7109results about How to "Reduce cracking" patented technology

Catalyst compositions comprising a first metallocene compound, a second metallocene compound, an activator-support, and an organoaluminum compound are provided. An improved method for preparing cyclopentadienyl complexes used to produce polyolefins is also provided.

Catalyst compositions comprising a first metallocene compound, a second metallocene compound, an activator-support, and an organoaluminum compound are provided. Methods for preparing and using such catalysts to produce polyolefins are also provided. The compositions and methods disclosed herein provide ethylene polymers having a HLMI of from about 0.5 to about 25, a polymer density of from about 0.920 to about 0.965, and a polydispersity of from about 3.0 to about 30.

An adhesive tape having an adhesive layer formed on one side of a substrate layer, which renders it possible to minimize the extent of development of chipping or fragmentation (nicks) or crack in chip when the silicon wafer, to which this tape is adhered, is cut into chips using a dicer. The adhesive layer of the tape has a storage modulus G′ of 1 MPa or more at a temperature of 15 to 35° C., and preferably tan δ as represented by the ratio of a loss modulus G″ to the storage modulus G′ is 0.05 or less. The adhesive layer is preferably constructed principally of an olefin polymer.

There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and / or utilize the side surface of an assembled flexible display.

Semiconductor light emitting devices, such as light emitting diodes, include a substrate, an epitaxial region on the substrate that includes a light emitting region such as a light emitting diode region, and a multilayer conductive stack including a reflector layer, on the epitaxial region. A barrier layer is provided on the reflector layer and extending on a sidewall of the reflector layer. The multilayer conductive stack can also include an ohmic layer between the reflector and the epitaxial region. The barrier layer further extends on a sidewall of the ohmic layer. The barrier layer can also extend onto the epitaxial region outside the multilayer conductive stack. The barrier layer can be fabricated as a series of alternating first and second sublayers.

The present invention relates to identification documents and smart cards. In one implementation, we provide a smart identification document including a document core. The document core is printed and laminated. The laminated core is milled to create a cavity. An integrated circuitry module is provided in the cavity. In one implementation, the cavity includes an upper cavity and a lower cavity. A laminate layer houses the upper cavity while the lower cavity extends into the document core. The upper cavity's aperture exceeds the aperture of the lower cavity resulting in a ledge in the laminate layer. A portion of the module may rest on the ledge, while another portion of the module may extend into the lower cavity. In another implementation, we provide a contactless smart card including a multi-layered structure. The structure includes a carrier layer including the smart card electronics. The carrier can be permeable (like a mesh or scrim) so that additional layers may be laminated into or through the carrier layer. A multi-layer structure provides a enhanced durability and helps protect the smart card electronics. In still another implementation, we provide a PET-based identification document. The PET-based document includes favorable durability and earth-friendly characteristics.

In one embodiment, a pad is formed on a substrate surface. The pad is connected with a connecting pattern. A first mask is formed on the substrate. The first mask has a first opening exposing at least a portion of the pad and a portion of the connecting pattern. A second mask is formed on the first mask. The second mask has a second opening exposing at least a portion of the pad and a portion of the connecting pattern. A boundary surface or sidewall of the first opening is not coplanar with a boundary surface or sidewall of the second opening. Therefore, stresses may be prevented from concentrating on the boundary surface of the first opening, thereby allowing dispersion of the stresses and restraining pattern cracks.

On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.

A honeycomb structural body comprising: a pillar-shaped ceramic block and a sealing material provided on an outer peripheral portion of said ceramic block, each of them having irregularities formed on an outer peripheral face wherein: when a least square curve is determined by a least square method on the basis of points constituting the contour of a cross-section, a center-of-gravity is defined as c1, a distance between a minimum concentric circumscribed curve having c1 and the center-of-gravity c1 is defined as D1, a distance between a maximum concentric inscribed curve having c1 and the center-of-gravity c1 is defined as D2, and the following inequality is satisfied: about 0.3 mm≦(D1-D2); same definition is applied to said ceramic block, a center-of-gravity thereof is defined as c2, a distance between a minimum concentric circumscribed curve having c2 and the center-of-gravity c2 is defined as D3, a distance between a maximum concentric inscribed curve having c2 and the center-of-gravity c2 is defined as D4, and the following inequality is satisfied: about 0.5 mm≦(D3-D4)≦about 7.0 mm.

Paroxysmal nocturnal hemoglobinuria or other hemolytic diseases are treated using a compound which binds to or otherwise blocks the generation and / or the activity of one or more complement components, such as, for example, a complement-inhibiting antibody.

The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.