6508 results about "External connection" patented technology

A novel massively parallel supercomputer of hundreds of teraOPS-scale includes node architectures based upon System-On-a-Chip technology, i.e., each processing node comprises a single Application Specific Integrated Circuit (ASIC). Within each ASIC node is a plurality of processing elements each of which consists of a central processing unit (CPU) and plurality of floating point processors to enable optimal balance of computational performance, packaging density, low cost, and power and cooling requirements. The plurality of processors within a single node may be used individually or simultaneously to work on any combination of computation or communication as required by the particular algorithm being solved or executed at any point in time. The system-on-a-chip ASIC nodes are interconnected by multiple independent networks that optimally maximizes packet communications throughput and minimizes latency. In the preferred embodiment, the multiple networks include three high-speed networks for parallel algorithm message passing including a Torus, Global Tree, and a Global Asynchronous network that provides global barrier and notification functions. These multiple independent networks may be collaboratively or independently utilized according to the needs or phases of an algorithm for optimizing algorithm processing performance. For particular classes of parallel algorithms, or parts of parallel calculations, this architecture exhibits exceptional computational performance, and may be enabled to perform calculations for new classes of parallel algorithms. Additional networks are provided for external connectivity and used for Input / Output, System Management and Configuration, and Debug and Monitoring functions. Special node packaging techniques implementing midplane and other hardware devices facilitates partitioning of the supercomputer in multiple networks for optimizing supercomputing resources.

A peripheral card having a Personal Computer (“PC”) card form factor and removably coupled externally to a host system is further partitioned into a mother card portion and a daughter card portion. The daughter card is removably coupled to the mother card. In the preferred embodiment, a low cost flash “floppy” is accomplished with the daughter card containing only flash EEPROM chips and being controlled by a memory controller residing on the mother card. Other aspects of the invention includes a comprehensive controller on the mother card able to control a predefined set of peripherals on daughter cards connectable to the mother card; relocation of some host resident hardware to the mother card to allow for a minimal host system; a mother card that can accommodate multiple daughter cards; daughter cards that also operates directly with hosts having embedded controllers; daughter cards carrying encoded data and information for decoding it; and daughter cards with security features.

Embodiments of the present invention are directed towards instruments for investigation, screening, diagnosis, analysis or therapy and, more particularly, towards embodiments of one or more external working channels along the instrument. In one aspect, there is provided an apparatus having an instrument having an elongate body; and an expandable lumen connected externally to the elongate body and extending from a proximal position on the elongate body to a distal position on the elongate body, the expandable lumen having a stowed configuration and a deployed configuration. Alternatives include a method of providing a working channel within the body that positioning an instrument within the body; and providing an external working channel having a lumen that extends along the working channel and outside of the instrument.

A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.