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8885results about How to "Improve heat transfer performance" patented technology

Q: How to Improve heat transfer performance?

Electrosurgical generator,Selectively adjustable cardiac valve implants,Balanced chilled fluid cooling system for a data center in a shipping container,Adjustable cardiac valve implant with coupling mechanism,Substrate processing apparatus

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Electrosurgical generator

ActiveUS7195627B2High peak power capabilityReduces delay and unwanted coagulation effectSurgical instruments for heatingPeak valueContinuous wave

An electrosurgical generator for supplying RF power to an electrosurgical instrument for cutting or vaporising tissue has an RF output stage with RF output devices, a series-resonant output network and an RF output. The generator offers improved cutting and vaporising performance, especially in relation to the reliability with which an arc can be struck when presented with an initial load impedance load. This is achieved by virtue of the output stage being capable of maintaining output pulses of at least 1 kW peak by supplying the RF output devices from a large reservoir capacitor. An appropriate combination of cutting performance and haemostasis is provided by allowing for pulsed or continuous wave operation once an arc has been established, according to whether or not a surplus energy condition exists, as indicated by the voltage across the reservoir capacitor.

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Owner:GYRUS MEDICAL LTD

Selectively adjustable cardiac valve implants

InactiveUS20050288778A1Improve heat transfer performanceEasy transferAnnuloplasty ringsRadio frequency energyLight energy

Methods and devices are provided for support of a body structure. The devices can be adjusted within the body of a patient in a minimally invasive or non-invasive manner such as by applying energy percutaneously or external to the patient's body. The energy may include, for example, acoustic energy, radio frequency energy, light energy and magnetic energy. Thus, as the body structure changes size and/or shape, the size and/or shape of the annuloplasty rings can be adjusted to provide continued reinforcement. In certain embodiments, the devices include a first body member including a first shape memory material configured to transform the annuloplasty ring from a first configuration having a first size of a dimension to a second configuration having a second size of the dimension. The second size is less than said first size in septal lateral distance. The devices also include a second body member including a second shape memory material configured to transform the annuloplasty ring from the second configuration to a third configuration having a third size of the dimension, wherein the second size is less than the third size in septal lateral distance.

Selectively adjustable cardiac valve implants

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Owner:MICARDIA CORP

Balanced chilled fluid cooling system for a data center in a shipping container

ActiveUS7511960B2Improve heat transfer performanceServersDigital data processing detailsData centerWater source

A movable data center is disclosed that comprises a movable enclosure having partitions that define a closed-loop air flow path. A plurality of fans and a plurality of data processing modules are disposed in the air flow path. A pipe network is disposed within the enclosure that includes a chilled water supply pipe that receives chilled water from a source of chilled water. A water return pipe is provided that circulates water back to the source of chilled water. A plurality of heat exchange modules is installed in the enclosure in the air flow path. The heat exchange modules receive the chilled water from the chilled water supply pipe. Each of the heat exchange modules has a water circulation tube that connects the chilled water supply pipe to the return water pipe.

Balanced chilled fluid cooling system for a data center in a shipping container

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Owner:ORACLE INT CORP

Adjustable cardiac valve implant with coupling mechanism

InactiveUS7361190B2Improve heat transfer performanceEasy transferBone implantAnnuloplasty ringsRadio frequency energyAcoustic energy

Methods and devices are provided for support of a body structure. The devices can be adjusted within the body of a patient in a minimally invasive or non-invasive manner such as by applying energy percutaneously or external to the patient's body. The energy may include, for example, acoustic energy, radio frequency energy, light energy and magnetic energy. Thus, as the body structure changes size and / or shape, the size and / or shape of the annuloplasty rings can be adjusted to provide continued reinforcement. In certain embodiments, the devices include a tubular member configured to be attached to or near a cardiac valve annulus. The tubular member includes a receptacle end and an insert end configured to couple with the receptacle end of the tubular member such that the tubular member substantially forms a shape of a ring. The insert end is configured to move with respect to the receptacle end to change a circumference of the ring.

Adjustable cardiac valve implant with coupling mechanism

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Owner:MICARDIA CORP

Substrate processing apparatus

ActiveUS20090197418A1Efficiently and uniformly cool and heat portionStable processingDomestic cooling apparatusDecorative surface effectsPlate heat exchangerEngineering

A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.

