34results about How to "Low cost of mass production" patented technology

The invention belongs to the technical field of welding of contact assemblies, and in particular relates to a welding method of an industrial plug socket contact assembly including the following steps: (1) preparing solder, the solder is in the shape of an annular sheet, and its inner diameter is larger than that of a rivet contact nail foot diameter, and the outer diameter is smaller than the diameter of the rivet contact nail head; (2) Prepare welding electrodes, the material of the welding electrodes is three high graphite, the welding electrodes have two, and the ends of the two welding electrodes are set There are two grooves that match the outer circumference of the nickel-plated terminal; (3) Assembly: soak the nickel-plated terminal with flux, put the solder on the contact pin of the silver alloy copper-clad rivet, and then apply the silver alloy copper-clad The rivet contact pins are inserted into the positioning holes of the nickel-plated terminals soaked in flux to complete the assembly of the contact assembly; (4) Place the assembled contact assembly into the two matching welding electrodes so that the welding electrodes The end is 1-4mm away from the head of the rivet contact, and then resistance brazing is performed to finally complete the welding of the contact assembly.

The invention discloses a preparing method for a corrosion-resistant liquid cooling heat dissipation cold plate and aims at providing a cold plate preparing method which is free of tedious treatment before welding and has prominent corrosion-resistant capability and long-term work reliability. According to the technical scheme, the two sides of a bottom transverse pipe commonly communicated serve as the starting points respectively, two sets of parallel pipes are longitudinally arranged continuously in a bent manner, and the bending radius of bent circular arc rings on the two longitudinal sides is larger than the distance between every two parallel pipelines; the free ends of each set of parallel pipes are fixedly connected through respective connector flanges; and the two sets of parallel pipes are fixed, clamped and positioned through pipeline clamping tools which are longitudinally arranged at intervals, die positioning plates with screw holes are adopted, wax patterns wrapping runner titanium pipes and connector flange assemblies are clamped between the two die positioning plates, and the runner titanium pipes and the connector flange assemblies are put into a smelting furnace, and a rectangular flat plate is formed through lost foam casting. The preparing method solves the problem that during traditional cold plate welding, a welding seam is prone to cracking, and consequently a cooling agent leaks.

The present invention relates to the field of molecular immunology. Although conventional vaccines such as attenuated foot-and-mouth disease vaccines and inactivated vaccines currently used have good immunogenicity, there are problems such as strong virus virulence, incomplete virus inactivation, and live virus escape from the preparation factory. Unsafe factors have prompted people to seek a safer and more effective FMD vaccine. The present invention utilizes phage surface display technology to screen effective FMDV epitopes, and provides a molecular mimic peptide of O-type foot-and-mouth disease virus antigen epitope, and the present invention also provides that the mimic peptide can be used in the preparation of immunogen and porcine foot-and-mouth disease epitope peptide vaccine Applications. The FMDV epitope peptide vaccine of the present invention has the antigenicity of the target molecule without toxicity, is very safe, and has low cost in large-scale production, and has good economic and social benefits.

The invention relates to the technical field of biology, in particular to a silkworm Bmlp3 gene promoter represented by SEQ ID No.1. The promoter can be used for expressing an extrinsic protein in a fat body. The invention also comprises a preparation method of a microscopic injection carrier for expressing the extrinsic protein in the fat body of silkworms, which comprises: constructing a recombinant expression vector containing a silkworm Bmlp3 gene promoter and an expression cassette; and preparing the microscopic injection carrier. The Bmlp3 gene promoter can realize the expression of the extrinsic protein in a development period in which the fat body is the most developed. The method can realize the controllability of an expression period; the transgenosis-mediated by a transposons derived from pggBac has characteristics of high stability, high heritability and the like; and through continuous rearing, colony can be enlarged quickly, and a quantitative guarantee for purification of the EQ ID No.1. The promoter can be used for expressing an extrinsic protein is provided.

The invention discloses a vacuum insulation board with no fear of surface damage and a processing technology thereof. The vacuum insulation board comprises an inner vacuum structural layer and at least one outer vacuum structural layer wrapped outside the inner vacuum structural layer, wherein the inner vacuum structure layer is composed of an inner core plate and a high vacuum barrier film wrapped outside the inner core plate, the inner core plate inner vacuum structure layer is composed of the inner core plate and the high vacuum barrier film wrapped outside the inner core plate, the inner core plate is prepared from a material such as glass fibers through carding hot pressing or dispersion wet method and a vacuum process, the inner core plate and a getter material are placed into the high vacuum barrier film to be made into the inner vacuum structure layer through high vacuum heat sealing equipment, the outer vacuum structure layer is composed of the inner vacuum structure, an outercore plate and a high-vacuum barrier film wrapped outside the outer core plate, and the outer core plate is made of glass fiber and other materials through wet-process mixed dispersion through a vacuum forming process. The vacuum insulation board has the characteristics of being good in heat preservation effect, safe, light, simple in construction, and capable of opening holes and the like, and after the surface is damaged, no drum, no expansion, no water absorption, and good retention and heat insulation performance are reserved.

The invention relates to a processing technology of a vacuum heat insulation panel with installation holes and without fear of surface damage. The vacuum heat insulation panel includes an inner vacuum structure layer and at least one outer vacuum structure layer wrapped around it. The inner vacuum structure layer consists of an inner core board It is composed of a high-vacuum barrier film wrapped on the outside. The inner core board is made of glass fiber and other materials by combing hot-pressing or dispersing wet and vacuum processes. The inner vacuum structure layer is made of high-vacuum heat-sealing equipment; the outer vacuum The structural layer is composed of an outer core board and a high-vacuum barrier film wrapped outside it. The outer core board is made of glass fiber and other materials by mixing and dispersing wet method and vacuum forming process. The air-absorbing material can be embedded on the outer core board and then loaded into the outer core board. Inside the high-vacuum barrier film, the outer vacuum structure layer is made with high-vacuum heat-sealing equipment. The installation hole is separated from the core layer by a partition plate provided with a through hole. After the surface of the vacuum heat insulation board is damaged, it does not bulge, does not expand, does not absorb water, and can retain heat preservation and heat insulation performance.

The invention relates to an SF6 breaker state monitoring method and a thionyl fluoride gas concentration monitoring device, wherein the method is used for detecting the concentration of thionyl fluoride which is the decomposer of SF6 in an SF6 breaker, and the state of the SF6 breaker is judged by the concentration of the thionyl fluoride. The monitoring device which implements the above method comprises an information acquisition and processing unit and a processing unit, wherein the information acquisition and processing unit comprises a sensor module, a current-to-voltage conversion module and an analog-to-digital conversion module are connected in sequence, the processing unit is a controller, and the output end of the analog-to-digital conversion module is connected with the input end of the controller. The gas concentration monitoring device provided by the invention has the advantages of small size, low cost and lower cost especially in mass production and is easy to carry. The device also can well and easily detect the gas concentration, is suitable for practical engineering application, and has high detection accuracy, wide detection range and good electromagnetic disturbance resistance.