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1203 results about "Intermetallic" patented technology

An intermetallic (also called an intermetallic compound, intermetallic alloy, ordered intermetallic alloy, and a long-range-ordered alloy) is a type of metallic alloy that forms a solid-state compound exhibiting defined stoichiometry and ordered crystal structure.

Nanostructured powders and related nanotechnology

Methods to manufacture nanoscale particles comprising metals, alloys, intermetallics, ceramics are disclosed. The thermal energy is provided by plasma, internal energy, heat of reaction, microwave, electromagnetic, direct electric arc, pulsed electric arc and / or nuclear. The process is operated at some stage above 3000K and at high velocities. The invention can be utilized to prepare nanopowders for nanostructured products and devices such as ion conducting solid electrolytes for a wide range of applications, including sensors, oxygen pumps, fuel cells, batteries, electrosynthesis reactors and catalytic membranes.
Owner:PPG IND OHIO INC

Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity

A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is converted to an intermetallic layer. A layer of copper intermetallics with halfnium, lanthanum, zirconium or tin, is provided to improve the electromigration resistance and to reduce defect sensitivity. A method is also provided to form a cap atop copper lines, to improve corrosion resistance, which fully covers the surface. Structure and methods are also described to improve the electromigration and corrosion resistance by incorporating carbon atoms in copper intersititial positions.
Owner:GLOBALFOUNDRIES INC

-Zn coated steel material, ZN coated steel sheet and painted steel sheet excellent in corrosion resistance, and method of producing the same

A coated steel material excellent in corrosion resistance and a method of producing the same, wherein a coated steel material has on the surface of the steel sheet a Zn-alloy coating layer containing 1-10 wt % of Mg, 2-19 wt % of Al and 0.01-2 wt % of Si, where Mg and Al satisfy Mg (%)+Al (%)<=20%, the balance being Zn and unavoidable impurities, and has a coating layer structure of a Mg intermetallic compound or the like. As a base metal treatment, it is preferably provided with a Ni coating layer. The coated Zn-alloy coated steel sheet may have provided on the coating layer, as an intermediate layer, a chromate film layer, and, as an upper layer, an organic coating layer. The Zn-alloy coating layer may further contain one or more of 0.01-1 wt % of In, 0.01-1 wt % of Bi and 1-10 wt % of Sn. The coated steel material may be painted.
Owner:NIPPON STEEL CORP

Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity

A method of providing sub-half-micron copper interconnections with improved electromigration and corrosion resistance. The method includes double damascene using electroplated copper, where the seed layer is converted to an intermetallic layer. A layer of copper intermetallics with hafnium, lanthanum, zirconium or tin, is provided to improve the electromigration resistance and to reduce defect sensitivity. A method is also provided to form a cap atop copper lines, to improve corrosion resistance, which fully covers the surface. Structure and methods are also described to improve the electromigration and corrosion resistance by incorporating carbon atoms in copper interstitial positions.
Owner:GLOBALFOUNDRIES INC

Fabrication of interleaved metallic and intermetallic composite laminate materials

InactiveUS7188559B1Well formedLimit cracking and fracturingWeapon componentsDomestic articlesGramComposite laminates
Typically 20–40 films of a tough first metal, normally 0.1–1.0 mm thick films of titanium, nickel, vanadium, and / or steel (iron) and alloys thereof, interleaved with a like number of films of a second metal, normally 0.1–1.0 mm thick films of aluminum or alloys thereof, are pressed together in a stack at less than 6 MPa and normally at various pressures 2–4 MPa while being gradually heated in the presence of atmospheric gases to 600–800° C. over a period of, typically, 10+ hours until the second metal is completely compounded; forming thus a metallic-intermetallic laminate composite material having (i) tough first-metal layers separated by (ii) hard, Vickers microhardness of 400 kg / mm2+, intermetallic regions consisting of an intermetallic compound of the first and the second metals. The resulting composite material is inexpensive, lightweight with a density of typically 3 to 4.5 grams / cubic centimeter, and very hard and very tough to serve as, among other applications, lightweight armor. Upon projectile impact (i) the hard intermetallic, ceramic-like, layers are confined by the tough metal layers while (ii) cracking and fracturing is blunted and channeled in directions orthogonal to the axis of impact.
Owner:RGT UNIV OF CALIFORNIA

