The present invention is intended to provide a glass article with a
metal member joined thereto in which an electroconductive
coating film is formed on at least a part of the surface of the glass article by baking a
silver paste that includes Ag particles and a glass
frit, a joining plane of the
metal member is fixed onto the electroconductive
coating film with a lead-free
solder alloy containing Sn as a main component, and the lead-free
solder alloy contains at least 1.5
mass % of Ag, which prevents the appearance of the electroconductive
coating film and the
bonding strength from degrading. Furthermore, in the present invention, when using a
metal member having at least two joining planes, the total area of the joining planes is set within a range of 37 mm2 to 50 mm2, which allows high
bonding strength between the glass article and metal member to be maintained while using the lead-free
solder alloy. Moreover, in the present invention, the volume of the lead-free solder
alloy to be provided on each joining plane is set to be 1.0 to 2.0 times the product of the area of the joining plane concerned and the thickness of the lead-free solder
alloy, which prevents cracks from occurring in the glass article.