265results about How to "High heat flux" patented technology

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for control including venting or recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. A gas permeable membrane removes and vents electrolytic gasses generated within the fluid chamber of the electroosmotic pump to ambient. A catalyst can be used to recombine electrolytic gases to form a vapor product that can be vented or condensed into a liquid state. An osmotic membrane provides for re-entry of condensed fluid to the fluid chamber.

Integrated Combustion Reactors (ICRS) and methods of making ICRs are described in which combustion chambers (or channels) are in direct thermal contact to reaction chambers for an endothermic reaction. Particular reactor designs are also described. Processes of conducting reactions in integrated combustion reactors are described and results presented. Some of these processes are characterized by unexpected and superior results, and/or results that can not be achieved with any prior art devices.

The invention discloses a heat pipe semiconductor refrigeration cool storage system which comprises a semiconductor refrigeration system and a heat pipe cool storage system; the heat end of a semiconductor refrigeration block in the semiconductor refrigeration system is tightly contacted with a first metal heat radiation block, the cold end of the semiconductor refrigeration block is tightly contacted with a second metal heat radiation block; a refrigeration heat radiation fin used for heat radiation of the heat end is arranged on the first metal heat radiation block; a condensation section of a heat pipe in the heat pipe cool storage system is arranged in the second metal heat radiation block, an evaporation section of the heat pipe is arranged in a cool storage device; phase change cool storage material used for storing cool energy is filled in the cool storage device, and a cool storage heat radiation fin used for transferring the cool energy in the cool storage device is arranged at the outside of the cool storage device. The heat pipe semiconductor refrigeration cool storage system of the invention utilizes the heat pipe to transfer the cool energy into the cool storage device in a box from the cold end of the semiconductor refrigeration block, the cool energy is great, the stored cool energy can be released according to the needs, and the residual cool energy is stored for standby, thereby being applicable to vaccine transportation, field operation and other long-term uses.

A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip.

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long,-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

An improved dry heat method and apparatus for thawing frozen biological fluids utilizing electrically heated plates and oscillatory motion to enhance heat transfer by mixing as the fluid thaws. Bags of frozen fluid to be thawed are lightly squeezed between two heating plates, one of which is gently oscillated to facilitate mixing of the thawing fluid, increasing heat transfer and reducing time required for thawing. Direct contact of the heating plates against the bag surfaces increases heat transfer by eliminating insulative effects of another bag wall and a water boundary layer, compared to water bath units. Flat (or curved to conform to bag) heat pipes are preferred as heating plates compared to plain aluminum sheet. Flat heat pipes have the property of an isothermal heating surface, thus maximizing heat transfer to the coldest areas, preventing hot spots, and simplifying heating plate temperature control.

A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.

The invention discloses a cooling system and method of an airborne heating element based on air expansion refrigeration, and belongs to the field of airborne equipment cooling. The cooling system comprises a high heat-flow heating element spray cooling circulation subsystem, an air expansion refrigeration circulation subsystem and a regenerator (7), wherein the high heat-flow heating element spray cooling circulation subsystem comprises a buffer tank (8), a circulation pump (9), a filter (10), a flow regulating valve (11), a spray chamber (14) and a bypass valve (15); the air expansion refrigeration circulation subsystem comprises a primary heat exchanger (2), a secondary heat exchanger (4), a water separator (5), a turbine (6) and a fan (16). The system can achieve rapid cooling of high heat-flow heating element, and achieve the purpose of circulation cooling for multiple times through the regenerator; an intermediate regenerator structure makes full use of the characteristics of large working time intervals of the heating element and large phase change latent heat of phase change materials, greatly reduces the volume of system equipment, and meets the requirements of airborne equipment.

A novel architecture of high-power four-quadrant hybrid power modules based on high-current trench gate IGBTs and arrays of low-current wide-bandgap diodes is conceived. The distributed physical layout of high power density wide-bandgap devices improves the cooling inside a fully-sealed module case, thus avoiding excessive internal heat flux build up and high PN junction temperature, and benefiting the converter's reliability and efficiency. The design of multiple-in-one hybrid integrated AC-switch module at high power ratings is enabled by using hybrid AC switch cells and aluminum nitride substrate structure.