Process for the production of elemental material and alloys

The present invention relates to a process for the production of an elemental material, comprising the step of reacting a halide of the elemental material with a reducing agent in solid form in a fluidized bed reactor at a reaction temperature which is below the melting temperature of the reducing agent. In a preferred embodiment of the present invention, the elemental material is titanium and the titanium is produced in powder form. The invention also relates to the production of alloys or intermetallics of the elemental materials.
Owner:MILLENNIUM INORGANIC CHEM

Ai-ni-la system ai-based alloy sputtering target and process for producing the same

The invention relates to an Al—Ni—La system Al-based alloy sputtering target comprising Ni and La, wherein, when a section from (¼)t to (¾)t (t: thickness) in a cross section vertical to a plane of the sputtering target is observed with a scanning electron microscope at a magnification of 2000 times, (1) a total area of an Al—Ni system intermetallic compound having an average particle diameter of 0.3 μm to 3 μm with respect to a total area of the entire Al—Ni system intermetallic compound is 70% or more in terms of an area fraction, the Al—Ni system intermetallic compound being mainly composed of Al and Ni; and (2) a total area of an Al—La system intermetallic compound having an average particle diameter of 0.2 μm to 2 μm with respect to a total area of the entire Al—La system intermetallic compound is 70% or more in terms of an area fraction, the Al—La system intermetallic compound being mainly composed of Al and La.
Owner:KOBE STEEL LTD +1

Cobalt-base alloy with high heat resistance and high strength and process for producing the same

A Co-base alloy which has a basic composition including, in terms of mass proportion, 0.1%-10% Al, 3.0-45% W, and Co as the remainder and has an intermetallic compound of the Ll2 type [Co3(Al,W)] dispersed and precipitated therein. Part of the Co may be replaced with Ni, Ir, Fe, Cr, Re, or Ru, while part of the Al and W may be replaced with Ni, Ti, Nb, Zr, V, Ta or Hf. The intermetallic compound [Co3(Al, W)] has a high melting point, and this compound and the matrix are mismatched little with respect to lattice constant. Thus, the cobalt-base alloy can have high-temperature strength equal to that of nickel-base alloys and excellent structure stability.
Owner:JAPAN SCI & TECH CORP

Method of welding titanium and titanium based alloys to ferrous metals

A method of welding titanium, and titanium based alloys, to ferrous metals is described. Welding of titanium, and titanium based alloys, is plagued with poor quality and highly brittle welds, substantially due to formation of Ti—Fe intermetallics in the weld pool. The instant invention provides supplementary filler material to alter the proportions of various elements in the weld pool. Certain fillers, such as nickel or iron, added to the weld pool enable high quality welds to be fabricated utilizing a wide variety of fusion welding techniques, including laser welding, between titanium, or titanium based alloys, and ferrous metals, including but not limited to the welding of nickel-titanium and stainless steel. Filler material may be supplied in various forms, including foil, wire, powders, preformed gaskets, and numerous others. Optionally, the titanium or titanium based alloy may be stress relieved to achieve full recovery of the shape memory strain prior to welding.
Owner:EDISON WELDING INSTITUTE INC

High-temperature composite articles and associated methods of manufacture

The present invention provides a method for forming a refractory metal-intermetallic composite. The method includes providing a first powder comprising a refractory metal suitable for forming a metal phase; providing a second powder comprising a silicide precursor suitable for forming an intermetallic phase; blending the first powder and the second powder to form a powder blend; consolidating and mechanically deforming the powder blend at a first temperature; and reacting the powder blend at a second temperature to form the metal phase and the intermetallic phase of the refractory metal-intermetallic composite, wherein the second temperature is higher than the first temperature.
Owner:GENERAL ELECTRIC CO

Abrasion resistant iron base sintered alloy material for valve seat and valve seat made of iron base sintered alloy

