47results about How to "Ensure coplanarity" patented technology

A header assembly includes an insulative contact housing having a plurality of walls defining an interior cavity and an insulative alignment housing having at least one alignment rib extending on an exterior surface thereof. The alignment housing is separately provided and independently mounted to the contact housing. A plurality of contacts are included within the cavity and extend through one of the walls to an exterior of the contact housing wherein the contacts flex against the alignment housing and abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

A header assembly includes an insulative housing comprising a plurality of walls defining an interior cavity, and a plurality of contacts within said cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulating housing comprises at least one alignment rib extending on an exterior surface thereof. The contacts are formed to abut the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

The invention relates to a sandwich packaging technique for preventing a chip from deviating. The sandwich packaging technique comprises the following steps: (1) providing a first lead frame; (2) coating an island region of the first lead frame with a solder paste; (3) implanting the chip into the first lead frame; (4) providing a second lead frame; (5) coating the second lead frame with the solder paste; (6) laminating the second lead frame on the chip on the upper surface of the first lead frame to form an overall frame; (7) pressing the upper surface and the lower surface of the overall frame formed in the step (6) with pressure plates and carrying out reflow soldering; (8) carrying out plastic packaging on the overall frame which is subjected to reflow soldering in the step (7); and (9) carrying out cutting or punching operation on a semi-finished product which is subjected to plastic packaging in the step (8), cutting or punching an original array-type plastic package body for separation, so as to prepare a sandwich package structure for preventing the chip from deviating. The sandwich packaging technique has the beneficial effect that the thickness, the area and the position of the solder paste can be easily controlled.

A shield terminal (20) includes an inner conductor terminal (21) and an outer conductor terminal (22) surrounding the inner conductor terminal (21). The outer conductor terminal (21) has a pull-out opening (46) through which an inner conductor connecting piece (26) of the inner conductor terminal (21) is pulled toward a circuit board (90). The outer conductor terminal (22) includes outer conductor connecting pieces that face the pull-out opening (46) and that include first and second outer conductor connecting pieces (53, 54) located on both sides across the inner conductor connecting piece (26) in a plan view and a third outer conductor connecting piece (42) that faces the inner conductor connecting piece (26) in a direction orthogonal to an arrangement direction of the first and second outer conductor connecting pieces (53, 54) at a position between the first and second outer conductor connecting pieces (53, 54) in the arrangement direction.

The invention relates to a multi-chip and multi-shingle stacked sandwich package structure with exposed frames and a technique of the multi-chip and multi-shingle stacked sandwich package structure. The method comprises the following steps: (1) providing a first lead frame; (2) coating the first lead frame with a tin paste; (3) implanting a first chip into the tin paste of the first lead frame; (4) providing a second lead frame, coating the second lead frame with the tin paste; (5) laminating the second lead frame on the first chip; (6) carrying out reflow soldering; (7) coating the second lead frame with the tin paste; (8) implanting a second chip into the second lead frame; (9) providing a third lead frame, coating the third lead frame with the tin paste; (10) laminating the third lead frame on the second chip; (11) carrying out reflow soldering; (12) carrying out plastic packaging with a molding compound; and (13) carrying out a cutting or punching operation. The multi-chip and multi-shingle stacked sandwich package structure with the exposed frames have the beneficial effects that the heat dissipating ability of a product is increased; and the package resistance of the product is reduced.

The invention provides a differential screw height-adjustable LED (light emitting diode) lamp base and a T-shaped calibrating form board using the same, relates to a vision calibrating form board, and belongs to the technical field of vision measurement. The differential screw height-adjustable LED lamp base consists of a height-adjustable lamp base body, a fixed seat, an adjusting sleeve, a shell and an anti-rotating spring. On the premise that LED spots do not rotate, the LED spots are only adjusted along a vertical direction of a coplane by 0.5mm when the adjusting sleeve rotates at an angle of 360 degrees, and if instruments such as a high-precision coordinate measuring machine and the like are adopted, 5-micrometer coplane adjusting precision of the LED spots can be achieved by manually adjusting the adjusting sleeve. The calibrating form board comprises a planar T-shaped calibrating form board structure consisting of five coplanar infrared LED spots. The differential screw height-adjustable LED lamp base and the T-shaped calibrating form board using the same are suitable for the field of vision measurement on camera parameter calibration by using the form board.

