5241 results about "Metal foil" patented technology

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g / m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.

The invention relates to a preparation method and an application of multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric. The multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is formed by successively arranging and laminating a metal foil reflection layer, a phase change temperature limitation layer, an interval composite membrane heat-insulation layer and a flame-retardant comfortable layer, wherein the metal foil reflection layer has high reflectivity and an enhanced heat-dissipation function; the phase change temperature limitation layer has functions of high energy consumption absorption and evenly-distributed heat conduction; the interval composite membrane heat-insulation layer has the functions of reflection insulation and even distribution of heat; and the flame-retardant comfortable layer has the functions of low-contact heat conduction, heat insulation and comfort. When the front side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric is under the action of open fire and strong heat flow environment, the back side of the multistage-spreading heat-dissipation fire-proof heat-insulation composite fabric can be kept below 50DEG C which is near the safe temperature state of the human skin, and the integral structural form and the mechanical property are stable. The natural thickness of the composite fabric is 5-15mm, the compression thickness of the composite fabric is 3-8mm, and the square meter quality of the composite fabric is 400-1500g / m<2>. The composite fabric is fire-proof heat-insulation material which is totally sealed, stuck and sewn and can be used for individual protection and environment heat insulation in special high-temperature occasions, such as fire control, military, exploration, safe escape and industry and the like.

Metal foils, wires, and seamless tubes with increased mechanical strength are provided. As opposed to wrought materials that are made of a single metal or alloy, these materials are made of two or more layers forming a laminate structure. Laminate structures are known to increase mechanical strength of sheet materials such as wood and paper products and are used in the area of thin films to increase film hardness, as well as toughness. Laminate metal foils have not been used or developed because the standard metal forming technologies, such as rolling and extrusion, for example, do not lend themselves to the production of laminate structures. Vacuum deposition technologies can be developed to yield laminate metal structures with improved mechanical properties. In addition, laminate structures can be designed to provide special qualities by including layers that have special properties such as superelasticity, shape memory, radio-opacity, corrosion resistance etc. Examples of articles which may be made by the inventive laminate structures include implantable medical devices that are fabricated from the laminated deposited films and which present a blood or body fluid and tissue contact surface that has controlled heterogeneities in material constitution. An endoluminal stent-graft and web-stent that is made of a laminated film material deposited and etched into regions of structural members and web regions subtending interstitial regions between the structural members. An endoluminal graft is also provided which is made of a biocompatible metal or metal-like material. The endoluminal stent-graft is characterized by having controlled heterogeneities in the stent material along the blood flow surface of the stent and the method of fabricating the stent using vacuum deposition methods.

A fibreboard, insulating, wall panel includes an integral air and vapor barrier of metal foil or metallized plastic film adhered to one surface of the panel. Panels are attached to a stud wall frame. Abutting panel joints are taped to provide a continuance vapor barrier. Increased thermal and acoustic insulation as well as structural integrity of the barrier is provided by the panel.

This invention comprises deposition of thin film photovoltaic junctions on metal substrates which can be heat treated following deposition in a continuous fashion without deterioration of the metal support structure. In a separate operation an interconnection substrate structure is produced in a continuous roll-to-roll fashion. In this way the interconnection substrate structure can be uniquely formulated from polymer-based materials since it does not have to endure high temperature exposure. Cells comprising the metal foil supported photovoltaic junctions are then laminated to the interconnection substrate structure. Conductive interconnections are deposited to complete the array. The conductive interconnections can be accomplished with a separately prepared interconnection component. The interconnected array is produced using continuous roll-to-roll processing which avoids the need to use the expensive and intricate material removal operations currently taught in the art to achieve electrical interconnections among arrays of photovoltaic cells.

The metal foil of the positive electrode 1a or the negative electrode 1b in the power generating element 1 is connected along the connecting plate portion 2b which is folded, twisted, and provided in a protruding condition from the main portion 2a of the current-collector connector 2; hence the shape of the current-collector connector 2 becomes easy to form, and a battery capable of enhancing current collection efficiency, reliability and workability can be provided.

A backplane for use in an electro-optic display comprises a patterned metal foil having a plurality of apertures extending therethrough, coated on at least side with an insulating polymeric material and having a plurality of thin film electronic devices provided on the insulating polymeric material.

