11213results about "Magnetic/electric field screening" patented technology

A non-optical isolator having a driver circuit for providing an input signal to one or more first passive components which are coupled across a galvanic isolation barrier to one or more corresponding second passive components, and an output circuit that converts the signal from the second passive components to an output signal corresponding to the input signal. The entire structure may be formed monolithically as an integrated circuit on one or two die substrates, for low cost, small size, and low power consumption. The passive components may be coils or capacitor plates, for example. When the first and second passive components are capacitor plates, a Faraday shield may be provided between them, with the first and second passive components being referenced to separate grounds and the Faraday shield referenced to the same ground as the second passive components.

A feedthrough terminal assembly for an active implantable medical device includes a conductive ferrule conductively coupled to a housing of the medical device, a feedthrough capacitor conductively coupled to the ferrule, an inductor closely associated with the capacitor in non-conductive relation, and a conductive terminal pin extending through the capacitor and the inductor. The terminal pin extends through the inductor in non-conductive relation and is conductively coupled to active electrode plates of the capacitor. In one preferred form, the terminal pin is wound about the inductor. Additionally, the inductor may be maintained in close association with the capacitor without forming a direct physical attachment therebetween.

Portable electronic devices are provided. Each device may be formed from two parts. A first part may be provided with components such as a display, a touch screen, a cover glass, and a frame. A second part may be provided with a plastic housing, circuit boards containing electrical components, and a bezel. Engagement members may be connected to the first and second parts. The engagement members may be formed from metal clips with holes and springs with flexible spring prongs that mate with the holes in the clips. The metal clips may be welded to frame struts on the frame and the springs may be welded to the bezel. During assembly, the first part may be rotated into place within the second part. Retention clips attached to the frame may be used to secure the two parts together. Assembly instructions and associated connector numbers may be provided within the devices.

A case for an electronic device protects and extends the battery life of the electronic device. The case has a lower case portion and an upper case portion, which assemble together to protect the top, side, and bottom edges of the electronic device. The lower case portion includes a battery to extend the battery life of the electronic device.

A receptacle for a pluggable module includes a housing having a front, a back wall, a top wall, a bottom wall, and side walls and defining a cavity for receiving a module. The bottom wall has a bottom opening to receive a receptacle connector, and the front has a front opening to receive the module. The walls of the housing are made from a conductive material. A plurality of elongated members extend down from the housing past the bottom wall. The elongated members are adapted for electrical connection to a host circuit board such that the walls of the housing are electrically connected to the host circuit board.

A low-EMI circuit which realizes a high mounting density by converting the potential fluctuation off a power supply layer with respect to a ground layer which occurs on switching an IC device etc., into Joule's heat in the substrate without using any parts as a countermeasure against the EMI. Its structure, a circuit board using it, and a method of manufacturing the circuit board are also disclosed. Parallel plate lines in which the Q-value of the stray capacitance between solid layers viewed from the power supply layer and ground layer is equivalently reduced and which are matchedly terminated by forming a structure in which a resistor (resistor layer) and another ground layer are provided in addition to the power supply layer and the ground layer on a multilayered circuit board. A closed shield structure is also disclosed. This invention can remarkably suppress unwanted radiation by absorbing the potential fluctuation (resonance) which occurs in a power supply loop by equivalently reducing the Q-value of the stray capacitance, absorbing the standing wave by the parallel plate lines matchedly terminated and, closing and shielding the parallel plate lines.

The invention is directed to conformal coatings that provide excellent shielding against electromagnetic interference (EMI). A conformal coating comprises an insulating layer and a conducting layer containing electrically conductive material. The insulating layer comprises materials for protecting a coated object. The conducting layer comprises materials that provide EMI shielding such as carbon black, carbon buckeyballs, carbon nanotubes, chemically-modified carbon nanotubes and combinations thereof. The insulating layer and the conductive layer may be the same or different, and may be applied to an object simultaneously or sequentially. Accordingly, the invention is also directed to objects that are partially or completely coated with a conformal coating that provides EMI shielding.

In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.

An electrical connector assembly is shown having a stamped and formed shielded cage having a plurality of ports for receiving SFP modules. The cages have an opening extending through a lower face thereof for receiving a header connector having first and second extensions which are aligned with the first and second columnar ports in the cage. Thus, the SFP modules are pluggable into individual ports, whereby two modules are interconnected to a single header connector interconnected to a motherboard.

An apparatus and method is provided to shield contactless portable electronic consumer devices such as radio frequency identification devices (RFID), tokens, mini-cards, key fobs, cellular phones, smartcards, etc. from wireless interrogation. In one embodiment, a contactless portable consumer device which includes a first antenna is shielded from unauthorized wireless interrogation with a radio frequency (RF) shield. The RF shield includes electrically conductive, non-ferromagnetic material and is configured to prevent unauthorized data transfer between a second antenna external to the portable consumer device and the first antenna.

An improved housing for a computing device is disclosed. The improved housing can have one or more of the following aspects. A first aspect of the invention pertains to a computer housing having a logo or other symbol that can be illuminated using light from the backside of a display panel. A second aspect of the invention pertains to a suspended frame is able to support a display panel within a display housing. A third aspect of the invention pertains to a computing device provided with an internal antenna. A fourth aspect of the invention pertains to a stiffener for a computer housing so as to increase the rigidity and strength of the computer housing. A fifth aspect of the invention pertains to a housing having a logo, symbol or other device that can be illuminated using light from the backside of a display panel. A sixth aspect of the invention pertains to a lid for a computing device, such as a portable computer, that is provided with a translucent housing.

An unassembled stacked IC device includes an unassembled tier. The unassembled stacked IC device also includes a first unpatterned layer on the unassembled tier. The first unpatterned layer protects the unassembled tier from ESD events.

A high frequency component is constructed such that the characteristics of a high frequency circuit that cannot be measured only by an outwardly extending terminal electrode are easily measured at the final-product stage. In the high frequency component, a substrate has an electrode pattern provided including a signal measuring electrode pad. Additionally, chip components are mounted on the substrate. A metal cover has a hole provided near the signal measuring electrode pad. Through the hole, a probe of a measuring apparatus is inserted from the outside to abut with the electrode pad. With the arrangement, a voltage signal obtained at a predetermined point of the high frequency circuit is measured.

A handheld computing device is disclosed. The handheld computing device includes a seamless enclosure formed from an extruded tube. The extruded tube includes open ends and internal rails which serve as a guide for slidably assembling an operational assembly through the open ends of the extruded tube, a reference surface for positioning the operational assembly relative to an access opening in the seamless enclosure, and a support structure for supporting the operational assembly during use.