2400results about "Soldered/welded conductive connections" patented technology

A window pane has a substrate formed from glass and includes an electrical device including an electrical conductor. An electrical connector is operatively connected to and in electrical communication with the conductor for transferring electrical energy to the conductor. An electrical connector is bonded to the electrical conductor and has a first interacting portion. A terminal is disposed adjacent to the electrical connector and has a second interacting portion for interacting with the first interacting portion to mechanically couple the electrical connector and the terminal. The substrate has a first coefficient of thermal expansion and the connector has a second coefficient of thermal expansion. A difference between the first and second coefficients of thermal expansion is equal to or less than 5×10⁻⁶/° C. Due to the mechanical coupling between the connector and the terminal, the terminal and connector are less prone to bending, breakage, or delamination than conventional connector structures.

To provide a suspension board with circuit that enables its terminals to be bonded to the other terminals with sufficient strength with simple structure, to ensure sufficient bonding reliability, the suspension board with circuit 11 includes a suspension board 12, a base layer 13 formed on the suspension board 12, and a conductive layer 14 formed on the base layer 13 and a cover layer 18 with which the conductive layer 14 is covered, wherein external connection terminals 17 to be bonded to terminals 28 of a read/write board 29 are formed without the suspension board 12 and/or the base layer 13 being formed.

A lead for an electronic device which resists the induction of a current from an electromagnetic field external to said lead includes one or more pairs of adjacent segments of electrical wire, each of the pairs including a first segment of electrical wire and a second segment of electrical wire. The lead also includes one or more shielded RF chokes, wherein each of the shielded RF chokes is provided between the first segment of electrical wire and the second segment of electrical wire of a respective one of the one or more pairs of adjacent segments. Also, an implantable device that includes a generator for generating one or more electrical pulse and a lead as described for delivering the pulses to tissue within a patient's body. A method for making the described implantable device is also provided.

In a structure 21 for connecting an electric wire and a connecting terminal in the invention, a ductile metal film 29 is formed in advance on an inner surface of a conductor caulking portion 24 of a crimp terminal 22 by such as plating, vacuum deposition, or adhesion. Then, the conductor caulking portion 24 in the rear portion of the crimp terminal 22 is caulked onto core wire portions M in a state of being stripped and extended in the axial direction from an end of a sheathed wire W to thereby establish connection. Subsequently, the metal film 29 is fused on heating. Accordingly, the ductile metal film 29 enters gaps between the inner surface of the conductor caulking portion 24 and the core wire portions M and between adjacent ones of the core wire portions M by the caulking stress. Hence, the area of contact between the conductor caulking portion 24 and the core wire portions M via the metal film 29 increases, and conductivity improves, thereby making it possible to suppress heat generation.

The present invention is directed to a power supply apparatus in which a battery and a circuit wiring board or boards are electrically connected by using lead terminals. The lead terminal (3) is adapted so that thickness of a welding portion (3a) is caused to be thinner than the thickness of a conductive portion (3b). Thus, current for welding flows to much degree in a thickness direction so that electric resistance of the welding portion becomes large, and heat based on the electric resistance also becomes large. From this fact, welding nugget (63) can be enlarged. As the result of the fact that large welding nugget is formed, the lead terminals are welded to terminal portions (37a) of the battery (2) with high reliability.

A bonded member including a ceramic base material 1 and a metallic member 7 which are bonded together, wherein a solder material 5 comprising Au is disposed on the surface of the ceramic base material 1 via an active metal layer, the active metal layer and the solder material 5 are molten by heating so as to form a precoat layer 6, the metallic member 7 is disposed on the surface of the precoat layer 6 via an insertion metal layer comprising pure metal which may form an alloy having a lower melting point than Au with Au or an alloy of the pure metal and Au, and the insertion metal layer and at least a portion in the vicinity of the interface between the insertion metal layer and the precoat layer 6 are molten by heating to bond the metallic member 7 and the precoat layer 6.

