The invention discloses a high-precision stepped crimping hole processing method, which comprises the following steps: Step 1, punching a positioning hole; Step 2, measuring expansion and contraction for the first time; Step 3, positioning the first pin; Step 4, passing Mechanically drill through holes; step 5, perform controlled depth drilling to obtain controlled depth drilled holes, the depth of controlled depth drilled holes is the depth of the target conduction layer, and the controlled depth drilled holes are the inner diameter of the target through hole; step 6, sink copper; Step seven, electroplating; step eight, forming electroplating PIN holes after electroplating the positioning holes, and testing the size of electroplating PIN holes; step nine, positioning through the second pin nails and electroplating PIN holes matched with electroplating PIN holes; Drill to get backdrilled drill holes. The invention reduces the influence of positioning point deviation and improves the position accuracy of back drilling; the tool diameter of back drilling only needs to be increased by 0.025mm to 0.1mm relative to depth control drilling, which avoids the large diameter of conventional back drilling. The waste of space; the allowable deviation accuracy of the finished hole position is less than the copper thickness of the hole, ensuring that the crimping hole is a through hole.