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8030results about "Heat transfer modification" patented technology
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Electronic device for regulating and controlling ambient temperatures, and relative setting method
InactiveUS6502758B2Easy to useQuick understandingDomestic cooling apparatusTemperature control using electric meansDot matrixDisplay device
Electronic device operable by an user for regulating and controlling ambient parameters, such as ambient temperature, comprising a processing unit, a display device for displaying selectable control functions and setting parameters related to a set of desired ambient conditions and a selection / control unit for selecting by the user at least one control function or setting parameter from among a set of displayed control functions or setting parameters. The device comprises an interactive display of a dot matrix type able to display to a user variable indications comprising at least the specific control function associated with each of said selection / control unit according to the specific selection made by the user.
Owner:INVENSYS CONTROLS ITAL
Nanotube/metal substrate composites and methods for producing such composites
InactiveUS20050238810A1Simplified and advantageous mannerReduce productionMaterial nanotechnologyIndirect heat exchangersHydrogen fuel cellChemical vapor deposition
Carbon nanotubes are grown directly on metal substrates using chemical vapor deposition. Metal substrates are comprised of catalysts which facilitate or promote the growth of carbon nanotubes. The nanotube coated metal substrates have applications including, but not limited to, heat transfer and thermal control, hydrogen storage, fuel cell catalytic reformers, electronics and semiconductors, implantable medical devices or prostheses, and tribological wear and protective coatings.
Owner:MAINSTREAM ENG
Advanced heat sinks and thermal spreaders
InactiveUS20070053168A1Material nanotechnologyDigital data processing detailsGraphiteMaterials science
A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W / m° C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.
Owner:GENERAL ELECTRIC CO
Susceptor design to reduce edge thermal peak
ActiveUS20160133504A1Solid-state devicesSemiconductor/solid-state device manufacturingSusceptorEngineering
Implementations of the present disclosure generally relate to a susceptor for thermal processing of semiconductor substrates. In one implementation, the susceptor includes a first rim surrounding and coupled to an inner region, and a second rim disposed between the inner rim and the first rim. The second rim includes an angled support surface having a plurality of cut-outs formed therein, and the angled support surface is inclined with respect to a top surface of the inner region.
Owner:APPLIED MATERIALS INC
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
InactiveUS7000684B2Minimized fluid path distanceImprove cooling effectSemiconductor/solid-state device detailsSolid-state devicesInterface layerPath distance
A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
Owner:VERTIV CORP
Heater control device and method to save energy
InactiveUS6293471B1Fuel supply regulationTemperature control using digital meansWater basedAutomatic control
A device and method is provided for automatically controlling the heating element(s) of an electric hot water heater to minimize electric energy consumption over a prolonged time period by projecting the future need for hot water based on it's use in prior time periods as well as by monitoring the use of hot water during current periods. The device saves energy by switching the heater "off" during times when the projected and current need for hot water is low or nonexistent thereby reducing the tank temperature and therefore energy losses to the ambient, while detecting the instantaneous requirement for hot water through utilization of a flow sensor arrangement, one of which is the utilization of thermistors on the exit pipe and on the tank or body of the heater. The device leaves all existing controls intact and may be adapted by end users to existing heaters or by manufacturers of original equipment (OEMs).
Owner:STETTIN DANIEL R +1
Cooling systems incorporating heat exchangers and thermoelectric layers
ActiveUS20070034356A1Thermoelectric device with peltier/seeback effectDigital data processing detailsEngineeringThermal contact
A method and system for cooling a heat source are presented. The system includes a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat rejector configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in a cooling system to enhance the cooling efficiency of the system.
Owner:VERTIV CORP
Systems and methods for weatherproof cabinets with multiple compartment cooling
A weatherproof cabinet with multiple-compartment cooling includes a housing and a door attached to the housing. The door includes a heat exchanger core, a first duct located at least partially between the heat exchanger door and an exterior of the door, and a second duct located at least partially between the heat exchanger door and an electronics compartment. The door also includes an inlet vent and an outlet vent that are pneumatically interconnected with the first duct. A fan is located at least partially within the first duct and is operative to draw external air into the first duct via the inlet vent, direct at least the first portion of the external air across the heat exchanger core, and then direct the first portion of the external air out of the first duct via the outlet vent. A partition is located within the first duct and separates the inlet vent from the outlet vent so that external air is not drawn into the first duct via the outlet vent during operation of the fan.