A semiconductor device includes metal foil to which a ground potential is applied, at a semiconductor constructing body provided on the metal foil and having a semiconductor substrate and a plurality of external connection electrodes provided on the semiconductor substrate. An insulating layer is provided around the semiconductor constructing body and has a thickness substantially equal to the semiconductor constructing body. An one upper interconnecting layer is provided on the semiconductor constructing body and insulating layer, and electrically connected to the external connection electrodes. A vertical conducting portion extends through the insulating layer and electrically connects the metal foil and upper interconnecting layer.

A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.

A protective acoustic cover assembly including a metal foil with perforations, and a treatment on one or more surfaces of said metal foil. The treatment is a hydrophobic or oleophobic treatment, or both. The protective acoustic cover assembly has an average specific acoustic resistance of less than about 11 Rayls MKS from 250-300 Hz, an average specific acoustic reactance magnitude of less than about 1 Rayls MKS from 250-300 Hz, and an instantaneous water entry pressure value of greater than about 11 cm. The perforations of the metal foil preferably have an average maximum pore size of less than about 150 micrometers. The protective acoustic cover assembly further includes an adhesive mounting system, and the preferred metal foil is nickel.

The present invention relates to structures and components for protecting organic light emitting diodes from environmental elements such as moisture and oxygen. According to a first aspect of the invention, top-emitting, high-resolution, OLED structures are provided which include a metal foil substrate; a planarization layer disposed over the metal foil substrate; an OLED stack (which includes lower and upper electrodes as well as an organic region disposed between the electrodes) disposed over the planarization layer; and a multilayer barrier region disposed over the OLED stack. A second aspect of the invention is directed to flexible, top emitting OLED structures which include the following: thin substrate region (i.e., a substrate having a thickness that is less than 200 microns); an OLED stack disposed over the flexible substrate region; a transparent upper barrier region that cooperates with the flexible substrate region to encapsulate the OLED stack, thereby protecting it from outside species such as water or oxygen; and a polymeric reinforcement layer which has a Young's Modulus ranging from about 0.3 to 7 GPa, which is disposed (i) below the substrate region, (ii) above the upper barrier region (in which case it is transparent), or (iii) both below the substrate region and above the upper barrier region.

A thermosettable adhesive is used to secure a laminate having a compliant layer (for example, a foamable composition containing a diene rubber), a layer comprised of a thermosettable resin capable of being cured to a rigid state, and an optional carrier layer (for example, a metal foil) to a substrate for the purpose of strengthening, stiffening, or otherwise reinforcing the substrate. The substrate may, for example, be a metal vehicle door. The thermosettable adhesive is comprised of at least one polyol such as a polyether polyol, at least one epoxy resin, and at least one polyisocyanate.

The present invention provides a metal clad laminate or a resin coated metal foil having a metal foil whose both surfaces are not substantially roughening-treated and an insulating resin composition layer using generally used insulating resin, and a printed wiring board and a manufacturing method thereof, in which the metal clad laminate or the resin coated metal foil is used, the reliability and circuit formability are high, and the conductor loss is extremely low.

A backplane for use in an electro-optic display comprises a patterned metal foil having a plurality of apertures extending therethrough, coated on at least side with an insulating polymeric material and having a plurality of thin film electronic devices provided on the insulating polymeric material.

According to a non-limiting embodiment of the present invention, an appliqué coating is provided for a substrate. The appliqué coating includes a metal foil and a first polymer film underlying the metal foil. A topcoat overlying the metal foil may be provided as a layer of paint or as a second polymer film. An adhesive, such as a pressure sensitive adhesive, underlying the first polymer film may be provided to affix the appliqué coating to the substrate. If desired, fibers may be dispersed throughout the second polymer film to provide anti-static properties. Also, an ink layer may be provided between the metal foil and the second polymer film, if desired, for aesthetic and / or anti-static purposes.

