1126 results about "Liquid cooling system" patented technology

An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.

A liquid cooling system and apparatus is presented. A two-piece embodiment is presented. The first component is a heat transfer unit capable of engaging a processor and adapted to transfer heat from the processor to a liquid thereby generating heated liquid. The heated liquid is transported through a detachable input and output transport conduit to a second component. The second component is a heat exchange unit capable of cooling the liquid transported from the heat transfer unit. The heat exchange unit includes an input cavity for receiving the heated liquid, a heat dissipater for dissipating heat from the heated liquid thereby producing cooled liquid, and an output cavity for outputting the cooled liquid back to the heat transfer unit. In one embodiment, the heat exchange unit includes a pumping system for pumping the liquid from the heat exchange unit through the conduit to the heat transfer unit and back.

In an electronic apparatus, including personal computers, being called by a desktop type and a notebook type, as well as a server, etc., comprising a redundant cooling system, mounting a CPU 200 necessitating cooling in a housing 100, wherein a liquid cooling system for cooling the CPU comprises: a cooling jacket 50; a radiator 60; and two (2) sets of circulation pumps, and there are further provided check valves 91 and 92 and conduits 81, 82 . . . , so as to maintain circulation of the liquid coolant even when one of the two (2) sets of circulation pumps stops the function thereof, through the other circulation pump, thereby built up a redundant liquid cooling system.

A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

Mounting systems are provided for bringing a heat exchanger from a server rack into thermal contact with a heat exchanger from an electronics server. An engaging force is applied to the two heat exchangers to create thermal communication there between. A mounting mechanism is configured to isolate the engaging force applied to the two heat exchangers. The mounting mechanism may include an interlocking mechanism that prevents transfer of the applied force to the rest of the electronics server to lessen the possibility of disconnecting the electrical connections between the electronics server and the rack, and / or lessening mechanical stresses transferred to the electronics server and the rack chassis. The mounting mechanism also may be coupled to the electronics server locking mechanism such that the action of locking the electronics server into the rack causes the heat exchangers to engage in thermal contact.

An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise. The electronic equipment is provided with a liquid-cooling system, in which heat generated in a heat generating portion is transmitted to a heat radiating portion with a liquid as a medium to achieve cooling, and an air-cooling system, in which heat transmitted to the heat radiating portion is forcedly cooled, and comprises a pump that circulates the liquid between the heat generating portion and the heat radiating portion, a fan that forcedly discharges heat of the heat radiating portion to an outside, a temperature sensor that detects temperature of the heat generating portion, and storage information that beforehand prescribes the relationship between temperature of the heat generating portion and voltages of the pump and the fan, the electronic equipment being constructed such that a pump voltage is raised without changing a fan voltage when the detected temperature exceeds a first temperature, and a fan voltage is raised when temperature detected by the temperature sensor exceeds a second temperature higher than the first temperature, thus further increasing a cooling capacity.

A rack-mount server system of a liquid cooling system, in which a heat-generating component such as CPU is cooled by a coolant, is composed of: a plurality of server modules with heat-generating components which are cooled by the circulating coolant; a coolant circulation path to which the server modules are connected in parallel and through which the coolant to cool the server modules is circulated; and a cooling unit connected in the middle of the coolant circulation path, the cooling unit circulating the coolant and cooling the coolant by radiating its heat to the outside air. Furthermore, a bypass route parallel to the server modules and going around the server modules is provided in the coolant circulation path, and the circulation quantity of the coolant is controlled in the bypass route. Alternatively, the flow quantity of the coolant is controlled in each of the server modules. In this manner, the cooling enough to ensure the reliability of a plurality of server modules mounted in the rack cabinet can be achieved.

A thermal interposer for a heat-generating electronic component includes a thermally conducting body that is configured to be thermally coupled to the electronic component. The thermally conducting body may include a first region that is located on a first face of the thermally conducting body. The first region may be adapted to be in thermal contact with a surface of the electronic component. The thermally conducting body may also include a second region located on a second face that is opposite the first face of the thermally conducting body. The thermal interposer may also include a cold plate assembly that is removably coupled to the thermally conducting body. The cold plate assembly may be in thermal contact with the second region of the thermally conducting body. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.