InactiveUS6139599AAbrasion resistance of the sintered alloy material is remarkably increasedIncrease resistanceMachines/enginesSlide valveCarbideHardness
A valve seat made of an iron base sintered alloy for internal combustion engines comprises of hard particles of hardness 700-1300 Hv dispersed by 3-20% by volume in a matrix phase comprising comprising of a 5-40% psarlite phase, a 20-60% fine carbide dispersed phase, and a 5-20% high alloy diffusd phase. The hard paricles are preferably selected from a group of Mo-Ni-Cr-Si-Co intermetallic compound particles, Cr-Mo-Co intermetallic compound particles, and Fe-Mo alloy particles. The iron base sinteed alloy is conpised of, by weight, C: 0.2-2.0%, Cr: 1.0-9.0%, Mo: 1.0-9.0%, Si: 0.1-1.0%, W: 1.0-50%, V: 0.2-3.0%, one or more Cu, Co and Ni of 0.5-10.0% in total, and the remainder substantial Fe.
Owner:NIPPON PISTONRING CO LTD

Method of Forming a Self Aligned Copper Capping Layer

InactiveUS20080311739A1Prevent further spreadPreventing inter-metal line leakageSemiconductor/solid-state device detailsSolid-state devicesCopper interconnectChemical exposure
A method of forming a capping layer on a copper interconnect line (14). The method comprises providing a layer (20) of Aluminium over the interconnect line (14) and the dielectric layer (10) in which it is embedded. This may be achieved by deposition or chemical exposure. The structure is then subjected to a process, such as annealing or further chemical exposure, in an environment containing, for example, Nitrogen atoms, so as to cause indiffusion of Al into the copper line (14) and nitridation to form a diffusion barrier 26 of the intermetallic compound CuAlN.
Owner:NXP BV

Plated steel product, plated steel sheet and precoated steel sheet having excellent resistance to corrosion

Provided are a Zn coated steel material, a Zn coated steel sheet and a painted steel sheet excellent in corrosion resistance, and a method of producing the same. Specifically, there is provided coated steel material excellent in corrosion resistance and a method of producing the same, which coated steel material is characterized in that it has, on the surface of steel sheet, a Zn-alloy coating layer containing 1 - 10 wt% of Mg, 2 - 19 wt% of Al and 0.01 - 2 wt% of Si, where Mg and Al satisfy Mg(%) + Al(%) ≤ 20%, the balance being composed of Zn and unavoidable impurities, and has a coating layer structure of a Mg intermetallic compound or the like. As a base metal treatment, it is preferably provided with a Ni coating layer. Also provided are a coated Zn coated steel sheet provided on the coating layer with, as an intermediate layer, a chromate film layer, and further with, as an upper layer, an organic coating layer, and a Zn coated steel sheet excellent in corrosion resistance provided on the coating layer with, as an upper layer, a chromate film, formed by coating with a resin chromate bath and drying, at 10 - 300 mg / m<2> as metallic chromium. The Zn-alloy coating layer according to the present invention may further contain one or more of 0.01 - 1 wt% of In, 0.01 - 1 wt% of Bi and 1 - 10 wt% of Sn. Further provided is a painted steel sheet having on the Zn-alloy coating layer a base metal treatment film layer containing 100 parts by weight of resin as solid content and 0.2 - 50 parts by weight of tannin or tannic acid and on the base metal treatment film layer, as an upper layer, an organic coating layer. Preferably the Zn-alloy coating layer further contains 0.01 - 2 wt% of Si, the base metal treatment film layer further contains 10 - 500 parts by weight of fine-grain silica as solid content, the organic coating layer is composed of an undercoating containing an anti-rust pigment and a colored overcoating, and a Ni coating layer is present under the zn-alloy coating layer. Further provided is a painted steel sheet having a base metal treatment film layer containing 100 parts by weight of resin as solid content and 0.1 - 3,000 parts by weight of a silane coupling agent and on the base metal treatment film layer, as an upper layer, an organic coating layer. The Zn-alloy coating layer can contain 0.01 - 2 wt% of Si and the base metal treatment film layer can further contain, as solid content, one or both of 1 - 200 parts by weight of fine-grain silica and 0.1 - 1,000 parts by weight of an etching fluoride. Moreover, a structure is present wherein intermetallic compound phase of 1 mu m or greater major diameter is dispersed in the Zn-alloy coating layer at a content of 0.1 - 50 vol%.
Owner:NIPPON STEEL CORP

Stable Gold Bump Solder Connections

A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2 intermetallic is adjacent to the gold bump. A region (208) of binary AuSn4 intermetallic is adjacent to the first AuSn2 region. Then, a region (209) of binary gold-tin solid solution is adjacent to the AuSn4 region, and a second region (210) of binary AuSn2 intermetallic is adjacent to the solid solution region. The second AuSn2 region is adjacent to a nickel layer (213) (preferred thickness about 0.08 μm), which covers the copper pad. The nickel layer insures that the gold / tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump / solder connections.
Owner:TEXAS INSTR INC

