Apparatus and method are provided for facilitating air-cooling of an
electronics system employing a vapor-compression heat exchange
system, and front and back covers. An
evaporator housing of the heat exchange
system is mounted to a system housing of the
electronics system and extends at least partially between air inlet and outlet sides of the system housing. The
evaporator housing includes air inlet and outlet openings, and an
evaporator. The
front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and
front cover define a
closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.