Product
Patsnap Eureka
For R&D, Patsnap Eureka makes reading and utilizing patents & technical documents easy.
Patsnap Eureka AIR
Designed for self-driven R&D workflows. Generate viable solutions, solve complex R&D challenges, empower your innovation with AI.
Patsnap Eureka Materials
Designed for material experts only. Revolutionize your material R&D, from search, analyze, to developing new materials.
Feature
TechResearch
Generate reliable direction feasibility study reports for your R&D in just a few steps.
TechSeek
Discover and master advanced knowledge NOW. Basics, ideas, possibilities, all at once.
TechMind
As an expert in R&D Theories, TechMind can generates customized viable solutions instantly.
TechRisk
Analyze your overall solution with one click, know your potential R&D risks in advance.
TechMonitor
Get weekly tech updates, stay abreast of the latest tech innovations and key insights.
Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
46results about How to "Large amount of heat" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Cast pedestal with heating element and coaxial heat exchanger
ActiveUS7327948B1High-temperature gradientHeat resistantSemiconductor/solid-state device manufacturingHigh-frequency/infra-red heating bakingHeat resistanceEngineering
The present invention provides a heat transfer assembly that, when coupled to an object, is capable of keeping the object at a uniform elevated temperature while removing large amounts of heat from an external source. The assembly may be contained in a pedestal for use in a UV-cure chamber. The heat transfer assembly includes a heating element to control the wafer temperature and a cooling element to remove incident IR heat from the wafer and pedestal. A heat resistant layer having a calibrated heat resistance is located between the heating and cooling elements and between the wafer and the cooling elements. The heat resistant layer is able to sustain high temperature gradient from the wafer to the coolant so that the coolant does not boil while permitting enough heat to be conducted away from the wafer to maintain the desired set-point temperature.
Owner:NOVELLUS SYSTEMS
Semiconductor device and manufacturing method thereof
ActiveUS20100109052A1Small sizeReduce semiconductor areaTransistorSemiconductor/solid-state device detailsAudio power amplifierElectrical conductor
In a semiconductor chip in which LDMOSFET elements for power amplifier circuits used for a power amplifier module are formed, a source bump electrode is disposed on an LDMOSFET formation region in which a plurality of source regions, a plurality of drain regions and a plurality of gate electrodes for the LDMOSFET elements are formed. The source bump electrode is formed on a source pad mainly made of aluminum via a source conductor layer which is thicker than the source pad and mainly made of copper. No resin film is interposed between the source bump electrode and the source conductor layer.
Owner:MURATA MFG CO LTD
Fluid infusion apparatus with an insulated patient line tubing for preventing heat loss
InactiveUS20050148934A1Large amount of heatEnhancing infusionMedical devicesIntravenous devicesLine tubingFluid infusion
A fluid warming and infusion system. According to one embodiment, the fluid warming and infusion system includes a container for storing a fluid to be infused into a patient, a fluid warmer for warming the fluid prior to the fluid being infused into the patient, a tubing for delivering the fluid to the patient after the fluid has been warmed by the fluid warmer, and a patient insertion device (e.g., a needle, or the like), which is connected to a distal end of the tubing, for insertion into the patient. After being warmed by the fluid warmer, the fluid flows through the tubing and is delivered into the patient by the insertion device. The tube includes a substantially thermally insulating component that prevents the warmed fluid from losing a substantial amount of heat as the fluid flows through the tube.
Owner:MALLINCKRODT INC
Cooling array
InactiveUS7057893B2Simple wayRemove large amount of heatDomestic cooling apparatusPower cablesAir conditioningPhysics
A cooling array including a housing accommodating electrical built-in components and an air conditioning device that is connected to a heat source of the electrical built-in components by a coolant-carrying inlet line and a return line. To simply air-condition complex systems having a plurality of electrical built-in components, several device inlet lines come out from the inlet line and device return lines come out from the return line and each electrical built-in component is assigned at least one device inlet line and at least one device return line.