Owner:COMMSCOPE INC
Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device
ActiveUS7104312B2Minimize temperature differenceTemperatue controlSemiconductor/solid-state device detailsTemperature differenceEngineering
A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
Owner:VERTIV CORP
Method for making a thermal interface material
ActiveUS7393428B2Increase in sizeReduced flexibilityLamination ancillary operationsHeat storage plantsCarbon nanotubePhase change
Owner:TSINGHUA UNIV +1
Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
InactiveUS6988534B2Temperatue controlSemiconductor/solid-state device detailsInter layerInterface layer
A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
Owner:VERTIV CORP
Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking
InactiveUS20050006754A1Semiconductor/solid-state device detailsNanoinformaticsContact padDevice material
A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).
Owner:GE LIGHTING SOLUTIONS LLC
Seat with temperature control and ventilation and safety system for a vehicle
InactiveUS6892807B2Shorten drying timeReduce the negative local chillingDomestic cooling apparatusPower to electric heating circuitsTemperature controlEngineering
Methods and apparatus for controlling the temperature of a seat such as a vehicle seat are disclosed. The apparatus includes an electrical heater disposed in the seat, a cooling unit such as a cooling element and a fan, a detector for detecting the temperature associated with the electrical heater, and a controller for controlling the electrical heater and the cooler based upon the detected temperature and upon the humidity algorithm comprising a predetermined set of calculations of the humidity of air at different temperatures.
Owner:LEAR CORP
Multi-level microchannel heat exchangers
ActiveUS7156159B2Uniform pressure flowAccurate concentrationThermal insulationSemiconductor/solid-state device detailsInterface layerInlet manifold
An apparatus and method of circulating a heat-absorbing material within a heat exchanger. The apparatus comprises a manifold layer coupled to an interface layer. The manifold layer comprises an inlet manifold and an outlet manifold. The interface layer comprises a plurality of channels that extend from the inlet manifold, toward a heat-exchanging plane, and turn away from the heat-exchanging plane, terminating at the outlet manifold. The plurality of channels are stacked in a plane non-parallel to the heat-exchanging plane. Each of the channels is adjacent to another, thus allowing heat radiated from a heat-generating device to be conducted to a cooling material circulating within the channels, away from the heat-generating device. Preferably, each of the channels has a U-shape or an elongated U-shape.
Owner:VERTIV CORP
Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact
InactiveUS20050126766A1Increase surface areaGood thermal contactSemiconductor/solid-state device detailsNanoinformaticsBoron nitrideNanostructure
Nanostructures provide improved contact to augment heat-exchange surfaces of various devices or structures. In one embodiment, an article of manufacture has a body having a heat-exchanging surface and nanostructures disposed on the heat-exchanging surface. The nanostructures are arranged to enhance thermal transfer between said body and an object distinct from said body and may be arranged to form a substantially continuous film. Examples of suitable nanostructures include carbon and / or boron nitride nanotubes, which may be grown on the heat-exchanging surface.
Owner:NASREEN CHOPRA
Magnetically enhanced convection heat sink
InactiveUS7031160B2Increased convection coolingHigh trafficElectromagnets without armaturesSemiconductor/solid-state device detailsMagnetic sourceConvection heat
A magnetically enhanced convection heat sink comprises a heat sink member for dissipating heat from a heat source. A magnetic source creates a magnetic field concentrated at a first location, the intensity of the magnetic field decreasing from the first location to a second location. The heat sink member is positioned within the magnetic field and in a gas flow path between the first and second locations. Gas, having paramagnetic properties, entering the heat sink at the first location is heated by the heat sink member, and as the gas becomes warmer is displaced by cooler gas causing the warmer gas to move toward the second location as it is further heated by the heat sink.
Owner:THE BOEING CO
Cooling airflow distribution device
InactiveUS7011576B2Domestic cooling apparatusDigital data processing detailsEngineeringVertical array
A system for removing heat from a plurality of electronic assemblies including a cabinet having brackets for supporting electronic assemblies in a vertical array between a first vertical airflow path and a second vertical air flow path of the cabinet, and a plinth underlying the cabinet and having an input port receiving air from the first vertical airflow path of the cabinet, an output port transmitting air to the second vertical air flow path, a heat exchanger positioned in an air flow path extending between the input and the output ports, and a fan assembly for driving air through the heat exchanger and towards the input port. The system further includes at least one air flow distribution device establishing a predetermined flow rate distribution through electronic assemblies supports by the brackets.
