3258results about "Power cables" patented technology

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

An electrical power system that can be used to interconnect a plurality of generators to a plurality to loads while being rated at less than a total power consumed. The system is preferably used to distribute power for a Liquefied Natural Gas (LNG) facility. The system broadly comprises a primary bus connected between the generators and the loads, such as electrical compressor motors used in the LNG facility. The generators and the loads are arranged along the primary bus in order to distribute the power from the generators to the loads, without overloading the primary bus.

An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cold plate is in thermal communication with at least one of the computer components, and convectively removes heat from that component using a liquid coolant. A heat exchanger dissipates heat from the liquid coolant, and provides liquid coolant back to the cold plate. An air mover within the chassis cools the heat exchanger, blows air across other components needing cooling, and removes heated air from the chassis. The air mover may extend substantially across the chassis, or it may blow crosswise from an outlet-ventilating direction.

A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.

Cables including a plurality of twisted pairs of insulated conductors and a core disposed between the plurality of twisted pairs of insulated conductors so as to separate at least one of the plurality of twisted pairs of insulated conductors from others of the plurality of twisted pairs of insulated conductors. In one example, a cable may include a jacket having a plurality of protrusions. In another example, the core may include one or more pinch points to facilitate breaking of the core. In yet another example, two or more cables may be bundled, and possibly twisted, together to form a bundled cable.

A patterned transparent conductor including a conductive layer coated on a substrate is described. More specifically, the transparent conductor can be patterned by screen-printing an acidic etchant formulation on the conductive layer. A screen-printable etchant formulation is also disclosed.

A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.

The present invention is a spray cooling thermal management device that cools an electronic component. Liquid coolant is dispensed upon a heated surface containing etched open microchannels.

In a disk array device for cooling respective sections including a HDD by a fan, drop of cooling efficiency by the difference of conditions of HDD mounted and unmounted sections is prevented and the use of a dummy HDD is deleted / eliminated. A housing contains a HDA mounted on the HDD, a power controller board for performing control to the HDD, a power unit for supplying power to each section, a fan for cooling the housing therein, and a backboard for connecting all the sections. On one backboard surface, the HDA is mounted, which has a cooling function for making cooling air flowing in the housing and exhausting air from the housing via a region on which the HDA are mounted and via a vent hole on the backboard. For the vent hole, a shutter is mounted, which has a mechanism for adjusting an open area rate of the vent hole by opening when the HDA is mounted and closing when removed.

Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.