The invention provides a belted layer transferring ring. The belted layer transferring ring comprises a fixed disc, a driving disc, clamping claw brackets, clamping claws and an air cylinder, wherein one end of the air cylinder is fixed on a base, and the other end of the air cylinder is fixed on the driving disc to be used for driving the driving disc to rotate back and forth; and the driving disc drives the clamping claw brackets and the clamping claws to retract along the radial direction by using a connection rod mechanism. According to the belted layer transferring ring with the structure, the clamping claws can move synchronously; and meanwhile, the coplanarity of the end faces of the clamping claws is guaranteed, the transferring precision of a belted layer and a crown is improved, and the tire forming quality is guaranteed. Furthermore, the quantity of magnetic switches on the air cylinder is increased, so that the accuracy and safety of the air cylinder are guaranteed; one air cylinder is used, so that the cost is saved; and meanwhile, the structures of the clamping claws are improved, and the replacement speeds of the clamping claws with different specifications are improved, so that the time is saved.

The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.

A method for manufacturing an electrical connector comprising a plurality of conductive terminals and a metal frame by insert molding, comprising presetting a core composed of conductive terminals and a metal frame into a mold cavity, wherein the metal frame includes a mounting surface and a plugging surface perpendicular to the mounting surface, and the conductive terminal includes a contact portion and a solder tail that are parallel to the mounting surface and the plugging surface of the metal frame respectively; The direction of the installation surface is inserted into the gap between two adjacent contact parts from the free end of the contact part of the conductive terminal to maintain a certain distance between the contact parts of each conductive terminal, and to move the removable second fixer along the direction of the metal The direction of the frame insertion surface is inserted from the free end of the welding tail of the conductive terminal into the gap between two adjacent welding tails, so as to keep the tails of each conductive terminal on the same plane; then inject a molten resin into the mold cavity, The molten resin forms an insulating shell on the peripheral surface of the core, which can combine the conductive terminal group and the metal frame and cover part of its area.

A board connector (10) has a tubular housing (20) that includes a back wall (25) with penetrating through holes (26). A terminal fitting (60) includes a tab (61) to be arranged to project into the housing (20) through the through hole (26), a press-fit portion (62) to be arranged inside the through hole (26) and a lead portion (63) to be arranged along a surface of a board (90). The press-fit portion (62) is inserted into the through hole (26) with an overlapping margin in a cross-section along a height direction in which the lead portion (63) faces the surface of the board (90). The tab (61) is inserted into the through hole (26) without any overlapping margin in the same cross-section.

The invention provides a weld leg component, an arrayed weld leg module and a key component. The key component includes a base. The weld leg component includes a support and weld leg, wherein the support is connected with the base; one end of the weld leg is connected with the support, and the other end of the weld leg is bent away from the base and extended below the support; the weld leg and thesupport are at least partially overlapped relative to the projection of the base; the support can support the weld leg; chances for the weld leg to deform are slimmed; weld leg coplanarity is effectively ensured at the premise of not greatly increasing the manufacture difficulty; key component fitting effect is improved.

The invention discloses a method for preparing wafers having bumps with different diameters. The method includes the following steps: for wafers having the bumps with the same composition and different diameters, adopting a small-opening ball placing net plate to complete the placing of a small-sized solder ball first, and then switching to a large-opening ball placing net plate to complete the placing of a large-sized solder ball, and performing uniform refluxing on the whole wafers; and for the wafers having the bumps with different compositions and different diameters, adopting a small-opening ball placing net plate to complete the placing and refluxing of a small-sized solder ball first, and then switching to a large-opening ball placing net plate to complete the placing and refluxingof a large-sized solder ball. According to the scheme of the invention, the bumps with various diameters and different compositions can be prepared on the same wafer by switching the ball placing netplates, and thus the advantages of simple process, high yield and high reliability can be achieved.