Owner:RITTALWERK RUDOLF LOH GMBH & CO KG
Intrinsic thermal enhancement for FBGA package
InactiveUS20050186704A1Signal integrationImprove performanceSemiconductor/solid-state device detailsSolid-state devicesDevice materialSolder ball
A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) mounted on a thin support substrate and interfaced with a die. Thermally conductive via interconnects extending through the substrate conduct heat generated by the die from the conductive plane to conductive balls mounted on traces on the opposing side of the substrate. In another embodiment, the semiconductor devices comprises a thick thermally conductive plane (e.g., copper foil) sandwiched between insulative layers, with signal planes (e.g., traces, bonding pads) disposed on the insulative layers, a die mounted on a first signal plane, and solder balls mounted on bonding pads of a second signal plane. A thermally conductive via interconnect extends through the substrate to provide a thermal path from the die and signal plane (traces) through the thick conductive plane and into the solder balls and external device (e.g., mother board). The present semiconductor device provides effective heat dissipation without the attachment of an external heat sink or spreader.
Owner:MICRON TECH INC
Low odor, light color, disposable article construction adhesive
InactiveUS20050014891A1Improve cohesive strengthEasy to processMonocarboxylic acid ester polymer adhesivesPersonal carePolymer scienceHot melt
We have found a novel spray-on adhesive composition made from components including a high melt index polymer and a high melt tackifier that interact to produce a composition that can form a low odor, light color, non-tacky, hot melt adhesive material that can be used in disposable article manufacture. The adhesive is thermally stable at hot melt application conditions, is low in cost, is easily applied and produces high quality disposable articles.
Owner:ADHERENT LAB
Intrinsic thermal enhancement for FBGA package
InactiveUS7138711B2Signal integrationImprove performanceSemiconductor/solid-state device detailsSolid-state devicesSolder ballSemiconductor package
Owner:MICRON TECH INC
Cooling Apparatus for Fluid
InactiveUS20090020263A1Reduce fluid resistanceIncrease heatInternal combustion piston enginesNon-fuel substance addition to fuelEvaporationEngineering
An apparatus for efficiently cooling the heat of a hot target without enlarging the size of a cooling device or needing either a piping to connect an evaporation portion and a condensation portion or a steam circulation pump. An exoergic-side heat exchanger has a fluid passage for the target fluid, and stores a coolant for cooling the fluid in the fluid passage through heat exchange. An endoergic-side heat exchanger has at least two coolant passages, the one ends of which communicate with the endoergic-side heat exchanger, and the other ends of which communicate with each other through a common coolant passage. A cooling device cools the coolant by exchanging heat with the coolant passing through the exoergic-side heat exchanger. The coolant passage has a diameter or an equivalent diameter within a range of 2 mm to 16 mm, and all the coolant passages have a substantially identical or equivalent diameter.
Owner:KOMATSU LTD
Electric supercharging device and multi-stage supercharging system
ActiveUS20140144412A1Effectively coolLarge amount of heatAssociation with control/drive circuitsInternal combustion piston enginesWindageStator
It is intended to provide: an electric supercharging apparatus wherein, with a simple structure, rotor windage loss in an electric motor for driving a compressor is reduced and good cooling performance is produced; and a multi-stage supercharging system using the electric supercharging device. This electric supercharging apparatus is provided with: a first cooling passage formed in a stator along a motor coil and communicating a gas supply port with a gas discharge port in a motor housing; and a first intake passage connecting the gas discharge port to an intake port of a compressor. This electric supercharging apparatus is configured to introduce outside air into the first cooling passage via the gas supply port by applying negative pressure to the first cooling passage via the first intake passage, thereby cooling the inside of the motor housing.
Owner:MITSUBISHI HEAVY IND ENGINE & TURBOCHARGER LTD
Intrinsic thermal enhancement for FBGA package
InactiveUS20060289989A1Signal integrationImprove performanceSemiconductor/solid-state device detailsSolid-state devicesDevice materialSolder ball
A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) mounted on a thin support substrate and interfaced with a die. Thermally conductive via interconnects extending through the substrate conduct heat generated by the die from the conductive plane to conductive balls mounted on traces on the opposing side of the substrate. In another embodiment, the semiconductor devices comprises a thick thermally conductive plane (e.g., copper foil) sandwiched between insulative layers, with signal planes (e.g., traces, bonding pads) disposed on the insulative layers, a die mounted on a first signal plane, and solder balls mounted on bonding pads of a second signal plane. A thermally conductive via interconnect extends through the substrate to provide a thermal path from the die and signal plane (traces) through the thick conductive plane and into the solder balls and external device (e.g., mother board). The present semiconductor device provides effective heat dissipation without the attachment of an external heat sink or spreader.