Method for preparing and applying single orientation Cu6Sn5 intermetallic compound micro-interconnecting welding point structure

The invention provides a method for preparing and applying a single orientation Cu6Sn5 intermetallic compound micro-interconnecting welding point structure. The method for preparing the single orientation Cu6Sn5 intermetallic compound micro-interconnecting welding point structure comprises the first step of arraying a Cu welding disc on a wafer through the electroplating technology, the second step of manufacturing bosses by preparing brazing filler metal prepared on the Cu welding disc, the third step of carrying out hot-wind remelting on the manufactured bosses for 30s-120s, the fourth step of carrying out solid-phase aging processes on chips obtained in the third step, the fifth step of placing the welding point bosses prepared in the fourth step into hydrochloric acid, oscillating the welding point bosses through ultrasound, washing and drying the welding point bosses to obtain a preferred orientation Cu6Sn5 welding disc, the sixth step of reversely buckling the welding point bosses prepared in the fifth step into a corresponding circuit board Cu metal layer, and obtaining the single orientation Cu6Sn5 intermetallic compound micro-interconnecting welding point structure through the reflow welding technology. Uniform and stable welding point structure can be obtained when the single orientation Cu6Sn5 intermetallic compound micro-interconnecting welding point structure is applied to large two-level packaging at the appropriate conditions.
Owner:HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL +3

TiAl intermetallic compound-based solid seif-lubricating composite material and preparation method thereof

InactiveCN102492871AMake fastFast preparationAl powderCompound matrix
The invention relates to a TiAl intermetallic compound-based solid seif-lubricating composite material which comprises Ti3SiC2, Ti2AlC and C which are used as the ternary composite lubricating phase and TiC which is used as the reinforced phase, and a preparation method thereof. The TiAl intermetallic compound-based solid seif-lubricating composite material is characterized in that the material is prepared from Ti powder, Al powder, Cr powder, Nb powder, B powder and Ti3SiC2 powder, wherein the molar ratio of Ti, Al, Cr, Nb and B is 48:47:2:2:1 and the dosage of the Ti3SiC2 powder is 5-20wt.% of the total weight of the Ti powder, Al powder, Cr powder, Nb powder and B powder. The TiAl / Ti3SiC2-Ti2AlC-C / TiC intermetallic compound-based solid seif-lubricating composite material synthesized by the method is novel in component design (the intermetallic compound matrix, the composite lubricating phase and the reinforced phase), high in density, good in tribological properties, stable in technological parameters, fast and simple in preparation process and easy in operation and the method is suitable to be used to prepare the high performance TiAl intermetallic compound-based solid seif-lubricating composite material.
Owner:WUHAN UNIV OF TECH

Nano intermetallic compound soldering paste and preparation method thereof

The invention discloses nano intermetallic compound soldering paste and a preparation method thereof, belonging to the field of material technologies. The nano intermetallic compound soldering paste disclosed by the invention comprises the following materials in mass ratio: 80-90 of nano intermetallic compound particles, 2-8 of dispersant, 2-8 of binder, 2-8 of thinner and 2-8 of soldering flux. The specific method comprises the following steps of: preparing the nano intermetallic compound particles by using a co-precipitation hydrothermal reduction method; mixing the prepared nano intermetallic compound particles with the dispersant, the binder, the thinner and the soldering flux; uniformly dispersing the obtained mixture in an organic solvent by using an ultrasonic oscillation, manual stirring or mechanical stirring method; and volatilizing an excess solvent, so that the nano intermetallic compound soldering paste is prepared. The soldering paste takes nano intermetallic compound particles as solid components, and by using the size effect of nano materials, an interconnection process at a temperature lower than the melting point temperature of a block is realized, thereby avoiding the high-temperature damages to components, avoiding the overreaction of a connection interface, achieving an effect of long-term high-temperature serving, and reducing the packaging cost.
Owner:HARBIN INST OF TECH

Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member

A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu3Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu6Sn5 intermetallic compound layer is formed thereon. A Cu atomic site in the Cu6Sn5 intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu6Sn5 intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.
Owner:NIPPON STEEL CHEMICAL CO LTD +1

