An integrated liquid cooling device for electronic components addresses the need for efficient cooling created by ever increasing power densities of electronic components. The integrated liquid cooling device has a housing enclosing the
electronic component, cooling liquid contained in the housing, a motor immersed in the cooling liquid and mounted to the housing, an
impeller driven by the motor, and cooling surfaces on the exterior of the housing. The motor driven
impeller creates a turbulent flow in the cooling liquid and a
high velocity liquid flow over the
electronic component, which rapidly transfers heat from the
electronic component and distributes it throughout the interior of the housing. The cooling surfaces on the exterior of the housing dissipate this heat, either by free or
forced convection, into the surrounding environment. Alternately, the integrated liquid cooling device may distribute this
heat energy over an equipment case by circulating cooling liquid through a baffled
enclosure that provides
high velocity cooling liquid flow near the heat generating electronic component. Additional
cooling capacity can be gained with the described integrated liquid cooling device by selecting a cooling liquid whose
boiling point is near the
operating temperature of the electronic component.