To provide a
thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a
hybrid integrated circuit, an LED module and a bright, ultra-long-life LED
light source employing it.A
metal base circuit board having insulating
layers and conductive circuits or
metal foils alternately laminated, characterized in that the thickness of each conductive circuit or
metal foil is from 5 μm to 450 μm, each insulating layer is made of a cured product of a resin composition comprising an
inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 μm to 300 μm; and a
hybrid circuit board employing it. The metal base circuit board wherein a coverlay is provided, and a layer having a magnetic loss or a layer having a
dielectric loss is laminated on the surface of the coverlay. A LED
light source unit having at least one light-emitting
diode (LED) mounted on the conductive circuit.