The invention discloses a heat pipe ground-source heat pump system which comprises a ground heat pump unit and an underground heat pipe; an inlet of a compressor in the ground heat pump unit is connected with an outlet of an evaporator, the outlet of the compressor is connected with the inlet of a water-cooled condenser, the outlet of the water-cooled condenser is connected with the inlet of a liquid storage device, the outlet of the liquid storage device is connected with an electromagnetic valve, the inlet of a throttle valve is connected with the outlet of the electromagnetic valve, and the outlet of the throttle valve is connected with the inlet of the evaporator. The underground heat pipe is composed of a group of heat pipes, the group of the heat pipes are vertically arranged in an underground hole, and the upper parts of the group of the heat pipes are connected with the evaporator. Heat pipe media are filled in the group of the heat pipes. The heat pipe ground-source heat pump system of the invention does not need a circulating pump, thereby saving power consumption; working media adopted in the heat pipes can not corrode the underground heat pipe, so the heat pipes can be used for a long time; the underground heat pipe is short, and the flow resistance of a secondary refrigerant is small; as the gas-liquid phase change heat exchange is occurred in the heat pipes, the heat flux density is high.

The invention discloses a cooling system and method of airborne heating elements based on evaporative refrigeration, and belongs to the field of cooling airborne equipment. The cooling system comprises a spray cooling cycle subsystem of high heat-flow heating elements, an evaporative refrigeration cycle subsystem, and a cold accumulator (5) for connecting the spray cooling cycle subsystem and the evaporative refrigeration cycle subsystem, wherein the spray cooling cycle subsystem of high heat-flow heating elements comprises a buffer tank (6), a circulating pump (7), a filter (8), a flow regulating valve (9), a spray cavity (12) and a bypass valve (13); the evaporative refrigeration cycle subsystem comprises a condenser (1), a heat regenerator (3), an expansion valve (4) and a compressor (14). Through adoption of the cooling system, the rapid heat dissipation of the high heat-flow heating elements can be realized, and the purpose of repeated circular heat dissipation is achieved through the cold accumulator; besides, the cold accumulator is arranged in the middle, the working time intervals of the heating elements and the characteristic of high latent heat of phase-change materials are fully utilized, so that the volume of the equipment of the system is greatly reduced, and the requirements of airborne equipment are satisfied.

The invention relates to a three-dimensional slab heat pipe with multi-layer microporous pipe arrays and a processing technique thereof. The three-dimensional slab heat pipe comprises a heat conductor, wherein the heat conductor is formed by extruding or punching metal materials and is provided with two or more than two layers of the microporous pipe arrays arranged in parallel; each layer of the microporous pipe array comprises two or more than two microporous pipes arranged in parallel; a working medium, which has the functions of phase change and heat transfer, is encapsulated in each microporous pipe; and two ends of the heat conductor are sealed and at least one end head is provided with a gradually-shrinking sealing strip which is formed by cold welding. The three-dimensional slab heat pipe provided by the invention has the advantages of low thermal resistance, high heat-exchanging efficiency, strong bearing capacity and high reliability.

The invention relates to a novel microelectronic device radiator which comprises a planar heat pipe being two or more through hole array flat plate structures arranged side by side and formed by extrusion or punching of metal materials and the equivalent diameters of through holes range from 0.2mm to 6mm. The through holes are filled with liquid working substance and two ends of the planar heat pipe are encapsulated in a sealing manner; an evaporation section of the planar heat pipe is in surface contact with a heating surface of a microelectronic device and a condensation section of the planar heat pipe eliminates heat through a heat elimination component. The novel microelectronic device radiator overcomes the defects of small contact area between the current round heat pipe and the heating surface of the microelectronic device, large equivalent resistance of heat conduction and complex manufacture technology, and has the advantages of high heat elimination efficiency and simple technology.