Owner:SANMINA-SCI CORPORATION
Low Pressure Drop Mixer for Radial Mixing of Internal Combustion Engine Exhaust Flows, Combustor Incorporating Same, and Methods of Mixing
ActiveUS20090255242A1Increase surface areaEnhanced interactionInternal combustion piston enginesFlow mixersCombustion chamberCombustor
An exhaust aftertreatment system is provided. The exhaust aftertreatment system includes a mixing arrangement for mixing flows of exhaust along a flow path. The mixing arrangement radially and angularly rearranges segments of two different portions of flow to mix the different portions of flow. The mixing arrangement initially converts a generally radially stratified temperature profile into an angularly stratified temperature profile to increase surface area between cool segments of exhaust gas and hot segments of exhaust gas. The aftertreatment system may also include a combustion chamber, a combustor housing and a combustor liner. The mixing arrangement is downstream from the combustion chamber to direct radially outward hot gas passing through the combustor liner and to direct radially outer cool gas passing between the liner and the combustor housing radially inward in an interleaving fashion.
Owner:WOODWARD GOVERNOR CO
Systems and methods for weatherproof cabinets with variably cooled compartments
InactiveUS6877551B2Substation/switching arrangement cooling/ventilationAir heatersBiomedical engineeringElectronics
Systems and methods for weatherproof cabinets with variably cooled compartments are provided. One such embodiment includes a housing having a door attached thereto, and in which a cooling compartment and a battery compartment are disposed. An electronics compartment is disposed within the cooling compartment, and an external fan is also disposed within the housing. Methods are also provided for transferring heat from inside the electronics compartment to the cooling compartment, from the cooling compartment to the outside of the housing, and from the battery compartment to the outside of the housing.
Owner:COMMSCOPE INC
Ventilated merchandising system
A ventilated merchandising system for products displayed in merchandise coolers such as refrigerator or freezer cases. One embodiment of the merchandising system includes a base member and a platform coupled to the base member such that air can flow between the platform and the base member. One or more plenum plates can be coupled to the base for directing air between the platform and the base member. A pusher plate may also be coupled to and movable along the platform for advancing products along the platform. A baffle system that may be coupled to a merchandising tray and a method of distributing air flow within a merchandise cooler unit are also provided.
Owner:DCI MARKETING
Carbon nanotube heat-exchange systems
InactiveUS20040194944A1Stationary conduit assembliesHeat transfer modificationCarbon nanotubeCooling fluid
A carbon nanotube heat-exchange system (10) and method for producing the same. One embodiment of the carbon nanotube heat-exchange system (10) comprises a microchannel structure (24) having an inlet end (30) and an outlet end (32), the inlet end (30) providing a cooling fluid into the microchannel structure (24) and the outlet end (32) discharging the cooling fluid from the microchannel structure (24). At least one flow path (28) is defined in the microchannel structure (24), fluidically connecting the inlet end (30) to the outlet end (32) of the microchannel structure (24). A carbon nanotube structure (26) is provided in thermal contact with the microchannel structure (24), the carbon nanotube structure (26) receiving heat from the cooling fluid in the microchannel structure (24) and dissipating the heat into an external medium (19).
Owner:ALLIANCE FOR SUSTAINABLE ENERGY
Cooling apparatus for semiconductor chips
ActiveUS8081465B2Improve flowLarge outputSemiconductor/solid-state device detailsSolid-state devicesCoolant flowSemiconductor chip
A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other.
Owner:FUJI ELECTRIC CO LTD
Liquid-Impregnated Surfaces, Methods of Making, and Devices Incorporating the Same
InactiveUS20130032316A1Improve skidReduce resistanceFouling preventionDe-icing equipmentsNon wettingFrost
The invention is directed to an article with a liquid-impregnated surface, the surface having a matrix of features thereupon, spaced sufficiently close to stably contain a liquid therebetween or therewithin, and preferable also a thin film thereupon. The surface provides the article with advantageous non-wetting properties. Compared to previous non-wetting surfaces, which include a gas (e.g., air) entrained within surface textures, these liquid-impregnated surfaces are resistant to impalement and frost formation, and are therefore more robust.