The invention belongs to the technical field of organic photovoltaics, in particular to a class of A-D-D'-A type asymmetric organic photovoltaic acceptor materials and applications thereof. Alkoxyindenothiophene and cyclopentadienodithiophene double-electron donor (D-D') units are used to jointly construct a skeleton containing non-covalent bond configuration locks, and 3-( Dicyanomethylene)inden-1-one modifies its terminus. Acceptors containing only simple fused rings have many advantages such as coplanar framework, low energy disorder and J-aggregation tendency, and the optical bandgap of such asymmetric small molecule acceptors is controllable in the range of 1.30-1.45eV tuned, can be combined with most donor materials to construct efficient bulk heterojunction binary organic solar cells. When the donor material is polymer PM6, the energy conversion efficiency of the binary OSCs device is as high as 13.67%, the open circuit voltage is 0.85eV, E loss Only 0.50V.

The invention discloses a preparing method for a corrosion-resistant liquid cooling heat dissipation cold plate and aims at providing a cold plate preparing method which is free of tedious treatment before welding and has prominent corrosion-resistant capability and long-term work reliability. According to the technical scheme, the two sides of a bottom transverse pipe commonly communicated serve as the starting points respectively, two sets of parallel pipes are longitudinally arranged continuously in a bent manner, and the bending radius of bent circular arc rings on the two longitudinal sides is larger than the distance between every two parallel pipelines; the free ends of each set of parallel pipes are fixedly connected through respective connector flanges; and the two sets of parallel pipes are fixed, clamped and positioned through pipeline clamping tools which are longitudinally arranged at intervals, die positioning plates with screw holes are adopted, wax patterns wrapping runner titanium pipes and connector flange assemblies are clamped between the two die positioning plates, and the runner titanium pipes and the connector flange assemblies are put into a smelting furnace, and a rectangular flat plate is formed through lost foam casting. The preparing method solves the problem that during traditional cold plate welding, a welding seam is prone to cracking, and consequently a cooling agent leaks.

The invention discloses a method for manufacturing a large-scale integrated circuit lead frame, which overcomes the defect of lower index qualification rate of the coplanarity and the displacement of pins of a lead frame manufactured in the prior art. The method comprises the following steps: (1) continuously stamping: continuously stamping a zone ring with a lead frame original blank on a die; (2) continuously electroplating: electroplating the zone ring with the lead frame original blank, wherein the electroplating area comprises the root welding area of the pins and the front surface of the chip island; and (3) slicing and confirming the size: cutting and flaking the electroplated zone ring to obtain a single plate lead frame piece, wherein in the step of continuous stamping, a connecting rib for connecting the end parts of a plurality of pins at each side into a whole is retained at one end of the pins in the lead frame original blank approaching to the four sides of the chip island, and in the step of slicing and confirming the size, when the zone ring is cut and the size is confirmed, the connecting rib of the end parts of the pins approaching to the four sides of the chip island is also cut off to obtain a finished lead frame. The invention can greatly improve the qualification rate of the coplanarity and the displacement of the pins of the finished lead frame.

A T -type calibration template that uses the differential spiral lamp structure with the differential spiral lamp structure, which involves a visual calibration template, which belongs to the field of visual measurement technology.The invention provides a highly adjustable spiral spiral high LED lamp holder, and a T -shaped calibration template with the differential spiral lamp structure.The differential spiral lamp holders are composed of raising lamp holders, fixed seats, adjustments, shells, and anti -rotating spring. Under the premise of ensuring that the LED light spot does not rotate, the LED is achieved when the adjustment sleeve rotates 360 degrees 360 degrees.The light spots are adjusted by 0.5mm per vertical direction in the common surface. If the instrument and other instruments such as high -precision coordinate measuring machines are used, the co -adjustment accuracy of the LED light spot 5 microns can be achieved by manual adjustment and adjustment.The calibration template includes a plane T -type calibration template structure composed of 5 co -infrared LED light points.The present invention is suitable for the field of visual measurement in the use of the template for camera parameter calibration.