The invention provides a method for preparing a C-axis preferred orientation aluminum
nitride polycrystalline film through magnetron
sputtering and the aluminum
nitride polycrystalline film, and relates to the technical field of
film material preparation. According to the method, the
semiconductor material substrate and the high-purity
sputtering aluminum target are relatively vertically arranged,so that the energy of migration movement of
sputtering aluminum atomic groups parallel to the surface of the substrate after reaching the substrate can be greatly improved, the C-axis preferred orientation growth of the aluminum
nitride film is convenient, and the piezoelectric response and
electromechanical coupling coefficient of the film are improved; according to the method, the heating wireis arranged near the
semiconductor material substrate, and high-temperature
radiation generated by the heating wire performs rapid heat treatment on the aluminum nitride film, so that the
crystallization degree of the film can be improved. Therefore, according to the method, the C-axis preferred orientation aluminum nitride thin film can be grown by utilizing the magnetron sputtering technology ata lower temperature, and the obtained aluminum nitride thin film is high in
crystallinity, has a higher piezoelectric response coefficient and an
electromechanical coupling coefficient, and can be used as a
chip material to be applied to a
surface acoustic wave device or a
bulk acoustic wave device.