The invention discloses a working medium contact cooling system of power batteries. An insulating liquid heat-conducting working medium is contained in a working medium box; a working medium pump sinks into the insulating liquid heat-conducting working medium; a filter is arranged at an inlet of the working medium pump; the working medium pump is connected with a spray main pipe; a plurality of spray branch pipes are connected with the spray main pipe in parallel; each spray branch pipe is provided with a plurality of nozzles; the nozzles are opposite to a high-power battery pack; the spray branch pipes and the spray main pipe form a cage frame; the high-power battery pack is placed in the cage frame; the spray branch pipes are distributed on the side surfaces and the upper part of the high-power battery pack to form a relatively open spray structure; and the insulating liquid heat-conducting working medium is a nonpolar substance and is free of a phase change in the spray process. The invention further provides a working method of the working medium contact cooling system of the power batteries. According to the working medium contact cooling system, the cooling structure is reasonable and the cooling efficiency is high.

A heat sink includes a heat conducting substrate and a plurality of directive heat elements disposed within the substrate such that a first end of each of the plurality directive heat elements are adapted to be disposed proximate a heat generating device and a second end of each of the plurality of directive heat elements are spaced apart within the substrate to promote the transfer to heat from the heat generating device through the directive elements to an area of the heat conducting substrate which is larger than the area of the heat generating device. In this way, the heat sink transforms a high heat flux density existing at one end of the directive heat elements proximate a device being cooled to a low heat flux density at an opposite end of the directive heat elements.

An electronic device with cooling of a heat dissipation source, by a liquid metals spreader, the device including at least one heat dissipation source, at least one spreader through which at least one liquid metal circulation channel passes forming a loop routed below a heat dissipation source, at least one heat sink, and at least one electromagnetic pump moving the liquid metal in the at least one channel such that the liquid metal absorbs heat dissipated by a heat dissipation source and transports the absorbed heat to be evacuated by the heat sink. Each spreader includes at least two plates made of an electrical insulating material located on each side of at least one bar made of deformable material.

A temperature control type loop heat pipe evaporator assembly comprises a heat compensator, N evaporation units and a connecting pipeline, wherein the N is a positive integer bigger than or equal to 1; the heat compensator is arranged in the input end so as to heat up the liquid working medium in the loop heat pipe into gas-liquid two-phase state; the N evaporation units are connected by the connecting pipeline so as to form an evaporation network; the input end of the evaporation network is connected with the output end of the heat compensator through the connecting pipeline; the output end of the evaporation network serves as the output end of the evaporator assembly. The evaporator assembly can ensure the working medium entering each evaporation unit in the loop heat pipe operation to be two-phase working medium, thus ensuring constant and consistent temperature of the heat source in working/non working state, and accurately controlling the temperature in the complete cycle.

The invention provides continuous casting mold fluxes specific for production of medium-high carbon steel and alloy steel. The mold fluxes are applicable to the production of the medium-high carbon steel and the alloy steel with a carbon content ranging from 0.26 to 1.0 weight percent by a thin slab continuous casting machine. The mold fluxes mainly comprise the following components in weight percentage: 23.0 to 31.0 percent of SiO2, 22.0 to 29.0 percent of CaO, 4.0 to 6.0 percent of MgO, 2.5 to 4.5 percent of Al2O3, less than or equal to 1.3 percent of Fe2O3, less than or equal to 1.0 percent of MnO2, 10.0 to 13.0 percent of Na2O, 8.7 to 12.0 percent of F and 7.0 to 10.0 percent of C. The mold fluxes of the invention have relatively low crystallization and softening temperatures, so when the medium-high carbon steel and the alloy steel with a relatively low liquidus temperature are poured, the lubrication of a non-Newtonian fluid and the probability of surface cracking caused by the inhomogeneous heat dissipation of a casting slab due to the crystallization are greatly reduced in a relatively low crystallization and softening temperature range.