Electrical connector housings are formed of a conductive loaded resin-based material which provides superior protection from EMI and RFI by absorbing such interfering signals. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination thereof, in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 40% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

A method of connecting a terminal fitting and an electric wire, includes the steps of: providing a terminal fitting; providing an electric wire in which a core wire is covered with an insulating sheath; providing a conductive connecting member formed with an insertion hole; inserting the electric wire into the insertion hole of the connecting member; compressing the connecting member radially inwardly so as to caulk an inserted portion of the electric wire uniformly over a whole periphery thereof; and welding the connecting member and the terminal fitting by applying ultrasonic wave.

A cable end connector assembly (1) includes an insulative housing (2), a number of contacts (3) assembled to the insulative housing in a back-to-front direction, a shielding member (5) assembled to the insulative housing, a cable (6) including a number of signal conductors (62) and drain wires (64) respectively soldered with the contacts, and an insulative cover (7) over-molding rear portions of the insulative housing and the shielding member and a front end of the cable. The housing includes an upper wall (21), a lower wall (22) and a pair of sidewalls (23) connecting with the upper and the lower walls. The shielding member includes a first and a second shielding halves (51, 52) respectively attached to the upper wall and the lower wall of the insulative housing.

The present invention is intended to provide a glass article with a metal member joined thereto in which an electroconductive coating film is formed on at least a part of the surface of the glass article by baking a silver paste that includes Ag particles and a glass frit, a joining plane of the metal member is fixed onto the electroconductive coating film with a lead-free solder alloy containing Sn as a main component, and the lead-free solder alloy contains at least 1.5 mass % of Ag, which prevents the appearance of the electroconductive coating film and the bonding strength from degrading. Furthermore, in the present invention, when using a metal member having at least two joining planes, the total area of the joining planes is set within a range of 37 mm² to 50 mm², which allows high bonding strength between the glass article and metal member to be maintained while using the lead-free solder alloy. Moreover, in the present invention, the volume of the lead-free solder alloy to be provided on each joining plane is set to be 1.0 to 2.0 times the product of the area of the joining plane concerned and the thickness of the lead-free solder alloy, which prevents cracks from occurring in the glass article.

An electrical connector includes a connector body, a plurality of cores and a plurality of electrically conductive contacts disposed in the cores of the connector body. Each of the contacts includes a fusible member attached thereto. Each of the fusible members includes an intermediate portion and two support members disposed on opposite sides of the intermediate portion. The support members are arranged to hang down below a tail portion of the contacts.

A terminal for a coaxial cable includes an electrically conductive core mounted in a dielectric member. The dielectric member along with the conductive core are positioned within an electrically conductive ground shield. The ground shield includes two identical split-barrel housing members which are joined together. When joined, the housing members form a cylindrical channel having surfaces which intimately contact an exposed length of cable outer conductor layer, creating a conductive connection between the outer conductor layer and the ground shield and structurally maintaining the outer conductor layer concentric to the dielectric sheath and inner conductor of the cable.

A method and structure for a solder interconnection, using solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate is disclosed. After a solder ball has been formed using standard methods it is reflowed to give the solder ball a smooth surface. A layer of low melting point metal, such as, bismuth, indium or tin, preferably, pure tin, is deposited on the top of the solder balls. This structure results in localizing of the eutectic alloy, formed upon subsequent low temperature joining cycle, to the top of the high melting solder ball even after multiple low temperature reflow cycles. This method does not need tinning of the substrate to which the chip is to be joined, which makes this method economical. It has also been noticed that whenever temperature is raised slightly above the eutectic temperature, the structure always forms a liquid fillet around the joint with copper wires. This liquid fillet formation results in substantial thermal fatigue life improvement for reduced stress at interface; and secondly, provides an easy means to remove chip for the purpose of chip burn-in, replacement or field repairs.

An electrical connector (100) adapted for electrically connecting an electronic element (1) such as a camera module with a substrate (200) comprises a shielding member (2, 3), an insulated housing (5) and a number of contacts (4) retained in the housing. Each contact comprises a contact portion (41) for electrically contacting with the camera module and a solder portion (44) extending out the housing for being soldered on the substrate. The shielding member surrounds the housing to prevent the contact from unexpected Electro Magnetic Interference and comprises a plurality solder legs soldered on the substrate. The solder legs are arranged among the solder portions of the contacts. Typically, the distance between every two adjacent solder legs is not greater than 2.5 millimeters. Therefore, the shielding member can effectively prevents various unexpected interference affecting signal transmission of the camera module.