Cooling system or electronic apparatus, and electronic apparatus using the same

Abstract

An electronic apparatus, such as, personal computers of so-called a desktop type and a notebook type, as well as, a server, etc., having a cooling system being high in cooling efficiency, wherein a CPU 200 in need of cooling is installed within a hosing 100, and the liquid cooling system for cooling the CPU, comprises: a heat-receiving (cooling) jacket 50; a radiator 60; and a circulation pump 70, wherein the heat-receiving (cooling) jacket 50, for transmitting heat generated from a heat-generation element, i.e., the CPU, into a liquid coolant flowing with in an inside thereof, has a heat diffusion plate 90 attached on the lower surface thereof. This heat diffusion plate encloses an operating fluid 94, such as water, within a space, which is hermetically sealed and formed within an inside thereof, and also has heater elements 95, being provided in contact with a portion the operating fluid. To those heater elements 95 are supplied a pulse-like electric power. With this, a portion of the operating fluid repeats forming / extinguishing, to give vibration to the operating fluid, thereby diffusing the heat over the entire of the diffusion plate, as a whole, thereafter the heat is transmitted to the heat-receiving (cooling) jacket. Or, alternatively, it may be connected with a heat radiation fin 300.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates to an electronic apparatus, such as, a personal computer, being so-called a desktop-type or a notebook-type, or a server, etc., and in particular, it relates to an electronic apparatus having a liquid cooling system therein, being able to cool down a heat-generation element mounted within an inside thereof, such as, a semiconductor integrated circuit (IC), effectively with an aid of a liquid refrigerant or coolant, as well as, the cooling system thereof. [0002] In order to maintain a normal operation thereof, cooling is necessary for the heat-generation element, such as, the semiconductor IC element, being mounted within an electronic apparatus, including a personal computer, of so-called the desktop-type or the notebook-type, as well as, a server, etc., and in particular, the heat-generation element, such as, a CPU (Central Processing Unit), as a representative one thereof, for example. For this reason, conventionally...

AI Technical Summary

Benefits of technology

[0017] Therefore, an object, according to the present invention, by taking the problems in such the conventional arts into the consideration, in more details, is provide a cooling system, being suitable for use in the personal computers, such as, called by the desktop type and / or the notebook type, and also the server, etc., and enhancing or increasing the cooling efficiency thereof with using a heat transmission / diffusion element, in which heat transmission / diffusion is promoted or facilitated through vibration of the heat-conductive liquid filled within an inside of a heat-conductive member, as well as, an electronic apparatus having such the cooling system therein.

Problems solved by technology

However, in the case where that contact surface is small in the area thereof, even though the heat diffuses also to the peripheral portion thereof, more or less, but it cannot diffuse to the entire of the jacket, therefore the cooling efficiency of the heat-generation element is lowered by means of the heat-receiving (or cooling) jacket.

Thus, at a position relatively far from the contact position with the CPU, the conduction of the heat generation cannot be obtained sufficiently, to the liquid coolant flowing within the jacket, and therefore, only a part of cooling capacity is utilized, but without using the, cooling capacity, fully, by means of the heat-receiving (or cooling) jacket.

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