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Owner:CANON ANELVA CORP

Light emitting diodes for high AC voltage operation and general lighting

InactiveUS7213942B2Improve heat transfer performanceLighting support devicesPoint-like light sourceLed arrayEffect light

A single-chip integrated LED particularly adapted for direct use with a high voltage AC power comprises a plurality of series-connected LEDs arranged in two arrays and flip chip bonded to a transparent substrate. The opposite polarities of the arrays are connected together and then connected to the AC power source. During the positive half of the AC cycle, one array of LEDs is forward biased and energized, while the other array is reverse biased. During the negative half of the AC cycle, the other array of LEDs is forward biased and thus energized, while the first array is reverse biased and thus not energized. The arrays are alternately energized and de-energized at the frequency of the AC power source, and thus the single-chip integrated LED always appears to be energized.

Light emitting diodes for high AC voltage operation and general lighting

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Owner:SEOUL SEMICONDUCTOR

Adjustable cardiac valve implant with coupling mechanism

InactiveUS20050288776A1Improve heat transfer performanceEasy transferAnnuloplasty ringsRadio frequency energyAcoustic energy

Methods and devices are provided for support of a body structure. The devices can be adjusted within the body of a patient in a minimally invasive or non-invasive manner such as by applying energy percutaneously or external to the patient's body. The energy may include, for example, acoustic energy, radio frequency energy, light energy and magnetic energy. Thus, as the body structure changes size and / or shape, the size and / or shape of the annuloplasty rings can be adjusted to provide continued reinforcement. In certain embodiments, the devices include a tubular member configured to be attached to or near a cardiac valve annulus. The tubular member includes a receptacle end and an insert end configured to couple with the receptacle end of the tubular member such that the tubular member substantially forms a shape of a ring. The insert end is configured to move with respect to the receptacle end to change a circumference of the ring.

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Owner:MICARDIA CORP

Ball grid array package with multiple interposers

InactiveUS6861750B2Increase stiffness/rigidityImprove heat transfer performanceSemiconductor/solid-state device testing/measurementSemiconductor/solid-state device detailsContact padPlanar substrate

Electrically, thermally and mechanically enhanced ball grid array (BGA) packages are described. An IC die is mounted to a first surface of a first stiffener. A peripheral edge portion of a second surface of the first stiffener is attached to a first surface of a second stiffener to cover an opening through the second stiffener that is open at the first surface and a second surface of the second stiffener. The second surface of the second stiffener is attached to a first surface of a substantially planar substrate that has a plurality of contact pads on the first surface of the substrate. The plurality of contact pads are electrically connected through the substrate to a plurality of solder ball pads on a second surface of the substrate.

Ball grid array package with multiple interposers

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Owner:AVAGO TECH INT SALES PTE LTD

High dielectric strength thermal interface material

InactiveUS6096414AImprove performanceMaintain good propertiesOther chemical processesSynthetic resin layered productsThermal conductivityThermal transmittance

A thermally-conductive, electrically insulative interface for conductively cooling a heat-generating source, such as an electronic component, having an associated thermal dissipation member such as a heat sink. The interface is provided as a cured sheet of a curable material formulated as a blend of a curable silicone binder, and a particulate alumina, i.e., aluminum oxide (Al2O3), filler. The interface is observed to exhibit a thermal conductivity of at least about 0.8 W/m-K and a wet dielectric breakdown strength of at least about 475 Vac/mil.

High dielectric strength thermal interface material

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Owner:PARKER INTANGIBLES LLC

Air Fryer

InactiveUS20080206420A1Improve heat transfer performanceProvide taste and texture and appearance characteristicDomestic stoves or rangesElectrical heating fuelProduct gasProcess engineering

An accelerated cooking air fryer is disclosed comprising a cavity, controller, thermal heating source, blower assembly, gas directing means and a vent assembly. Hot gas is circulated by the blower motor assembly into the air fryer cavity where the hot air is directed in a manner wherein a conflicting, colliding turbulent gas flow is directed at a food product providing for the accelerated cooking of the food product.

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Owner:TURBOCHEF TECH INC

Corrugated fin and frame assembly for battery cooling

ActiveUS20110293982A1Easy to manufactureLow costCell temperature controlVehicular energy storageEngineeringHeat sink

A cooling module for a battery pack assembly is disclosed. The cooling module includes a frame having a plurality of legs forming an opening through a central portion of the frame, at least one of the plurality of legs including a slot formed therethrough. A cooling fin is coupled to the frame. The cooling fin includes a corrugated plate interposed between a first plate and a second plate forming a plurality of fluid flow channels between the first plate and the second plate. The cooling modules are disposed in a stack having at least one battery cell disposed between adjacent cooling modules. The battery cell is in heat transfer communication with the cooling fin of at least one cooling module, wherein the cooling fin facilitates a transfer of heat energy between the battery cell and the flow channels formed in the cooling fin.

