5044results about "Rack/frame construction" patented technology

A handheld computing device is disclosed. The handheld computing device includes an enclosure having structural walls formed from a ceramic material that is radio-transparent.

An easily removable modular optical signal transceiver unit for conversion between modulated light signal transmission and electronic data signals and which conforms to the Small Form Factor standard for transceiver interfaces is disclosed. The structural details of its chassis include aspects which insure the proper positioning of electronic circuit boards of a transmitter optical subassembly and a receiver optical subassembly as well as the positioning of electromagnetic radiation shielding on the chassis. In conjunction with an interface device on an electronic circuit board of a host device, the chassis supports electromagnetic radiation shielding which substantially encloses the sources of electromagnetic radiation within the module and suppresses the escape of electromagnetic radiation, thereby preventing electromagnetic interference with sensitive components and devices in proximity to the module.

System and method for automatically obtaining the connectivity status, or map, of a cabling system in data and / or voice networks are disclosed. A suitable retrofit kit for this purpose comprises a plurality of upgraded patch cords for replacement of respective used patch cords through which scanning signals are forwarded by a scanning system and a plurality of adapter panels attached to a respective patch panel that includes for a connectivity status indicator and an electrical contact for mating with the corresponding electrical scanning contact of an upgraded patch cord. Scanning signals received by an electrical contact are processed to generate data that represents the current connectivity status, or map, of the cabling system. A plurality of adapter plugs for initializing the scanning system by a first connectivity status, or map, is also provided. Cabling system management is effected with the first and current connectivity status, or map.

A patch panel mountable to a network rack includes a patch panel frame and rack mounting plates. The frame forms a central section having a longitudinal width sized to fit within the network rack. The rack mounting plates are provided on opposite longitudinal ends of the central section and allow the panel to be mounted to a network rack. The central section includes two panel sections angled outwardly in an inverted V-shapes, and the central section has mounted thereon a plurality of cable connectors that receive cabling on the front side and the rear side of the patch panel frame. Each connector has a horizontal axis.

An accommodation apparatus facilitates the attachment, exchange, operation, and wire configuration of a plurality of communication devices, such as a media converter, and a power unit. The accommodation apparatus comprises a support part fixed to an external frame, and a loading part, movable relative to the support part. The loading part removably accommodates the communication devices, and includes a first surface and a second surface, wherein the transmission medium can be connected to the communication devices through the first and second surfaces.

A battery cover latching assembly (50) for a portable electronic device (100) includes a housing (20), a first cover (10) configured for attaching to a first side of the housing, and a second cover (30) configured for attaching to a second side of the housing. The battery cover latching assembly includes a locking portion (131), a latch (342), and a button (40). The locking portion is formed on the first cover. The latch is formed on the second cover, the latch is engageable with the locking portion so as to lock the first cover and second cover with each other. The button is configured so as to be retained by the housing, the button is operable to deform the latch so as to unlock the first cover and the second cover.

A rack-mount server system of a liquid cooling system, in which a heat-generating component such as a CPU is cooled by a coolant has a plurality of server modules with heat-generating components which are cooled by the circulating coolant. The server modules are connected in parallel to a circulation coolant path through which the coolant to cool the server modules is circulated. In the middle of the coolant circulation path is a cooling unit that cools the coolant by radiating its heat to the outside air. Furthermore, a bypass route parallel to the server modules and going around the server modules is provided in the coolant circulation path, and the circulation quantity of the coolant is controlled in the bypass route. Alternatively, the flow quantity of the coolant is controlled in each of the server modules.

A modular server system includes a midplane having a system management bus and a plurality of blade interfaces on the midplane. The blade interfaces are in electrical communication with each other. A server blade is removeably connectable to one of the plurality of blade interfaces on the midplane. The server blade has a server blade system management bus in electrical communication with the system management bus of the midplane, and a network interface to connect to a network. A media blade is removeably connectable to one of the plurality of blade interfaces on the midplane, and the media blade has at least one storage medium device.

A tamper respondent module includes a basecard adapted to be inserted into a slot in a rack enclosure comprising at least one guide edge, at least one electrical coupler, a surface and at least one electronic component that contains information in an electronic format. In one example, an outer cover is coupled to the basecard and includes at least five sides. The outer cover is arranged in a covering relationship over the at least one electronic component. In another example, an anti-tamper apparatus is disposed between the outer cover and the surface. In another example, an anti-tamper circuit is electrically coupled to the at least one electronic component. In another example, a thermal frame is thermally coupled to the at least one electronic component.

A handheld computing device is disclosed. The handheld computing device includes a seamless enclosure formed from an extruded tube. The extruded tube includes open ends and internal rails which serve as a guide for slidably assembling an operational assembly through the open ends of the extruded tube, a reference surface for positioning the operational assembly relative to an access opening in the seamless enclosure, and a support structure for supporting the operational assembly during use.

A circuit board design is disclosed that is useful in high-speed differential signal applications uses either a via arrangement or a circuit trace exit structure. A pair of differential signal vias in a circuit board are surrounded by an opening that is formed within a ground plane disposed on another layer of the circuit board. The vias are connected to traces on the circuit board by way of an exit structure that includes two flag portions and associated angled portions that connect the flag portions to circuit board traces. In an alternate embodiment, the circuit board traces that leave the differential signal vias are disposed in one layer of the circuit board above a wide ground strip disposed on another layer of the circuit board.

