251results about How to "Radiation suppression" patented technology

A low-EMI circuit which realizes a high mounting density by converting the potential fluctuation off a power supply layer with respect to a ground layer which occurs on switching an IC device etc., into Joule's heat in the substrate without using any parts as a countermeasure against the EMI. Its structure, a circuit board using it, and a method of manufacturing the circuit board are also disclosed. Parallel plate lines in which the Q-value of the stray capacitance between solid layers viewed from the power supply layer and ground layer is equivalently reduced and which are matchedly terminated by forming a structure in which a resistor (resistor layer) and another ground layer are provided in addition to the power supply layer and the ground layer on a multilayered circuit board. A closed shield structure is also disclosed. This invention can remarkably suppress unwanted radiation by absorbing the potential fluctuation (resonance) which occurs in a power supply loop by equivalently reducing the Q-value of the stray capacitance, absorbing the standing wave by the parallel plate lines matchedly terminated and, closing and shielding the parallel plate lines.

A method of manufacturing an active matrix substrate is provided that uses a technique of transferring a thin film device. In forming thin film transistors and pixel electrodes on an original substrate before transfer, an insulator film such as an interlayer insulation film or the like, is previously removed before the pixel electrodes are formed. Further, the original substrate is separated by exfoliation to transfer the device to a transfer material to cause the pixel electrodes to partially appear in the surface or the vicinity of the surface of the device. This portion permits application of a voltage to a liquid crystal through the pixel electrode.

A wiring substrate section 2 is provided between a radiation detecting section 1, which is formed of a scintillator 10 and a PD array 15, and signal processing elements 30 and 32 for processing a detected signal outputted from the PD array 15, and the wiring substrate section 2 has a wiring substrate 20 which is formed of a glass material having a radiation shielding function and in which a conductive member 21 serving as a conduction path for guiding the detected signal therethrough is provided in a through hole 20c. Relative to the through hole 20c of the wiring substrate 20, the signal processing elements 30 and 32 of the signal processing section 3, located downstream of the wiring substrate 20, are each disposed in an area excluding those areas on the extension of the through holes 20c, and this allows the signal processing elements 30 and 32 not to be seen through the through holes 20c. This arrangement realizes a radiation detector which suppresses radiation made incident on the signal processing means located downstream of the wiring substrate.

Methods, apparatuses, devices, and systems for creating, controlling, conducting, and optimizing fusion activities of nuclei. The controlled fusion activities cover a spectrum of reactions from aneutronic, fusion reactions that produce essentially no neutrons, to neutronic, fusion reactions that produce substantial numbers of neutrons.

Provided is a dielectric waveguide filter. The filter includes: a multi-layered structure of dielectric substrates having first and second ground planes at its top and bottom; first, second, and third waveguide resonators disposed at multiple layers within the multi-layered structure; converters for signal transition between input / output ports and the first and third waveguide resonators; first vias for forming the first, second, and third waveguide resonators; and second vias disposed at a boundary surface of the first waveguide resonator and the third waveguide resonator.

An object of the invention is to provide a Mach-Zehnder type optical modulator that can reduce wavelength chirp occurring in a modulated light, and also can reduce an optical loss with a small sized configuration. To this end, according to the present Mach-Zehnder type optical modulator, in a configuration where optical waveguides and a coplanar electrode are formed on a substrate having an electro-optical effect, a polarization inversed region is formed in a part of an interaction portion of the substrate, and a signal electrode is arranged above one of parallel waveguides in a polarization inversed region and is arranged above the other parallel waveguide in a non-inversed region. Furthermore, a surface area of the substrate positioned on both sides of each of the parallel waveguides is lowered to provide a ridge structure section, and a buffer layer is formed on a ridge side face thereof.

In a receptacle cage, a front EMI finger in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between the peripheral edge of a slot of a cover, into which a plug connector for the optical module connected to a receptacle connector in a receptacle connector accommodating portion is inserted, and a peripheral surface of a plug connector and a gap between a lower surface of the cover and a surface, on which a printed wiring board is mounted, are shielded by an EMI gasket serving as a second shield member and an EMI gasket serving as a third shield member, respectively.

A multi-layered spectral purity filter improves the spectral purity of extreme ultra-violet (EUV) radiation and also collects debris emitted from a radiation source.

An X-ray detector is provided with a plurality of modules each having a plurality of detection elements each composing a pixel, in which the detection elements convert incoming radiations to electric data depending on amounts of the radiations. The plural modules are mutually adjacently arranged on the same surface with a gap having a known width formed therebetween, such that the modules are arranged along at least one of a first X-axis and a first Y-axis, wherein the radiation detector is given a scan direction which is set along one of the first X- and Y-axes and the first Y-axis is perpendicular to the first X-axis. The plural detection elements of each module are two-dimensionally arranged along a second X-axis and a second Y-axis which are set obliquely to the first X-axis and the first Y-axis respectively and which are perpendicular to each other.

An electronic device (1) has an information processor (3) including a circuit board (31) and an integrated circuit element (32). The integrated circuit element is mounted on the circuit board for controlling input and output of information. Further, the circuit board is provided with a cover member (33A) having thermal conductivity and electrical conductivity and covering the integrated circuit element. The cover member, which is electrically connected to ground patterns (G) formed on the circuit board, includes an electromagnetic radiation suppressor (5) for suppressing radiation of electromagnetic waves generated from the integrated circuit element.