect to the first pattern of electrodes. Each of the electrodes has at least one tab portion, which extends to at least one of the side faces of the package. Perpendicularly projecting first and second plates, the tab portions of the electrodes in the first plates are free from the tab portions of the electrodes in the second plates.
Owner:PHYCOMP HLDG BV

Storage capacitor power supply

A long-lived, lightweight, and quickly and precisely charged storage capacitor power supply capable of stably supplying electric power to a load. The power supply has a capacitor block consisting of capacitors connected in series, in parallel or in any combination of series and parallel. The power supply further includes a charging circuit for charging the block, a charging power supply connected with the block via the charging circuit, and a charge-limiting circuit. This charge-limiting circuit detects the voltage across the terminals of the block and limits charging of the block if the voltage reaches a given value. One embodiment of the invention further includes a charge-limiting circuit, a full charge-detecting circuit, and a residual electricity-detecting circuit connected in parallel with the block. The charge-limiting circuit senses that the voltage across the terminals of the block exceeds the given value and causes the charging current to bypass the block. The full charge-detecting circuit senses that the charge-limiting circuit is operated and determines that full charge is attained. The residual electricity-detecting circuit finds the residual electric power from the voltage across the terminals of the block. Another embodiment has a first and a second capacitor block. The voltage across the terminals of the first block is detected. The first block is charged from the second block until the detected voltage reaches a given voltage. The first block supplies electric power directly to the load.
Owner:NANTONG JIANGHAI CAPACITOR CO LTD +1

Electronic component and method of manufacturing the same

The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.
Owner:TDK CORPARATION

Integrated broadband ceramic capacitor array

A monolithic capacitor structure includes opposed and overlapping plates within a dielectric body, which are arranged to form a lower frequency, higher value capacitor. Other conductive structure is located either inside the dielectric body or on an external surface thereof and is effective to form a higher frequency, lower value capacitor in parallel with the lower frequency, higher value capacitor. The resulting array of combined series and parallel capacitors integral with the dielectric body provides effective wideband performance in an integrated, cost-effective structure.
Owner:DEVOE DANIEL +2
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