A system and method for transferring heat from a terminal in a mobile communication system. The system comprises a circuit board mounted to a terminal body, in which a heat generating component is mounted, and a shield frame for shielding electromagnetic waves generated from the circuit board and supporting the circuit board. At least one heat radiating apparatus is installed between the heat generating component and the shield frame. The at least one heat radiating apparatus transfers heat generated by the heat generating component away from the circuit board and substantially directly to the shield frame. The heat transfer prevents an impact of the generated heat being transferred to the circuit board from the shield frame.

The enclosure includes a base section fabricated from a single piece of material, such as sheet metal, in which multiple design details are punched and formed. A cover section with tabs for inserting in slots formed in the base section is provided. A one-piece card cage including injector / ejector latching details and card guide rails is connected via welding or other means to the base section. An enabler assembly, including guide rails, is fastened to the card cage and configures the card cage into multiple adapter receiving cavities.

A ground pad structure for preventing solder extrusion and a semiconductor package having the ground pad structure are disclosed, wherein the ground pad structure has the ground pads located along the circumference of its ground plane be formed in a non-solder mask defined manner. Accordingly, a good grounding quality is maintained, and the occurrence of the electrical bridging among the adjacent conductive traces can be avoided as the extrusion of the molten solder bumps from the ground pads located along the ground pad structure's circumference toward their adjacent conductive traces is effectively prevented.

An integrated circuit device as a first IC chip, a second IC chip, and a circuit board having a hole formed therein that is large enough to permit the second IC chip to be accommodated therein. The first and second IC chips are bonded together so as to be electrically connected together, and the first IC chip is mounted on the circuit board with the second IC chip accommodated in the hole formed in the circuit board. Here, one of the IC chips forming a chip-on-chip structure is accommodated in the hole formed in the circuit board, making further thickness reduction possible. Moreover, the obverse surfaces of the IC chips are located closer to the circuit board, making possible wireless mounting of the IC chips, despite forming a chip-on-chip structure, on the circuit board through connection using bumps. This helps reduce trouble due to inductance in a circuit that handles a high-frequency signal.

In resin-molded engine control unit, a coil, an electrolytic capacitor, a microprocessor, electronic parts and a connector terminal are mounted on a board. Inside a cover fixed on the board, a resin-free region is formed. The coil, the electrolytic capacitor and the microprocessor, which should not be sealed with resin, are mounted in the resin-free region, while the board and the electronic parts which are not capped by the cover are sealed with a resin.

In a slide hinge for a small-sized information terminal composed of a first casing and a second casing, to achieve a slide hinge having a function of relatively and automatically sliding the first casing and the second casing from predetermined slide positions, a slide hinge in which a first casing provided with a keyboard portion and a second casing provided with a display portion are relatively slid includes: a linear slide means provided between the first casing and the second casing; and a turning means for performing a turning operation accompanying linear slide operations of the first casing and the second casing by the slide means, the turning means being configured to generate rotation torque from a predetermined turning angle so that the first casing and the second casing automatically and relatively slide in an opening direction and / or a closing direction depending on the slid position thereof.

The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The network of grounded conductive elements are coupleable to a grounded layer and to the EMI shield and provides improved EMI shielding through the volume of the printed circuit board below an electronic component mounted on the printed circuit board.

A patch panel mountable to a network rack includes a patch panel frame and rack mounting plates. The frame forms a central section having a longitudinal width sized to fit within the network. The rack mounting plates are provided on opposite longitudinal ends of the central section and allow the panel to be mounted to a network rack. The central section includes two panel sections angled outwardly in an inverted V-Shape, and the central section has mounted thereon a plurality of cable connectors that receive cabling on the front side and the rear side of the patch panel frame. Each connector has a horizontal axis.

A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.

An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.

There is provided a portable communication device for minimizing the SAR of electromagnetic waves. In the portable communication device, a slim upper housing has an FBC on which a keypad is mounted, a lower housing is vertically spaced from the slim upper housing by a predetermined distance and includes a PCB assembly, and a middle housing is positioned between the slim upper housing and the lower housing, spatially isolated from the lower housing by a separation plate to minimize the adverse effects of electromagnetic waves generated from the PCB assembly, and has a slot opened from the front end to hold an object in the lengthwise direction. A sliding battery pack is insertable to and detachable from the middle housing in the lengthwise direction.

An anchoring member and related method are disclosed for substantially parallel assembly of two additional daughter printed circuit boards (PCB) and heat sink on each side of main of mother PCB, and to retain a predetermined mating distance thereto to retain a predetermined mating distance thereto. The anchoring member comprises an elongated body extending in a longitudinal direction and having a first coupling member on one end for coupling the first daughter board in a substantially perpendicular orientation to the longitudinal direction on a first side of the mother board. The elongated body also comprises a second coupling member at the opposite end from the elongated body from the first coupling member for coupling the second daughter board in a substantially perpendicular orientation to the longitudinal direction on a second side of the mother board. The elongated body also has a positioning flange for positioning the elongated body in an aperture of the mother board at an inserted position and a friction fit surface for interacting with the aperture of the mother board to secure the elongated body in the inserted position.