47results about How to "Ensure coplanarity" patented technology

A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

A header assembly includes an insulative housing comprising a plurality of walls defining an interior cavity, and a plurality of contacts within said cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulating housing comprises at least one alignment rib extending on an exterior surface thereof. The contacts are formed to abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

A shield terminal (20) includes an inner conductor terminal (21) and an outer conductor terminal (22) surrounding the inner conductor terminal (21). The outer conductor terminal (21) has a pull-out opening (46) through which an inner conductor connecting piece (26) of the inner conductor terminal (21) is pulled toward a circuit board (90). The outer conductor terminal (22) includes outer conductor connecting pieces that face the pull-out opening (46) and that include first and second outer conductor connecting pieces (53, 54) located on both sides across the inner conductor connecting piece (26) in a plan view and a third outer conductor connecting piece (42) that faces the inner conductor connecting piece (26) in a direction orthogonal to an arrangement direction of the first and second outer conductor connecting pieces (53, 54) at a position between the first and second outer conductor connecting pieces (53, 54) in the arrangement direction.

The invention provides a belted layer transferring ring. The belted layer transferring ring comprises a fixed disc, a driving disc, clamping claw brackets, clamping claws and an air cylinder, wherein one end of the air cylinder is fixed on a base, and the other end of the air cylinder is fixed on the driving disc to be used for driving the driving disc to rotate back and forth; and the driving disc drives the clamping claw brackets and the clamping claws to retract along the radial direction by using a connection rod mechanism. According to the belted layer transferring ring with the structure, the clamping claws can move synchronously; and meanwhile, the coplanarity of the end faces of the clamping claws is guaranteed, the transferring precision of a belted layer and a crown is improved, and the tire forming quality is guaranteed. Furthermore, the quantity of magnetic switches on the air cylinder is increased, so that the accuracy and safety of the air cylinder are guaranteed; one air cylinder is used, so that the cost is saved; and meanwhile, the structures of the clamping claws are improved, and the replacement speeds of the clamping claws with different specifications are improved, so that the time is saved.

A method for manufacturing an electrical connector comprising a plurality of conductive terminals and a metal frame by insert molding, comprising presetting a core composed of conductive terminals and a metal frame into a mold cavity, wherein the metal frame includes a mounting surface and a plugging surface perpendicular to the mounting surface, and the conductive terminal includes a contact portion and a solder tail that are parallel to the mounting surface and the plugging surface of the metal frame respectively; The direction of the installation surface is inserted into the gap between two adjacent contact parts from the free end of the contact part of the conductive terminal to maintain a certain distance between the contact parts of each conductive terminal, and to move the removable second fixer along the direction of the metal The direction of the frame insertion surface is inserted from the free end of the welding tail of the conductive terminal into the gap between two adjacent welding tails, so as to keep the tails of each conductive terminal on the same plane; then inject a molten resin into the mold cavity, The molten resin forms an insulating shell on the peripheral surface of the core, which can combine the conductive terminal group and the metal frame and cover part of its area.

A board connector (10) has a tubular housing (20) that includes a back wall (25) with penetrating through holes (26). A terminal fitting (60) includes a tab (61) to be arranged to project into the housing (20) through the through hole (26), a press-fit portion (62) to be arranged inside the through hole (26) and a lead portion (63) to be arranged along a surface of a board (90). The press-fit portion (62) is inserted into the through hole (26) with an overlapping margin in a cross-section along a height direction in which the lead portion (63) faces the surface of the board (90). The tab (61) is inserted into the through hole (26) without any overlapping margin in the same cross-section.

The invention provides a weld leg component, an arrayed weld leg module and a key component. The key component includes a base. The weld leg component includes a support and weld leg, wherein the support is connected with the base; one end of the weld leg is connected with the support, and the other end of the weld leg is bent away from the base and extended below the support; the weld leg and thesupport are at least partially overlapped relative to the projection of the base; the support can support the weld leg; chances for the weld leg to deform are slimmed; weld leg coplanarity is effectively ensured at the premise of not greatly increasing the manufacture difficulty; key component fitting effect is improved.

The invention discloses a method for manufacturing a large-scale integrated circuit lead frame, which overcomes the defect of lower index qualification rate of the coplanarity and the displacement of pins of a lead frame manufactured in the prior art. The method comprises the following steps: (1) continuously stamping: continuously stamping a zone ring with a lead frame original blank on a die; (2) continuously electroplating: electroplating the zone ring with the lead frame original blank, wherein the electroplating area comprises the root welding area of the pins and the front surface of the chip island; and (3) slicing and confirming the size: cutting and flaking the electroplated zone ring to obtain a single plate lead frame piece, wherein in the step of continuous stamping, a connecting rib for connecting the end parts of a plurality of pins at each side into a whole is retained at one end of the pins in the lead frame original blank approaching to the four sides of the chip island, and in the step of slicing and confirming the size, when the zone ring is cut and the size is confirmed, the connecting rib of the end parts of the pins approaching to the four sides of the chip island is also cut off to obtain a finished lead frame. The invention can greatly improve the qualification rate of the coplanarity and the displacement of the pins of the finished lead frame.