17523results about "Impedence networks" patented technology

A telemetry system and method for providing spatial positioning information from within a patient's body are disclosed. The system includes at least one implantable telemetry unit which includes (a) at least one first transducer being for converting a power signal received from outside the body, into electrical power for powering the at least one implantable telemetry unit; (b) at least one second transducer being for receiving a positioning field signal being received from outside the body; and (c) at least one third transducer being for transmitting a locating signal transmittable outside the body in response to the positioning field signal.

Piezoelectric resonators utilizing a differentially offset reflector. One or more piezoelectric resonators are supported upon a substrate by one or more intervening layers of material, which intervening layers of material act as a reflector. The reflector isolates the resonators from the substrate. A portion of one or more of the intervening layers of material includes a differential layer of material, which differential layer shifts the resonant frequencies of the resonators that overlie the differential layer as compared with the resonant frequencies of those resonators that do not overlie the differential layer of material.

A communication system includes: a transmitter including a transmission circuit unit generating an RF signal for transmitting data and an electrical-field coupling antenna transmitting the RF signal as an electrostatic field or an induction field; a receiver including an electrical-field coupling antenna and a reception circuit unit subjecting an RF signal received by the electrical-field coupling antenna to reception processing; and a surface-wave propagation device including a plurality of linear surface-wave transmission lines for propagating a surface wave radiated from the electrical-field coupling antenna of the transmitter.

An inductive wireless power system using an array of coils with the ability to dynamically select which coils are energized. The coil array can determine the position of and provide power to one or more portable electronic devices positioned on the charging surface. The coils in the array may be connected with series resonant capacitors so that regardless of the number of coils selected, the resonance point is generally maintained. The coil array can provide spatial freedom, decrease power delivered to parasitic loads, and increase power transfer efficiency to the portable electronic devices.

A display includes an optical film that has a surface structure, such as a prismatically structured surface for increasing the brightness of the display. The structured surface is bonded to an opposing surface of a second film using a layer of adhesive, by penetrating the structured surface into the adhesive layer to a depth less than a feature height of the structured surface. The bonded film structure provides additional strength to the films and reduces the possibility of film damage during display assembly.

A radio frequency chip package is formed by assembling a connecting element such as a circuit board or flexible circuit tape having chips thereon with a bottom plane element such as a lead frame incorporating a large thermally-conductive plate and leads projecting upwardly from the plane of the plate. The assembly step places the rear surfaces of the chips on the bottom side of the connecting element into proximity with the thermal conductor and joins the conductive traces on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board. The leads provide robust electrical connections between the connecting element and the circuit board.

Embodiments of the invention disclose a method and a system configured to transfer energy wirelessly, comprising: a source configured to generate evanescent waves, in response to receiving the energy, on at least part of a surface of the source; a sink configured to receive the energy wirelessly from the source via a coupling of the at least part of the evanescent waves; and a load configured to receive the energy from the sink, wherein the load and the sink are configured to move along the surface of the source such that the at least a part of the evanescent waves are coupled between the source and the sink within an energy transfer area.

The present invention provides a system and method of quantifying flow, detecting a location of an obstruction and quantifying a degree of the obstruction in a pipe characterized in pulsatile flow. The method includes the steps of (a) attaching at least two spaced pressure sensors onto inner walls of the pipe; (b) using the at least two spaced pressure sensors for recording pressure records associated with each of the at least two pressure sensors within the pipe; and (c) using the pressure records for quantifying the pulsatile flow in the pipe, for detecting the location of the obstruction in the pipe and for quantifying the degree of the obstruction in the pipe.

A wireless charging method and apparatus are provided. A non-contact wireless local communication unit performs non-contact wireless local communication for wireless charging authentication through a non-contact wireless local communication antenna. A wireless power receiver receives supply power from a wireless power transmitter by using a resonator resonating on a resonance frequency equal to that of the wireless power transmitter after the wireless charging authentication. A charging controller performs wireless charging by using the supply power received by the wireless power receiver. One or more switches switch between a connection between the non-contact wireless local communication antenna and the non-contact wireless local communication unit, and a connection between the wireless power receiver and the charging controller.