An embedded chip package includes a substrate having a dielectric interposer, a first metal foil on a first surface and a second metal foil on a second surface of the substrate, wherein the substrate has a cavity recessed into the first surface; a metal heatsink embedded within the cavity; a semiconductor die mounted on a flat bottom of the metal heatsink; a dielectric layer covering the first surface of the substrate; at least one built-up circuit trace layer on the dielectric layer; a solder resist layer on the built-up circuit trace layer and on the dielectric layer; a heat-dissipating metal layer on the second metal foil; and heat-dissipating plugs connecting the flat bottom of the metal heatsink and the heat-dissipating metal layer.

A cylindrical lithium secondary battery includes a positive electrode (1) having a positive electrode mixture layer disposed on a surface of a positive electrode current collector made of a conductive metal foil and containing a positive electrode active material, and a negative electrode (2) having a negative electrode mixture layer disposed on a surface of a negative electrode current collector made of a conductive metal foil and having a negative electrode active material containing silicon particles and / or silicon alloy particles. The amount of the positive electrode active material is 50 mg or less per 1 cm2 of the positive electrode, the average particle size of the silicon particles and / or silicon alloy particles is from 5 μm to 15 μm, and the theoretical electrical capacity ratio of the negative electrode to the positive electrode is 1.2 or greater.

An overlay of patterned metal foil above a substrate to be protected supports development of localized coronas after a lightning strike. The localized coronas transport energy of a lightning strike above the substrate's surface with limited removal of metal foil from the lightning strike attachment point. A first polymer film underlies patterned metal foil. A topcoat overlies the patterned metal foil. An adhesive, underlying the first polymer film affixes the lightning diverter overlay to the substrate. If desired, semiconductor particulates may be dispersed throughout the second polymer film to contribute to instantaneous generation of localized coronas. Also, an ink layer may be provided between the patterned metal foil and the topcoat or on the exterior, if desired, for aesthetic and / or anti-static purposes.

A current transformer includes a Rogowski coil, having an opening at the center in which a conductor penetrates, comprising, a printed circuit board having a plurality of layers forming at least first to fourth circuit board surfaces including a circuit board top surface, a circuit board bottom surface and circuit board conducting internal surfaces between the circuit board top surface and the circuit board bottom surface, a plurality of radial metal foils, each metal foil radiating from a center that is approximately the center of the opening, mounted on the first to fourth circuit board surfaces, a first winding formed by electrically connecting metal foils on the first and second circuit board surfaces with first plated through holes penetrating the first and second circuit board surfaces in a thickness direction of the printed circuit board, a second winding formed by electrically connecting metal foils on the third and fourth circuit board surfaces with second plated through holes penetrating the third and fourth circuit board surfaces in a thickness direction of the printed circuit board, a first return circuit line electrically connected with the first winding in series, a second return circuit line electrically connected with the second winding in series, and a pair of the first winding and the first return circuit line and a pair of the second winding and the second return circuit line being electrically connected in series.

A lid and a container using the lid are disclosed, the lid having a central panel of paperboard with a resilient plastic skirt joined about its perimeter. A metal foil membrane having heat activated adhesive layers is attached to the lid and the rim of the container by inductive heating. Detents project from an inside surface of the skirt and cooperate with the rim on the container to hold the lid in an open position. A stacking lip extends from the skirt and interfits within an identical lid to allow the lids to be stacked for shipment. A hinge extends transversely across the central panel and divides the lid into movable and fixed portions. Weakened regions on the skirt separate when the lid is opened and provide evidence of potential tampering.

A spacing profile for a spacing frame, which is to be fitted in the edge area of a double-glazing unit, forming an interspace, with a profile body of a material possessing low thermal conductivity and with a diffusion-impermeable metal foil which is bonded to the profile body so as to establish a material fit, is characterized in that the metal foil is, at least on the surface facing away from the profile body, provided with a corrosion preventing coating which comprises a colored lacquer coating and / or a layer of chromium or of a chromium alloy, wherein the corrosion preventing coating comprises a thickness which is lower by at least a factor of 2.5, preferably by at least a factor of 10 and further preferred by at least a factor of 20, as compared to the thickness of the metal foil.

An improved container seal including at least one metal-free tab member is provided. The container seal comprises a flexible, metal-free cover sheet and a flexible sealant sheet. The cover sheet comprises at least one layer of a flexible sheet material and includes a body portion that is sized and shaped to at least cover a container finish and has at least one metal-free tab portion extending from the periphery of the body portion. The flexible sealant sheet comprises a thermoplastic sealing surface layer, an inner surface layer and a layer of metal foil. The flexible sealant sheet is of the same size and shape as the body portion of the cover sheet. The inner surface of the sealant sheet and the inner surface of the body portion of the cover sheet are bonded together in opposed, congruent contact with each other. A method of manufacturing the container seal is also provided.