Corrugated fin and frame assembly for battery cooling

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Owner:GM GLOBAL TECH OPERATIONS LLC

Adjustable cardiac valve implant with ferromagnetic material

InactiveUS20050288781A1Improve heat transfer performanceEasy transferAnnuloplasty ringsRadio frequency energyAcoustic energy

Methods and devices are provided for support of a body structure. The devices can be adjusted within the body of a patient in a minimally invasive or non-invasive manner such as by applying energy percutaneously or external to the patient's body. The energy may include, for example, acoustic energy, radio frequency energy, light energy and magnetic energy. Thus, as the body structure changes size and/or shape, the size and/or shape of the annuloplasty rings can be adjusted to provide continued reinforcement. In certain embodiments, the devices include a body member including a ferromagnetic shape memory material. The body member has a first size of a dimension in a first configuration and a second size of the dimension in a second configuration. The body member is configured to be implanted into a heart so as to reinforce a cardiac valve annulus in the first configuration. The body member is configured to transform from the first configuration to the second configuration in vivo in response to a magnetic field. The body member in the second configuration is configured to reduce a size of the cardiac valve annulus.

Adjustable cardiac valve implant with ferromagnetic material

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Owner:MICARDIA CORP

Nano carbon materials for enhancing thermal transfer in fluids

InactiveUS6695974B2Improve thermal conductivityImprove heat transfer performanceMaterial nanotechnologyNanostructure manufactureOrganic groupElectrical polarity

A novel fluid heat transfer agent suitable for use in a closed heat transfer system, for example, wherein energy is transferred between an evaporator and a condenser in heat exchange relationship with the heat transfer agent that is caused to flow from one to the other. The novel heat transfer agent is a complex comprising a body of heat transfer fluid, for example, ethylene glycol or water, having suspended therein carbon nanoparticles in a quantity sufficient to enhance the thermal conductivity of the body of heat transfers fluid, per se. The carbon nanoparticles are selected from carbon in the form of sp<2 >type and sp<3 >type bonding and preferably comprise nanotubes or fullerenes and may have a coupling agent bonded thereto or enclosed therein when the nanotube or fullerene forms a hollow capsule. The coupling agent may be a polar organic group covalently bonded to the carbon nanoparticles and miscible in the fluid medium.

Owner:MATERIALS & ELECTROCHEM RES

Absorption refrigerator

InactiveUS6845631B1Improve heat transfer performanceEasy to useContainer filling methodsDomestic refrigeratorsHigh temperature storageEngineering

An absorption refrigerator (1) including a cabinet having outer walls (2, 3, 4, 5, 6) and at least one door (7, 8) encasing a low temperature storage compartment (9) and a higher temperature storage compartment (10), said compartments being essentially sealed from each other and separated by a partition wall (11), which partition wall is arranged inside the cabinet and generally perpendicular to a first wall (2) of said outer walls. The refrigerator further comprises an absorption refrigerating system including an evaporator tube (20), having a first section (21) for absorbing heat from the low temperature compartment and a second section (22) for absorbing heat from the higher temperature compartment, said second section being arranged downstream said first section. In order to reduce heat transfer into the cabinet through the outer walls, a major part of the first section is arranged generally in parallel with said partition wall.

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Owner:DOMETIC APPLIANCES

Fan assembly

ActiveUS20120034108A1Efficient air flow generationEmission reductionPropellersJet pumpsEngineeringAirflow

A fan assembly includes a motor-driven impeller for creating an air flow, at least one heater for heating a first portion of the air flow, and a casing comprising at least one air outlet for emitting the first portion of the air flow, and first channel means for conveying the first portion of the air flow to said at least one air outlet. To cool part of the casing, the casing includes means for diverting a second portion of the air flow away from said at least one heater, and second channel means for conveying the second portion of the air flow along an internal surface of the casing. This second portion of the air flow may merge with the first portion within the casing, or it may be emitted through at least one second air outlet of the casing.

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Owner:DYSON TECH LTD

Fan assembly

InactiveUS20120033952A1Quick changeReduce in quantityDucting arrangementsPump componentsMotor driveEngineering

A fan assembly includes a motor-driven impeller for creating an air flow, a casing including an interior passage for receiving the air flow, and a plurality of air outlets for emitting the air flow from the casing. The casing defines and extends about an opening through which air from outside the casing is drawn by the air flow emitted from the air outlets. The fan assembly also includes at least one heater for heating at least a first portion of the air flow, and means for diverting at least a second portion of the air flow away from said at least one heater. The plurality of outlets includes at least one first air outlet for emitting the relatively hot first portion of the air flow and at least one second air outlet for emitting the relatively cold second portion of the air flow.

