A conductive electrolessly plated
powder used, for example, for bonding a small
electrode of an electronic device, its producing method, and a conductive material containing the plated
powder. Conventionally, there has been known, as conductive powders, metallic powders such as of
nickel, carbon powders, and conductive plating powders the resin core particles of which are coated with a
metal, e.g.,
nickel. However, there has been no conductive electrolessly plated powders having a good
conductivity with respect to connection between conductive patterns having an
oxide coating thereon or between electrodes and no methods for producing such powders industrially. The conductive electrolessly plated
powder of the present invention consists of resin spherical core particles the
average size of which is 1 to 20 mum and each of which has a
nickel or
nickel alloy coating formed by
electroless plating. The
coating includes small projections of 0.05 to 4 mum on its outermost layer and the coating is substantially continuous with the small projections. A method of producing such a powder is also disclosed.