Owner:MASSACHUSETTS INST OF TECH
System and Method For Vertically Stacked Information Handling System and Infrastructure Enclosures
ActiveUS20100170277A1Improve processing densityEffective distributionDomestic cooling apparatusIndirect heat exchangersInformation processingVolumetric Mass Density
An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers.
Owner:DELL PROD LP
System and method for thermal energy storage and power generation
A thermal energy storage system is proposed in which the latent heat of fusion of common salts is used to store energy within a selectable temperature range, extending both above and below the melting / freezing temperature zone of the salt mixture. The salt mixture occupies interstitial void spaces in a solid endostructure. The solid material remains in the solid state throughout the thermal cycling of the energy storage system, and preferably has properties of thermal conduction and specific heat that enhance the behavior of the salt mixture alone, while being chemically compatible with all materials in the storage system. The storage system is capable of accepting and delivering heat at high rates, thereby allowing power generation using a suitable energy transfer media to power a turbine of an electric generator or a process heat need to provide a relatively local, dispatchable, rechargeable thermal storage system, combined with a suitably sized generator.
Owner:WOODWARD GOVERNOR CO
Illumination apparatus of light emitting diodes and method of heat dissipation thereof
InactiveUS7210832B2Extended service lifeDissipate heat generatedDomestic stoves or rangesPoint-like light sourceEngineeringLoop heat pipe
An illumination apparatus of light emitting diodes and method of heat dissipation thereof are provided. The present illumination apparatus is associated with a loop heat pipe (LHP) device. The LHP device includes a condenser communicating with an evaporator. The illumination apparatus includes a base having a plurality of light emitting diodes disposed thereon and a cover with a light exit enclosing the base. The evaporator is associated with the base and the condenser is associated with the cover. The heat generated from the light emitting diodes is conducted to the cover, and thereby dissipated away.
Owner:ADVANCED THERMAL DEVICES
Heat sink
InactiveUS20080066888A1Minimized pressure dropImprove cooling effectSemiconductor/solid-state device detailsSolid-state devicesRADIUSHeat spreader
A heat sink comprises a base panel having a top surface and a bottom surface. A plurality of pin fins extend outwardly from the top surface and each fin has a cross-sectional configuration with two radiuses, a first radius and a second radius, wherein the first radius is larger than the second radius. The first and second radiuses are tangentially interconnected by intermediate portions, giving the pin fin cross-sectional configuration a raindrop shape, thereby generating low pressure drop across the heat sink by minimizing the drag force effects and maintaining large exposed surface area available for heat transfer.
Owner:DANAHER MOTION STOCKHOLM AB
Method and apparatus for cooling electronic components
InactiveUS6400568B1Digital data processing detailsSemiconductor/solid-state device detailsProcess engineeringElectronic component
The present invention discloses improved cooling designs and methods for the cooling of heat sources. One embodiment of the present invention is a cooling system comprising a housing and at least one divider disposed within the housing. The at least one divider creates a plurality of airflow channels through the housing. Another embodiment of the invention is a method for dissipating heat from heat sources within an electrical assembly comprising at least partially separating the heat sources with a divider. Separate airflow channels are created whereby the separated heat sources are disposed within the separated airflow channels. Forced airflow streams are generated through the separated airflow channels, thereby dissipating heat from the heat sources into the forced airflow streams.
Owner:ORACLE INT CORP
Heat exchanger tube having integrated thermoelectric devices
InactiveUS20080028769A1Maximize heating efficiencyMaximize efficiencyThermoelectric device with peltier/seeback effectVehicle heating/cooling devicesEngineeringThermoelectric effect
A heat exchanger for a vehicle is shown, wherein the heat exchanger includes a plurality of tubes having integrated thermoelectric devices disposed thereon to facilitate heat transfer between the tubes and an atmosphere surrounding the tubes.
Owner:GENTHERM INC
Nanotube/metal substrate composites and methods for producing such composites
InactiveUS20060233692A1Simplified and advantageous mannerReduce productionSolar heating energyMaterial nanotechnologyHydrogen fuel cellChemical vapor deposition
Carbon nanotubes are grown directly on metal substrates using chemical vapor deposition. Metal substrates are comprised of catalysts which facilitate or promote the growth of carbon nanotubes. The nanotube coated metal substrates have applications including, but not limited to, heat transfer and thermal control, hydrogen storage, fuel cell catalytic reformers, electronics and semiconductors, implantable medical devices or prostheses, and tribological wear and protective coatings.
Owner:MAINSTREAM ENG
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