13368results about "Substation/switching arrangement cooling/ventilation" patented technology

An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

Refrigerator including a body forming an outer appearance of the refrigerator, a terminal detachably mounted on the body for controlling the refrigerator, a power supply device at one side of the body, for receiving power from an outside of the refrigerator, converting to a predetermined charge power, and supplying to the terminal, and an electric connection part connected between the power supply device and the terminal.

A distribution cabinet (1) for accommodating weak-current distribution installations, in particular for arranging outdoors, havinga base box (2),an outer cabinet body (3) with at least one door (4),a cabinet cover (5), andan inner installation frame (6),the installation frame (6) being made up of profile sections (50), of which the cross-sectional shapes has two insertion pockets (51a,b), of which the insertion directions (52a,b) run at right angles to one another.

Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

A method for controlling a data center, comprising a plurality of server systems, each associated with a cooling system and a thermal constraint, comprising: a concurrent physical condition of a first server system; predicting a future physical condition based on a set of future states of the first server system; dynamically controlling the cooling system in response to at least the input and the predicted future physical condition, to selectively cool the first server system sufficient to meet the predetermined thermal constraint; and controlling an allocation of tasks between the plurality of server systems to selectively load the first server system within the predetermined thermal constraint and selectively idle a second server system, wherein the idle second server system can be recruited to accept tasks when allocated to it, and wherein the cooling system associated with the idle second server system is selectively operated in a low power consumption state.

A switchgear cabinet having at least one cabinet door and a fan-assisted air circulation on an interior for cooling heat-generating devices installed inside, which are disposed one above the other in tiers. With particular air circulation, the partial cooling air flows in the tiers and can be set and adjusted, to a large extent independently of one another.

An electric power distributor mountable on a motor vehicle for distributing power from a power source installed in the motor vehicle to a plurality of electric load units equipped in the vehicle has a plurality of semiconductor operative elements which are incorporated in a power supply circuit from the power source to the electric load units; a control circuit board incorporated with a control circuit for controlling an operation of the semiconductor operative elements; a housing for encasing the semiconductor operative elements and the control circuit board therein; and a heat releasing member provided on an outer surface of the housing to release heat transferred from the semiconductor operative elements outside of the housing. The control circuit board is arranged at such a position as to be mounted over the semiconductor operative elements from a side of the housing opposite to the mounted side of the heat releasing member with respect to the semiconductor operative elements, and is formed with a heat transfer layer on a side of the control circuit board as opposed to the semiconductor operative elements. The heat transfer layer and the heat releasing member are connected by a heat transfer member.

A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a picking material.

An assembly of devices including at least one switchgear cabinet and a cooling device. The switchgear cabinet has a closed interior, in which electric installations can be housed. The cooling device is attached in the vicinity of or near a lateral surface of the switchgear cabinet that runs vertically with respect to the front face, extending at least over part of the height of the switchgear cabinet and having a spatial connection with the interior via at least one air inlet and at least one vent outlet. The cooling device includes a receiving chamber that houses at least one heat exchanger. This invention facilitates the adaptation of the cooling device in superstructures of this type to modified cooling requirements. To achieve this, at least sections of the receiving chamber of the cooling device are divided into two or more receiving sub-chambers that are situated one above the other and a cooling module is housed in at least one of the receiving sub-chambers.

An exemplary embodiment relates to a cooling system and a method for cooling an electronic display. A preferred embodiment includes a transparent gas cooling chamber. The transparent gas cooling chamber may have a linear polarizer. The components in the system are preferably housed within the electronic display housing. The cooling chamber defines a gas compartment that is anterior to and coextensive with the electronic display surface. Fans may be used to propel the isolated gas through the cooling chamber. The circulating gas removes heat directly from the electronic display surface by convection. The isolated gas is transparent or at least semi-transparent. The image quality of an exemplary embodiment remains essentially unchanged, even though the gas is flowing through a narrow channel over the visible face of the electronic display surface.