1660 results about "Piezoelectric thin films" patented technology

A piezoelectric thin film sensor array is used to scan and capture biometric data, for example, a fingerprint image. In one embodiment, a multi-layer structure includes a PVDF layer in between two conductor grids arranged orthogonally to one another. Urethane can be added to one side where a finger is placed. A foam substrate can be used as a support. In one feature, the PVDF, and grids can be peeled off like a label for easy replacement. Multiplexers are switched to scan the sensor. A single pixel or a group of pixels can be detected and output to an image memory. The presence of a fingerprint ridge is detected by virtue of a ring-down oscillation that arises from reflection when an electric field is applied to the piezoelectric thin film sensor array at a pixel in contact with the fingerprint ridge. For example, such a ring-down value associated with a fingerprint ridge can be detected at about 150 ns. (or 5 cycles at 30 MHZ). Other reflections indicative of additional biometrics (e.g. from tissue, blood, bone, fingernail, etc.) can also be detected. A Doppler effect due to reflections from circulating blood can also be detected. Such a Doppler effect can provide further information about direction and speed of blood circulation. An instantaneous pyroelectric effect can also be detected to indicate a live finger presence.

A piezoelectric resonator that achieves stable quality and improved resonance characteristics includes an acoustic reflector portion disposed between a substrate and a vibration portion, which includes a piezoelectric thin film sandwiched between a pair of electrodes, and a plurality of low acoustic impedance layers made of a material having relatively low acoustic impedance and a plurality of high acoustic impedance layers formed made of a material having relatively high acoustic impedance, the acoustic impedance layers being disposed alternately, and adjustment layers, which are disposed between the high acoustic impedance layers and the low acoustic impedance layers on the substrate sides of the high acoustic impedance layers and which have an acoustic impedance value intermediate between that of the high acoustic impedance layers and that of the low acoustic impedance layers. The low acoustic impedance layers and the high acoustic impedance layers have compressive stresses and the adjustment layers have a tensile stress.