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Owner:DYSON TECH LTD

Flexible thermal ground plane and manufacturing the same

ActiveUS20110017431A1Improve thermal performanceEffective liquid supplySemiconductor/solid-state device detailsSolid-state devicesGround planeNanorod

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Flexible thermal ground plane and manufacturing the same

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Owner:KELVIN THERMAL TECH

Photobioreactor systems positioned on bodies of water

InactiveUS20090130706A1Maintain depthConstant thicknessBioreactor/fermenter combinationsBiological substance pretreatmentsLiquid mediumStream flow

Certain embodiments and aspects of the present invention relate to a photobioreactor including photobioreactor units through which a liquid medium stream and a gas stream flow. The photobioreactor units are floated on a body of water such as a pond or a lake. The liquid medium comprises at least one species of phototrophic organism therein. Certain methods of using the photobioreactor system as part of fuel generation system and/or a gas-treatment process or system at least partially remove certain undesirable pollutants from a gas stream. In certain embodiments, the photobioreactor units are formed of flexible, deformable material and are configured to provide a substantially constant thickness of liquid medium. In certain embodiments, a barrier between the photobioreactor unit and the body of water upon which the unit is floated facilitates thermal communication between the liquid medium and the body of water.

Photobioreactor systems positioned on bodies of water

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Owner:THE TRON GRP

Battery Thermal System for Vehicle

ActiveUS20090280395A1Avoid blockage concernWell heat transferFuel cell heat exchangeCell temperature controlRefrigerantEngineering

A battery thermal system for use in a vehicle having a power plant, an air conditioning system and a battery pack, and a method of operation, is disclosed. The battery thermal system may include a refrigerant-to-coolant heat exchanger that selectively receives a refrigerant from the vehicle air conditioning system; a battery radiator located adjacent to a cooling fan; a valve that receives a liquid coolant from the battery pack and selectively redirects the liquid coolant to the refrigerant-to-coolant heat exchanger and the battery radiator; and an electric pump for pumping the liquid coolant through the battery pack, the valve, the refrigerant-to-coolant heat exchanger and the battery radiator. The battery thermal system may also include a battery coolant heater for selectively heating the coolant that flows into the battery pack.

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Owner:GM GLOBAL TECH OPERATIONS LLC

Electric water heater capable of intelligently distributing heating power

InactiveCN106123306AEnergy savingImprove intelligenceWater heatersElectric heatingEngineering

The invention provides an electric water heater. The electric water heater comprises a controller, an electric heating device and a water tank. The electric heating device is arranged in the water tank. The electric heating device comprises a left pipe box, a right pipe box and floating pipe coils. The floating pipe coils communicate with the left pipe box and the right pipe box to form sealed circulation of heating fluid. The left pipe box, the right pipe box and the floating pipe coils are filled with the heating fluid. One or more floating pipe coils are arranged. Each floating pipe coil comprises multiple arc-shaped pipe bundles. The center lines of the multiple pipe bundles are arcs of concentric circles. The end portions of the adjacent pipe bundles communicate so that the end portions of the pipe bundles can form free ends of the pipe bundles. The concentric circles are circles with the center of the left pipe box as the circle centers. The pipe diameter of the left pipe box is larger than the pipe diameter of the right pipe box. A first electric heater is arranged in the left pipe box. A second electric heater is arranged in the right pipe box. The first electric heater and the second electric heater are in data connection with the controller. The controller determines the ratio of the heating power of the first electric heater to the heating power of the second electric heater according to the pipe diameter of the left pipe box and the pipe diameter of the right pipe box. According to the electric water heater, automatic distribution of the heating power is achieved through the controller, energy is saved, and intellectualization of the water heater is improved.

Electric water heater capable of intelligently distributing heating power

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Owner:QINGDAO UNIV OF SCI & TECH

High-frequency chip packages

InactiveUS20050046001A1Improve heat transfer performanceEasy transferImpedence networksSemiconductor/solid-state device detailsElectrical conductorSemiconductor chip

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit board so as to provide enhanced thermal conductivity to the circuit board and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier. A module includes two circuits and an enclosure with a medial wall between the circuits to provide electromagnetic shielding between the circuits.