An electronic component includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a cavity that penetrates from the first surface to the second surface of the semiconductor substrate, and an electrical mechanical element that has a movable portion formed above the first surface of the semiconductor substrate so that the movable portion is arranged above the cavity. The electronic component further includes an electric conduction plug, which penetrates from the first surface to the second surface of the semiconductor substrate, and which is electrically connected to the electrical mechanical element.

A communication system includes: a transmitter including a transmission circuit unit generating an RF signal for transmitting data and an electrical-field coupling antenna transmitting the RF signal as an electrostatic field or an induction field; a receiver including an electrical-field coupling antenna and a reception circuit unit subjecting an RF signal received by the electrical-field coupling antenna to reception processing; and a surface-wave propagation device including a plurality of linear surface-wave transmission lines for propagating a surface wave radiated from the electrical-field coupling antenna of the transmitter.

A compact and efficient optical illumination system featuring planar multi-layered LED light source arrays concentrating their polarized or un-polarized output within a limited angular range. The optical system manipulates light emitted by a planar light emitters such as electrically-interconnected LED chips. Each light emitting region in the array is surrounded by reflecting sidewalls whose output is processed by elevated prismatic films, polarization converting films, or both. The optical interaction between light emitters, reflecting sidewalls, and the elevated prismatic films create overlapping virtual images between emitting regions that contribute to the greater optical uniformity. Practical illumination applications of such uniform light source arrays include compact LCD or DMD video image projectors, as well as general lighting, automotive lighting, and LCD backlighting.

A method of formation of a microelectromechanical system (MEMS) resonator or filter which is compatible with integration with any analog, digital, or mixed-signal integrated circuit (IC) process, after or concurrently with the formation of the metal interconnect layers in those processes, by virtue of its materials of composition, processing steps, and temperature of fabrication is presented. The MEMS resonator or filter incorporates a lower metal level, which forms the electrodes of the MEMS resonator or filter, that may be shared with any or none of the existing metal interconnect levels on the IC. It further incorporates a resonating member that is comprised of at least one metal layer for electrical connection and electrostatic actuation, and at least one dielectric layer for structural purposes. The gap between the electrodes and the resonating member is created by the deposition and subsequent removal of a sacrificial layer comprised of a carbon-based material. The method of removal of the sacrificial material is by an oxygen plasma or an anneal in an oxygen containing ambient. A method of vacuum encapsulation of the MEMS resonator or filter is provided through means of a cavity containing the MEMS device, filled with additional sacrificial material, and sealed. Access vias are created through the membrane sealing the cavity; the sacrificial material is removed as stated previously, and the vias are re-sealed in a vacuum coating process.

Disclosed is an acoustic resonator that includes a substrate, a first electrode, a layer of piezoelectric material, a second electrode, and an alternating frame region. The first electrode is adjacent the substrate, and the first electrode has an outer perimeter. The piezoelectric layer is adjacent the first electrode. The second electrode is adjacent the piezoelectric layer and the second electrode has an outer perimeter. The alternating frame region is on one of the first and second electrodes.

The vehicle power supply apparatus 100 has a power transmitting unit 110 including a power transmission side coil 111 for generating an alternating magnetic field, a positioning member 112 for positioning the power transmission side coil 111 in a vehicle 20, and a power transmission side circuit 114 supplying an electric current to the power transmission side coil 111; and a power receiving unit 120 including a power receipt side coil 121 disposed in a rear window member 30 which is a non-magnetic portion of the vehicle 20 and generating an induced current based on an alternating magnetic field generated by the power transmission side coil 111 and a power receipt side circuit 122 supplying, to a power-supplied object, electric power based on the induced current generated by the power receipt side coil 121.

The invention provides a micro-electro-mechanical-system (MEMS) mirror device, comprising: a mirror having a 2-dimensional rotational articulated hinge at a first end, and having a 1-dimensional rotational articulated hinge at a second end opposite the first end; a movable cantilever connected to the mirror through the 1-dimensional rotational articulated hinge; a support structure connected to the mirror through the 2-dimensional rotational articulated hinge and connected to the movable cantilever; whereby movement of said movable cantilever causes rotation of the mirror in a first axis of rotation, and the mirror is also rotatable about a second torsional axis of rotation perpendicular to said first axis of rotation.