Owner:MICRON TECH INC
Electrically controlled exhaust valve
InactiveUS20050109024A1Reduce the amount requiredReduce heat transferSilencing apparatusEngine controllersExhaust valveAcoustic wave
An exhaust system for a motor vehicle having a variable displacement engine includes an exhaust valve assembly that is moveable between an open position and a position blocking at least some of the exhaust gases. The blocking of some the exhaust gases increases backpressure that reflects sound waves. The reflection of sound waves provides for the conditioning of noises eminating from the exhaust system. The exhaust valve assembly utilizes an electric actuator. The exhaust valve assembly includes heat insulation features for isolating the electric actuator from heat radiating from the exhaust pipe.
Owner:ARVIN TECH INC
Multilayer circuit board and semiconductor device using the same
InactiveUS6891732B2Improve cooling effectLarge amount of heatSemiconductor/solid-state device detailsSolid-state devicesMetallic materialsEngineering
A multilayer circuit board for mounting a semiconductor element thereon, comprising a core substrate of a metal material and a plurality of wiring layers stacked on either side of the core substrate, each of the stacked wiring layers being isolated from an adjacent wiring layer by an insulating layer interposed therebetween, the multilayer circuit board having an area at which a heat spreader for dissipating heat generated from the semiconductor element mounted on the circuit board is to be joined to the multilayer circuit board, wherein the multilayer circuit board allows the heat spreader to be joined to the core substrate without the insulating layers being interposed therebetween. A semiconductor device using the multilayer circuit board is also disclosed.
Owner:SHINKO ELECTRIC IND CO LTD
Cutting tool
ActiveUS7201956B2Improve chip resistanceImprove cutting performancePigmenting treatmentMilling cuttersCrystal structureTitanium carbonitride
The present invention provides a cutting tool in which the hard coating layer demonstrates superior chipping resistance. The cutting tool has a tool base composed with tungsten carbide-based cemented carbide or titanium carbonitride-based Cermet, and a hard coating layer provided on the surface thereof; wherein the hard coating layer includes: (a) a Ti compound and / or Zr compound layer, which is a lower layer, comprising one or more layers of a TiC layer, TiN layer, TiCN layer, TiCO layer, TiCNO layer, ZrC layer, ZrN layer, ZrCN layer, ZrCO layer, ZrCNO layer and (b) an aluminum oxide layer having an α crystal structure which is an upper layer, including the highest peak in the inclination section within a range of 0–10.
Owner:MITSUBISHI MATERIALS CORP
Machine equipped with a temperature compensated lathe spindle
InactiveUS6958588B2Large amount of heatImprove accuracyProgramme-controlled manipulatorTemperatue controlEngineeringMachining
A machine for machining a workpiece with at least one revolving or rotating tool has a work spindle with a shaft (5), whose temperature is monitored by means of at least one temperature sensor (26). The temperature sensor is detected in contactless fashion. The sensor (26) is preferably a radiation-sensitive sensor, which detects the temperature radiation output. by the shaft (5). In triggering the positioning drive mechanisms, the control unit (35) of the machine (1) takes into account the temperature expansions of the shaft (5) that result from the temperature changes in the shaft. The positioning drive mechanisms serve to position a tool (6), carried by the shaft (5), relative to the workpiece (2). A machining precision is thus achieved that is independent of the temperature and temperature changes of the machine (1) overall, of temperature changes in the coolant—lubricant, and of temperature changes in the tool (6) and the shaft (5), that can all be caused by the power converted at the machining site.
