843results about "Varistors" patented technology

Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations. The disclosed technology may be utilized with a plurality of monolithic multilayer components, including interdigitated capacitors, multilayer capacitor arrays, and integrated passive components. A variety of different plating techniques and termination materials may be employed in the formation of the subject self-determining plated terminations.

Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles. The multi-layer component can optionally be used in combination with the neat dielectric polymer or glass layer and can optionally have interposed metal layers. A method is disclosed for dispersing insulative particles and conductive or semiconductive particles in a binder using a volatile solvent for dispersement of the insulative particles and the conductive or semiconductive particles before mixing with the binder.

Resistive elements include a patterned region of nanofabric having a predetermined area, where the nanofabric has a selected sheet resistance; and first and second electrical contacts contacting the patterned region of nanofabric and in spaced relation to each other. The resistance of the element between the first and second electrical contacts is determined by the selected sheet resistance of the nanofabric, the area of nanofabric, and the spaced relation of the first and second electrical contacts. The bulk resistance is tunable.

In an organic PTC thermistor comprising a matrix of at least two high-molecular weight compounds, a low-molecular weight organic compound, and conductive particles having spiky protuberances, a thermoplastic elastomer is contained in the matrix whereby the thermistor is improved in reliability and performance stability.

A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.

An elastomeric particle (1, 1, 1″) comprises a non-conducting elastomeric body (2) having an electrically conducting surface (4a, 4b, 6). Pressure sensor elements (20, 20′, 20″; 30, 30′, 30″, 30′″) comprising such elastomeric particles are disclosed, as well as sensor clusters (50″, 50′″, 50IV, 50V, 50VI, 50VII, 70) comprising such sensor elements. There is also disclosed a pressure sensor element (40, 40′, 40″, 40′″, 40IV, 40V, 40VI, 40VII), comprising a resistive element (44, 44′, 44″) providing a conduction path, a first electrode (42a, 42a-1, 42a-2, 42a-3, 42a-4, 42a-5, 42a-6), connected to the resistive element, a second electrode (42b, 42b′), which in a quiescent state is spaced from said first electrode, wherein the second electrode, when the pressure sensor element is subjected to a pressure, is arranged to contact said first electrode or said resistive element. Systems comprising such sensor elements and sensor clusters are disclosed, as well as methods of their fabrication.

An exemplary varistor is disclosed which includes at least two poles; a non-linear block; a conductive plate arranged on a main face of the block and having a protruding portion forming one of the poles; and an electrically insulating coating applied to the main face of the block. The part forming the connection pole emerges from the electrically insulating coating and has a braze surface extending above the electrically insulating coating; and the protruding part forming the connection pole is connected to the rest of the plate over at least half of the perimeter thereof.

A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

A battery cover assembly having integrated battery condition monitoring for measuring electrical current passing to and from a battery post, including an electrically conductive collar for connecting to a post of a battery, and an electrically conductive terminal for receiving a connector of a load. An electrically conductive resistor having a known resistance extends between outer surfaces of the collar and the terminal. The battery cover assembly is incorporated into a battery, which may also include a voltage measuring device connected between the outer surfaces of the collar and the terminal for measuring the voltage drop across the resistor, memory for storing the known resistance of the resistor, and a digital processor programmed to receive the measured voltage drop from the voltage measuring device, retrieve the known resistance from the memory, and calculate current flow through the resistor based on the measured voltage drop and the known resistance, whereby current flow to and from the battery can be measured. A temperature measuring device may also be incorporated to measure temperature of the resistor located between the outer surfaces of the collar and the terminal. A resistance-temperature table may be stored in the memory and used to calculate the actual resistance of the resistor and then to compensate the current value from the voltage measured across the resistor.

In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2≦d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV.