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46results about How to "Large amount of heat" patented technology

Intrinsic thermal enhancement for FBGA package

A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) mounted on a thin support substrate and interfaced with a die. Thermally conductive via interconnects extending through the substrate conduct heat generated by the die from the conductive plane to conductive balls mounted on traces on the opposing side of the substrate. In another embodiment, the semiconductor devices comprises a thick thermally conductive plane (e.g., copper foil) sandwiched between insulative layers, with signal planes (e.g., traces, bonding pads) disposed on the insulative layers, a die mounted on a first signal plane, and solder balls mounted on bonding pads of a second signal plane. A thermally conductive via interconnect extends through the substrate to provide a thermal path from the die and signal plane (traces) through the thick conductive plane and into the solder balls and external device (e.g., mother board). The present semiconductor device provides effective heat dissipation without the attachment of an external heat sink or spreader.
Owner:MICRON TECH INC

Intrinsic thermal enhancement for FBGA package

A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) mounted on a thin support substrate and interfaced with a die. Thermally conductive via interconnects extending through the substrate conduct heat generated by the die from the conductive plane to conductive balls mounted on traces on the opposing side of the substrate. In another embodiment, the semiconductor devices comprises a thick thermally conductive plane (e.g., copper foil) sandwiched between insulative layers, with signal planes (e.g., traces, bonding pads) disposed on the insulative layers, a die mounted on a first signal plane, and solder balls mounted on bonding pads of a second signal plane. A thermally conductive via interconnect extends through the substrate to provide a thermal path from the die and signal plane (traces) through the thick conductive plane and into the solder balls and external device (e.g., mother board). The present semiconductor device provides effective heat dissipation without the attachment of an external heat sink or spreader.
Owner:MICRON TECH INC

Electric supercharging device and multi-stage supercharging system

It is intended to provide: an electric supercharging apparatus wherein, with a simple structure, rotor windage loss in an electric motor for driving a compressor is reduced and good cooling performance is produced; and a multi-stage supercharging system using the electric supercharging device. This electric supercharging apparatus is provided with: a first cooling passage formed in a stator along a motor coil and communicating a gas supply port with a gas discharge port in a motor housing; and a first intake passage connecting the gas discharge port to an intake port of a compressor. This electric supercharging apparatus is configured to introduce outside air into the first cooling passage via the gas supply port by applying negative pressure to the first cooling passage via the first intake passage, thereby cooling the inside of the motor housing.
Owner:MITSUBISHI HEAVY IND ENGINE & TURBOCHARGER LTD

Intrinsic thermal enhancement for FBGA package

A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the device and package are provided. In one embodiment, the semiconductor device comprises a thick thermally conductive plane (e.g., copper plane) mounted on a thin support substrate and interfaced with a die. Thermally conductive via interconnects extending through the substrate conduct heat generated by the die from the conductive plane to conductive balls mounted on traces on the opposing side of the substrate. In another embodiment, the semiconductor devices comprises a thick thermally conductive plane (e.g., copper foil) sandwiched between insulative layers, with signal planes (e.g., traces, bonding pads) disposed on the insulative layers, a die mounted on a first signal plane, and solder balls mounted on bonding pads of a second signal plane. A thermally conductive via interconnect extends through the substrate to provide a thermal path from the die and signal plane (traces) through the thick conductive plane and into the solder balls and external device (e.g., mother board). The present semiconductor device provides effective heat dissipation without the attachment of an external heat sink or spreader.
Owner:MICRON TECH INC

Control apparatus and method for vehicle

A control apparatus for a vehicle equipped with an automatic transmission having an apply element that is applied when the vehicle takes off from a standstill, which executes a neutral control which releases the apply element when the automatic transmission is in a forward-drive range and the vehicle is stopped with a predetermined condition being satisfied, includes a controller that detects a target idle speed of an engine and determines whether the neutral control can be executed based on the target idle speed.
Owner:TOYOTA JIDOSHA KK

Exhaust gas heat recovery unit and exhaust gas heat recovery method

An exhaust gas heat recovery unit includes a plurality of heat pipes (23) each of which includes a heater-side heat pipe portion (23a) positioned on the side of a heater (21) which heats pure water using heat of exhaust gas discharged from an engine and an evaporator-side heat pipe portion (23b) positioned on the side of an evaporator (22) which evaporates the pure water, heated at the heater-side heat pipe portion (23a), using the heat of the exhaust gas. The pitch of heater-side corrugated fins (28a) on the outer periphery of the heater-side heat pipe portion (23a) is set to substantially half the pitch of evaporator-side corrugated fins (28b) on the outer periphery of the evaporator-side heat pipe portion (23b).
Owner:TOYOTA JIDOSHA KK

Sensor control device

A sensor control device including a circuit board separate from and electrically connectable to a gas sensor, the gas sensor including a detecting element configured to output a concentration response signal in response to the concentration of a specific gas component. The circuit board has mounted thereon: a detecting element driving unit; a temperature sensing element configured to output a temperature response signal in response to a temperature of the circuit board; a temperature calculating unit; and a concentration information correcting unit configured to correct gas concentration information calculated by the detecting element driving unit based on temperature information calculated by the temperature calculating unit.
Owner:NGK SPARK PLUG CO LTD

Broadband Power Amplifier with A High Power Feedback Structure

InactiveUS20090231042A1High power feedback structureLarge optimum load impedanceSemiconductor/solid-state device detailsSolid-state devicesBroadband power amplifierPower over
A broadband power amplifier using a novel high power feedback structure is disclosed in this patent. Feedback is widely used in amplifier design to broaden the bandwidth of the amplifier. Traditionally, the feedback resistor is either an axial resistor placed over the top of the transistor or a surface mount resistor with a long PCB trace making up the rest of the feedback path. However, each of these methods has it's limitations. The axial resistor doesn't have good heat sinking capability and therefore cannot handle high power. The feedback on PCB makes the feedback path long and becomes positive feedback at high frequency, thus limiting the high end frequency of operation of the amplifier in a stable region. The feedback structure disclosed in this patent has a good heat sinking path, has very short feedback path; allowing for higher frequency operation. We successfully applied the feedback structures to a Gallium Nitride (GaN) transistor, which is a new type of power transistor that has low parasitic capacitance and high optimum load impedance, and demonstrated an amplifier with very high output power over extraordinarily broad bandwidth. Matching networks have been optimized to improve performance and stability. We have demonstrated that unconditional stability is achievable while operating over a broad bandwidth using this feedback structure.
Owner:JIA PENGCHENG +1
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