Owner:WALTER MASCHINENBAU GMBH
Exhaust heat recovery system
InactiveUS20100154394A1Maintain warm-up performanceHeat recoveryInternal combustion piston enginesRecuperative heat exchangersEngineeringInternal combustion engine
An exhaust heat recovery system 25 provided with a plurality of heat pipes 60, 61 provided with heat recovery parts 60a, 61a and heat exchange parts 60b, 61b. The heat pipes recover heat from exhaust gas exhausted from an internal combustion engine at the heat recovery parts and transfer this recovered heat to an object to be heated at the heat exchange parts. The heat recovery part 60a of the first heat pipe 60 recovers heat from the exhaust gas at an exhaust purification catalyst 20′ provided in an engine exhaust passage or its upstream side. The heat recovery part 61b of the second heat pipe 61 recovers heat from the exhaust gas at the downstream side of the exhaust purification catalyst. Due to this, there is provided an exhaust heat recovery system which can recover at least a fixed amount of exhaust heat at all times while maintaining a warm-up performance of the exhaust purification catalyst.
Owner:EXXON RES & ENG CO +1
Thermal energy storage apparatus
InactiveUS20100147486A1Heating fastInexpensive to fabricateHeat storage plantsRegenerative heat exchangersThermal energyFiber
The present invention provides a thermal energy storage (TES) apparatus having a fast response to heat, which is also simple, lightweight, compact, and inexpensive to fabricate. In one preferred embodiment of the present invention, phase change material (PCM) is enclosed in a tubular container. A brush-like heat spreading element having radial bristles is installed in the tube within the PCM. The bristles are made of wires or fibers having good thermal conductivity and their ends are in a good thermal contact with the interior wall of the tube. Heat from external source is deposited into the tube exterior and conducted through the wall, transferred to the bristles, and conducted through the bristles in a generally radial direction substantially through out the PCM volume. The TES may be used in buildings to stabilize temperature and thus reduce the cost of building climate control such as heating and air conditioning.
Owner:VETROVEC JAN
Control apparatus and method for vehicle
ActiveUS20050027424A1Large amount of heatApplication problemDigital data processing detailsGearing controlDriving rangeControl equipment
A control apparatus for a vehicle equipped with an automatic transmission having an apply element that is applied when the vehicle takes off from a standstill, which executes a neutral control which releases the apply element when the automatic transmission is in a forward-drive range and the vehicle is stopped with a predetermined condition being satisfied, includes a controller that detects a target idle speed of an engine and determines whether the neutral control can be executed based on the target idle speed.
Owner:TOYOTA JIDOSHA KK
Low odor, light color, disposable article construction adhesive
InactiveUS6846876B1Increase surface areaImprove productivityMonocarboxylic acid ester polymer adhesivesManual label dispensersPolymer scienceHot melt
Owner:ADHERENT LAB
Exhaust gas heat recovery unit and exhaust gas heat recovery method
InactiveUS20110005227A1Efficiently recoverEfficient heatingInternal combustion piston enginesRecuperative heat exchangersExhaust gasEvaporator
An exhaust gas heat recovery unit includes a plurality of heat pipes (23) each of which includes a heater-side heat pipe portion (23a) positioned on the side of a heater (21) which heats pure water using heat of exhaust gas discharged from an engine and an evaporator-side heat pipe portion (23b) positioned on the side of an evaporator (22) which evaporates the pure water, heated at the heater-side heat pipe portion (23a), using the heat of the exhaust gas. The pitch of heater-side corrugated fins (28a) on the outer periphery of the heater-side heat pipe portion (23a) is set to substantially half the pitch of evaporator-side corrugated fins (28b) on the outer periphery of the evaporator-side heat pipe portion (23b).
Owner:TOYOTA JIDOSHA KK
Sensor control device
InactiveUS20090114536A1Large amount of heatReduce adverse effectsMaterial analysis by electric/magnetic meansTemperature senseElectricity
A sensor control device including a circuit board separate from and electrically connectable to a gas sensor, the gas sensor including a detecting element configured to output a concentration response signal in response to the concentration of a specific gas component. The circuit board has mounted thereon: a detecting element driving unit; a temperature sensing element configured to output a temperature response signal in response to a temperature of the circuit board; a temperature calculating unit; and a concentration information correcting unit configured to correct gas concentration information calculated by the detecting element driving unit based on temperature information calculated by the temperature calculating unit.