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Owner:TESSERA INC

Speed cooking oven

InactiveUS6874495B2Prevent excessive grease build-upSolve the quick installationSelf-cleaning stoves/rangesMeat/fish preservationAir movementProcess engineering

A speed cooking ovens is disclosed comprising a cooking cavity, thermal heating source, air movement and directing means, air flow control means, an air delivery means, and a vent assembly. The speed cooking oven may additionally utilize air flow control mechanisms and be practiced as a single rack speed cooking oven or a multi rack speed cooking oven. Hot gas is circulated to and from the oven cavity via air delivery means, such that turbulently mixed glancing, conflicting and colliding air flows mix at and about the surfaces of the food product. The turbulently mixed air flows are spatially averaged over the surface area of the food product producing high heat transfer and moisture removal rates, thereby optimizing speed cooking of the food product.

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Owner:TURBOCHEF TECH INC

Method and Apparatus for Additive Manufacturing Using Filament Shaping

ActiveUS20170274585A1StrengthImprove heat transfer effectAdditive manufacturing apparatus3D object support structuresFibrous compositesMaterials science

A method and apparatus for additive manufacturing wherein a fiber composite filament having an arbitrarily shaped cross section is softened and then flattened to tape-like form factor for incorporation into a part that is being additively manufactured.

Method and Apparatus for Additive Manufacturing Using Filament Shaping

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Owner:AREVO INC

Double temperature sensor

ActiveUS20080170600A1Easy to manufactureTolerances of the heat transfer coefficient can be minimizedThermometer detailsThermometers using electric/magnetic elementsElectricityHeat flux

A double temperature sensor is provided for measuring a near-surface temperature of the ambient air and the temperature of the skin surface (9). A heat flux insulation block (4) is made of an insulation material in one piece as a housing. Two temperature sensor elements (2, 3) with respective electric connections (6) belonging to them are arranged in the heat flux insulation block (4) one on top of another at spaced locations from one another and near the surface.

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Owner:DRAGERWERK AG

Memory heat sink

InactiveUS7151668B1Increase surface areaIncrease coolant flowSemiconductor/solid-state device detailsSolid-state devicesCoolant flowEngineering

An apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor device and provides enhanced cooling for the semiconductor device. The apparatus provides a relatively large surface area for transferring heat away from a semiconductor device, and provides for enhanced coolant flow through or around the apparatus. The apparatus includes a channel that may accommodate a heat pipe to further enhance transfer of heat away from the semiconductor device.

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Contact heat-transferring cooking system with an electric hotplate

InactiveUS6150636AImprove heat transfer performanceIncrease temperature differenceCooking-vessel materialsDomestic stoves or rangesCouplingVolumetric Mass Density

A contact heat-transferring electric hotplate (11) is provided, which is made from nonoxidic ceramic, particularly silicon nitride. Its very thin hotplate body (14) in the form of a disk is installed in self-supporting manner in a hob plate, e.g. by bonding, and has an extremely flat surface or which is adapted to the cooking vessel shape, which creates such a small gap with respect to said vessel that a coupling is possible even with higher power densities with only a temperature difference of a few degrees. The heating means (17) is also in contact with or directly connected to the underside of the hotplate body (14).

Contact heat-transferring cooking system with an electric hotplate

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Owner:E G O ELEKTRO GERAETEBAU GMBH

Nanocomposite ice-coating-proof paint having properties of superhydrophobicity and low adhesive strength

InactiveCN102660182AExcellent anti-icing effectLarge specific surface areaCoatingsSolventDefoamer

The invention relates to a nanocomposite ice-coating-proof paint having properties of superhydrophobicity and low adhesive strength and a preparation method thereof. The nanocomposite ice-coating-proof paint is characterized by comprising such raw materials, by mass, as 3%-30% of a fluorine-containing polyacrylate copolymer, 40%-80% of a solvent, 0.05%-1.5% of a defoamer, 0.05%-1% of an anti-setting agent, 1%-15% of nanoparticles, and 1%-20% of a crosslinking-curing agent. Film thickness of an ice-coating-proof coating prepared by adopting the nanocomposite ice-coating-proof paint provided by the invention is 5-10 mum, the water contact angle is over 150 degrees and the maximum angle is up to 169 degrees, and the adhesive strength of ice on the coating surface is 1.43*10<-2>MPa. The coating has a significant effect on ice-coating proofing, and can be used for preventing ice-coating on such components as telegraph pole towers, heat pump air-conditioners, low-temperature refrigeration devices, aircraft components, and the like.