A method and apparatus are described for fabricating a high aspect ratio MEMS device by using metal thermocompression bonding to assemble a reference wafer (100), a bulk MEMS active wafer (200), and a cap wafer (300) to provide a proof mass (200d) formed from the active wafer with bottom and top capacitive sensing electrodes (115, 315) which are hermetically sealed from the ambient environment by sealing ring structures (112 / 202 / 200a / 212 / 312 and 116 / 206 / 200e / 216 / 316).

A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.

A feedthrough terminal assembly for an active implantable medical device (AIMD) includes a plurality of leadwires extending from electronic circuitry of the AIMD, and a lossy ferrite inductor through which the leadwires extend in non-conductive relation for increasing the impedance of the leadwires at selected RF frequencies and reducing magnetic flux core saturation of the lossy ferrite inductor through phase cancellation of signals carried by the leadwires. A process is also provided for filtering electromagnetic interference (EMI) in an implanted leadwire extending from an AIMD into body fluids or tissue, wherein the leadwire is subjected to occasional high-power electromagnetic fields such as those produced by medical diagnostic equipment including magnetic resonance imaging.

A thin-film resonator having a seed layer and a method of making the same are disclosed. The resonator is fabricated having a seed layer to assist in the fabrication of high quality piezoelectric layer for the resoantor. The resonator has the seed layer, a bottom electrode, piezoelectric layer, and a top electrode. The seed layer is often the same material as the piezoelectric layer such as Aluminum Nitride (AlN).

A backlight for a display device, such as a liquid crystal display device, includes a light guiding plate having a front and a rear surface. The front and rear surfaces may be parallel to one another, or may instead be non-parallel. To the extent that such surfaces are non-parallel, one surface may be included at a single, or multiple angles with respect to the other surface. The backlight further includes a light source that is coupled to an edge of the light guiding plate by means of an energy conserving coupling section, and which provides light that is conditioned and transmitted through the light guiding plate. Light extractors are disposed on at least one side of the light guiding plate to assist in the transmission and conditioning of the light that is provided to the light guiding plate by the light source.

An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer.

A system for monitoring, directing and controlling the dose of radiation in a medical procedure for irradiating a specific region of a patient's body. In its generic form, the system includes at least one sensor being implantable within, or in proximity to, the specific region of the patient's body, the at least one sensor being for sensing at least one parameter associated with the radiation. The system further includes a relaying device which is in communication with the sensor(s). The relaying device serves for relaying the information outside of the patient's body.

A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) or insulating base and resonator wafers, wherein resonator anchors, a capacitive air gap, isolation trenches, and alignment marks are micromachined in an active layer of the base wafer; the active layer of the resonator wafer is bonded directly to the active layer of the base wafer; the handle and dielectric layers of the resonator wafer are removed; viewing windows are opened in the active layer of the resonator wafer; masking the single crystal silicon semiconductor material active layer of the resonator wafer with photoresist material; a single crystal silicon resonator is machined in the active layer of the resonator wafer using silicon dry etch micromachining technology; and the photoresist material is subsequently dry stripped.

A micro-electrical-mechanical system (MEMS) vibrating structure includes a carrier substrate, a first anchor, a second anchor, a single crystal piezoelectric body, and a conducting layer. The first anchor and the second anchor are provided on the surface of the carrier substrate. The single-crystal piezoelectric body is suspended between the first anchor and the second anchor, and includes a uniform crystalline orientation defined by a set of Euler angles. The single-crystal piezoelectric body includes a first surface parallel to and facing the surface of the carrier substrate on which the first anchor and the second anchor are formed and a second surface opposite the first surface. The conducting layer is inter-digitally dispersed, and is formed on the second surface of the single-crystal piezoelectric body. The first surface of the single-crystal piezoelectric body is left exposed.