Owner:NGK SPARK PLUG CO LTD
Solar energy system
InactiveUS20140311551A1High return on investmentIncrease valueSolar heating energySolar heat devicesWorking fluidWater storage tank
A solar energy system includes a solar energy receiver and a matrix of pipes containing a working fluid attached to the bottom side of the receiver. The matrix is a plurality of vertically-tilted pipes and at least three horizontal pipes arranged in a specific order and have a defined function. The working fluid absorbs heat and changes from a liquid to a gas. The system further includes a thermal storage tank, which includes a heat storage medium and a heat exchanger. The heat exchanger receives evaporated working fluid from one of the horizontal pipes, condenses the working fluid vapor by transferring heat to the heat storage medium. When water is the working fluid, a distilled water storage tank may be connected to the heat exchanger to receive distilled water. When recirculation of the working fluid is desired, condensed liquid from the heat exchanger is flowed to a horizontal pipe.
Owner:ORG WORLD INTPROP
LED illumination apparatus and manufacturing method thereof
InactiveUS20170184282A1Large amount of heatReduce weightPlanar light sourcesLighting heating/cooling arrangementsEnvironmental resistanceProtection mechanism
Disclosed are an LED illumination apparatus and its manufacturing method. A metal sheet is stamped to form a conductive plate with 3D space, and the conductive plate includes an illumination circuit, and a support frame for supporting the conductive plate to form different types of illumination apparatuses. The support frame is provided for supporting and fixing the conductive plate to facilitate the conductive plate to form a 3D curved surface, and an LED chip soldering point protection mechanism is provided for protecting each LED chip soldering point, so that the illumination apparatus is applicable for mass production to improve the yield rate and meet the high heat dissipation efficiency, large-range illumination, material saving, lightweight and / or environmental protection requirements.
Owner:LONGWIDE TECH
Semiconductor device
InactiveUS20170162482A1Joint strength declineImprove the immunityConversion constructional detailsSemiconductor/solid-state device detailsEngineeringCopper
A semiconductor device includes a semiconductor element and an electrically conductive member. The semiconductor element is configured to allow an electric current to flow from a first electrode to a second electrode and prevent an electric current flowing from the second electrode to the first electrode. The electrically conductive member is joined with the second electrode via a solder joint layer. Surface of the second electrode in contact with the solder joint layer mainly comprises nickel, and surface of the electrically conductive member in contact with the solder joint layer mainly comprises copper. The solder joint layer comprises first and second compound layers. The first compound layer is located at an interface with, the second electrode and comprises nickel-tin based intermetallic compound. The second compound layer is located at an interface with the electrically conductive member and comprises copper-tin based intermetallic compound.
Owner:TOYOTA JIDOSHA KK
Control device for vehicle drive device
ActiveUS20150274154A1Reliably and easily determinedIncrease heatHybrid vehiclesDigital data processing detailsHeat generationControl unit
A control device for a vehicle drive device having a speed change mechanism that attains a predetermined shift speed by engaging multiple engagement elements. The control device predicts an amount of heat generation and determines whether any jumping shift from the current shift speed to the shift speed that is the multiple shift speeds higher or lower than the current shift speed can be permuted or not between the current shift speed and the target shift speed, and if the jumping shift can be permitted, the control unit performs the jumping shift and controls the speed change mechanism so as to shift the shift speed from the current shift speed to the target shift speed.