A rechargeable lithium battery including a negative electrode made by sintering, on a surface of a conductive metal foil as a current collector, a layer of a mixture of active material particles containing silicon and / or a silicon alloy and a binder, a positive electrode and a nonaqueous electrolyte, characterized in that the nonaqueous electrolyte contains carbon dioxide dissolved therein.

A flexible metal foil substrate organic light emitting diode (OLED) display and a method for forming the same are provided. The method comprises: supplying a metal foil substrate such as titanium (Ti), Inconel alloy, or Kovar, having a thickness in the range of 10 to 500 microns; planarizing the metal foil substrate surface; depositing an electrical isolation layer having a thickness in the range of 0.5 to 2 microns overlying the planarized metal foil substrate surface; depositing amorphous silicon having a thickness in the range of 25 to 150 nanometers (nm) overlying the electrical insulation layer; from the amorphous silicon, forming polycrystalline silicon overlying the electrical insulation layer; forming thin-film transistors (TFTs) in the polycrystalline silicon; and, forming an electronic circuit using the TFTs, such as an OLED display.

The invention discloses a nanometer multiple-layer composite thermal insulation material and a preparation method thereof. The nanometer multiple-layer thermal insulation composite material is formed by alternatively overlapping an infrared reflecting screen and a spacer; the ratio of total layer amounts n of the infrared reflecting screens and the spacers to the total thickness of the nanometer multiple-layer composite thermal insulation material is 0.5-4; the infrared reflecting screen is a metal foil or a metal plated foil; the spacer is a thermostability nanometer porous aerogel composite thermal insulation material; the infrared reflecting screen and the spacer are combined by being adhered with thermostability adhesives or in puncturing connection by thermostability sewing threads. The invention also comprises the preparation method of the nanometer multiple-layer composite thermal insulation material. The nanometer multiple-layer composite thermal insulation material of the invention has low density, favorable mechanical property and favorable high-temperature thermal insulation property, lowers requirements on the vacuum degree by a VIP plate when being used as vacuum thermal insulation plate core materials, does not need getter and can satisfy harsh high-efficiency thermal insulation using requirements on materials by aviation, aerospace and civil fields. The method of the invention can prepare thermal insulation material members with large size and complex shape.

A protective acoustic cover assembly including a metal foil with perforations, and a treatment on one or more surfaces of said metal foil. The treatment is a hydrophobic or oleophobic treatment, or both. The protective acoustic cover assembly has an average specific acoustic resistance of less than about 11 Rayls MKS from 250-300 Hz, an average specific acoustic reactance magnitude of less than about 1 Rayls MKS from 250-300 Hz, and an instantaneous water entry pressure value of greater than about 11 cm. The perforations of the metal foil preferably have an average maximum pore size of less than about 150 micrometers. The protective acoustic cover assembly further includes an adhesive mounting system, and the preferred metal foil is nickel.

This invention comprises deposition of thin film photovoltaic junctions on metal substrates which can be heat treated following deposition in a continuous fashion without deterioration of the metal support structure. In a separate operation an interconnection substrate structure is produced in a continuous roll-to-roll fashion. In this way the interconnection substrate structure can be uniquely formulated from polymer-based materials since it does not have to endure high temperature exposure. Cells comprising the metal foil supported photovoltaic junctions are then laminated to the interconnection substrate structure. Conductive interconnections are deposited to complete the array. The conductive interconnections can be accomplished with a separately prepared interconnection component. The interconnected array is produced using continuous roll-to-roll processing which avoids the need to use the expensive and intricate material removal operations currently taught in the art to achieve electrical interconnections among arrays of photovoltaic cells.

To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it.A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a hybrid circuit board employing it. The metal base circuit board wherein a coverlay is provided, and a layer having a magnetic loss or a layer having a dielectric loss is laminated on the surface of the coverlay. A LED light source unit having at least one light-emitting diode (LED) mounted on the conductive circuit.