Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

3195results about How to "Reliable electrical connection" patented technology

Nanowire structures comprising carbon

ActiveUS20070212538A1Low costImproved electrical connectivity and stabilityElectric discharge heatingFuel cells groupingNanometreMembrane configuration
The present invention is directed to nanowire structures and interconnected nanowire networks comprising such structures, as well as methods for their production. The nanowire structures comprise a nanowire core, a carbon-based layer, and in additional embodiments, carbon-based structures such as nanographitic plates consisting of graphenes formed on the nanowire cores, interconnecting the nanowire structures in the networks. The networks are porous structures that can be formed into membranes or particles. The nanowire structures and the networks formed using them are useful in catalyst and electrode applications, including fuel cells, as well as field emission devices, support substrates and chromatographic applications.
Owner:ONED MATERIAL INC

Thermal enhance MCM package and manufacturing method thereof

A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity. The cavity not only accommodates the first package, the first carrier, the second package, the second carrier and the intermediate substrate but also provides alignment mechanism by the supporting portion and the alignment portion to prevent the dislocation after all the components of the thermal enhance MCM package are connected with each other. Furthermore, the first carrier has a first side and the second carrier has a second side. The first side and the second side both have grounding portions, for example recessed portions and metal layers, for providing a ground shielding of the first package and the second package against the outside. In addition, the grounding portions also provide thermal paths to increase the ability of the heat dissipation. Besides, a method for manufacturing the thermal enhance MCM package is provided.
Owner:ADVANCED SEMICON ENG INC

Module fabrication of solar cells with low resistivity electrodes

ActiveUS20150270410A1Facilitating cell-level MPPTFacilitatingPV power plantsPhotovoltaic energy generationMetal gridBusbar
One embodiment of the present invention provides a solar module. The solar module includes a front-side cover, a back-side cover, and a plurality of solar cells situated between the front- and back-side covers. A respective solar cell includes a multi-layer semiconductor structure, a front-side electrode situated above the multi-layer semiconductor structure, and a back-side electrode situated below the multi-layer semiconductor structure. Each of the front-side and the back-side electrodes comprises a metal grid. A respective metal grid comprises a plurality of finger lines and a single busbar coupled to the finger lines. The single busbar is configured to collect current from the finger lines.
Owner:TESLA INC

Cartridge and printing material supply system

A cartridge comprises an ink supply structure, a terminal bearing structure, and a first restriction portion. The terminal bearing structure has terminals arranged in a terminal plane which is neither parallel nor perpendicular to a plane defined by a mounting direction leading edge of the ink supply structure, so that the contact portions of the terminals receive a force in a direction opposite from the mounting direction. An engagement portion of the first restriction portion is provided at a position adjacent to the terminal bearing structure.
Owner:SEIKO EPSON CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products