Owner:AISIN AW CO LTD
Broadband Power Amplifier with A High Power Feedback Structure
InactiveUS20090231042A1High power feedback structureLarge optimum load impedanceSemiconductor/solid-state device detailsSolid-state devicesBroadband power amplifierPower over
A broadband power amplifier using a novel high power feedback structure is disclosed in this patent. Feedback is widely used in amplifier design to broaden the bandwidth of the amplifier. Traditionally, the feedback resistor is either an axial resistor placed over the top of the transistor or a surface mount resistor with a long PCB trace making up the rest of the feedback path. However, each of these methods has it's limitations. The axial resistor doesn't have good heat sinking capability and therefore cannot handle high power. The feedback on PCB makes the feedback path long and becomes positive feedback at high frequency, thus limiting the high end frequency of operation of the amplifier in a stable region. The feedback structure disclosed in this patent has a good heat sinking path, has very short feedback path; allowing for higher frequency operation. We successfully applied the feedback structures to a Gallium Nitride (GaN) transistor, which is a new type of power transistor that has low parasitic capacitance and high optimum load impedance, and demonstrated an amplifier with very high output power over extraordinarily broad bandwidth. Matching networks have been optimized to improve performance and stability. We have demonstrated that unconditional stability is achievable while operating over a broad bandwidth using this feedback structure.
Owner:JIA PENGCHENG +1
Thermal management system for vehicle
ActiveUS11142037B2Improve cooling effectImprove heating efficiencyAir-treating devicesSecondary cellsElectric machineThermal management system
A thermal management system for a vehicle includes a cooling device which includes a radiator, electrical components, and at least one water pump which are connected through a coolant line, to circulate a coolant through the coolant line to supply the coolant to the electrical components and an oil cooler which is mounted on the coolant line and connected to a drive motor to cool the drive motor; and an HVAC module which has a heater connected to the coolant line through first and second connection lines to supply the coolant with a temperature which is increased as the coolant passes through the electrical components and the oil cooler in a heating mode of a vehicle.
Owner:HYUNDAI MOTOR CO LTD +1
Low odor, light color, disposable article construction adhesive
InactiveUS20050056367A1Increase surface areaImprove productivityMonocarboxylic acid ester polymer adhesivesManual label dispensersPolymer scienceHot melt
Owner:ADHERENT LAB
Recording medium drive
InactiveUS7016158B2Suppression of rise in temperature of headIncrease temperatureDisposition/mounting of recording headsRecord information storageHeat resistanceMetallic materials
A head slider is related to an actuator block. A flexible printed circuit board is received on the surface of the actuator block. A head IC is mounted on the surface of the flexible printed circuit board. A heat conductive member is mounted on the head IC. The heat resistance of the heat conductive member is set smaller than that of the flexible printed circuit board. A larger amount of heat can be transmitted from the head IC to the actuator block. The actuator block is made of a metal material such as aluminum. The heat resistance of the actuator block is apparently smaller than that of the flexible printed circuit board. A larger amount of heat can be radiated from the actuator block as compared with the flexible printed circuit board. The head IC is thus reliably prevented from a rise in the temperature.
Owner:TOSHIBA STORAGE DEVICE CORP
Manufacturing method of reactor and heating device
ActiveUS20180286580A1High magnetic flux densityLarge amount of heatTransformers/inductances detailsMagnetic core manufactureAdhesiveNuclear engineering
A manufacturing method of a reactor includes: mounting a reactor coil onto a first core segment and a second core segment, and placing the first core segment and the second core segment face to face, with an uncured thermosetting adhesive sandwiched between the first core segment and the second core segment; placing a heating core such that one end of the heating core is wound faces the first core segment, and the other end of the heating core faces the second core segment; producing heat in the first core segment and the second core segment by an alternating magnetic flux; and binding together the first core segment and the second core segment by a temperature rise and cure of the thermosetting adhesive.
Owner:TOYOTA JIDOSHA KK
Cooling array
InactiveUS20050117297A1Simple wayRemove large amount of heatDomestic cooling apparatusIndirect heat exchangersComing outEngineering
A cooling array including a housing accommodating electrical built-in components and an air conditioning device that is connected to a heat source of the electrical built-in components by a coolant-carrying inlet line and a return line. To simply air-condition complex systems having a plurality of electrical built-in components, several device inlet lines come out from the inlet line and device return lines come out from the return line and each electrical built-in component is assigned at least one device inlet line and at least one device return line.
Owner:RITTALWERK RUDOLF LOH GMBH & CO KG
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com