Coating systems containing beta phase and gamma-prime phase nickel aluminide

A coating and process for depositing the coating on a substrate. The coating is a nickel aluminide overlay coating of predominantly the beta (NiAl) and gamma-prime (Ni3Al) intermetallic phases, and is suitable for use as an environmental coating and as a bond coat for a thermal barrier coating (TBC). The coating can be formed by depositing nickel and aluminum in appropriate amounts to yield the desired beta+gamma prime phase content. Alternatively, nickel and aluminum can be deposited so that the aluminum content of the coating exceeds the appropriate amount to yield the desired beta+gamma prime phase content, after which the coating is heat treated to diffuse the excess aluminum from the coating into the substrate to yield the desired beta+gamma prime phase content.
Owner:GENERAL ELECTRIC CO

Plate

Plate consisting of a steel substrate (1) and a precoat (2) consisting of a layer of intermetallic alloy (3) in contact with said substrate, topped by a layer of metal alloy (4), characterized in that, on at least one precoated face of said plate, an area (6) situated at the periphery of said plate has said metal alloy layer removed.
Owner:ARCELORMITTAL INVESTIGACION Y DESARROLLO SL

Sintered composites containing superabrasive particles

This invention provides a composite product and an effective method for producing the same, based on an SHS or intense heat producing process. Said composite essentially comprises either (1) one or more skeletal structures of three dimensionally joined pieces of at least one ceramic material selected from carbide, boride, nitride and silicide of titanium, zirconium, tantalum, niobium, silicon, chromium, tungsten, and molybdenum, and metallic material of alloy and / or intermetallic compound which fills the gaps within each and between adjacent skeletal structures, or (2) a matrix consisting of SHS products of metallic and / or ceramic substances, and particles of superabrasive selected from diamond and high pressure polymorphism of boron nitride, which are held and distributed in the matrix in the whole, in the surface or surface area comprising the portion corresponding to the end working face. Also effective is the use of superabrasive particles coated with metallic and / or non-metallic materials by some specific techniques.
Owner:2 KANAGAWA +3

Microchannel heat exchangers and methods of manufacturing the same

A heat exchanger device includes an extruded body that includes one or more layers of channels for coolant flow therethrough, the channels generally having inner diameters of between about 50 microns to about 2000 microns. The device is formed of a material having a high thermal conductivity to facilitate transfer of heat from the heating components present in the subject cooling application to the coolant passing through the heat exchanger and to be compatible with materials of the heating components. The device material is selected from the group consisting of ceramic oxides, ceramic carbides, ceramic nitrides, ceramic borides, ceramic suicides, metals, and intermetallics, and combinations thereof. The heat exchanger device is formed from an extruded filament that is arranged to give the desired channel configuration. The filament includes a central, removable material and an outer material that forms the channel walls upon removal of the central material.
Owner:ADVANCED CERAMICS

Methods for processing metal alloys

A method of processing a metal alloy includes heating to a temperature in a working temperature range from a recrystallization temperature of the metal alloy to a temperature less than an incipient melting temperature of the metal alloy, and working the alloy. At least a surface region is heated to a temperature in the working temperature range. The surface region is maintained within the working temperature range for a period of time to recrystallize the surface region of the metal alloy, and the alloy is cooled so as to minimize grain growth. In embodiments including superaustenitic and austenitic stainless steel alloys, process temperatures and times are selected to avoid precipitation of deleterious intermetallic sigma-phase. A hot worked superaustenitic stainless steel alloy having equiaxed grains throughout the alloy is also disclosed.
Owner:ATI PROPERTIES LLC

Solder Paste, Joining Method Using the Same and Joined Structure

A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.
Owner:MURATA MFG CO LTD

Production of ultrafine metal carbide particles utilizing polymeric feed materials

The production of ultrafine metal carbide powders from polymeric powder and metallic precursor powder starting materials is disclosed. In certain embodiments, the polymeric powder may comprise polypropylene, polyethylene, polystyrene, polyester, polybutylene, nylon, polymethylpentene and the like. The metal precursor powder may comprise pure metals, metal alloys, intermetallics and / or metal-containing compounds such as metal oxides and nitrides. In one embodiment, the metal precursor powder comprises a silicon-containing material, and the ultrafine powders comprise SiC. The polymeric and metal precursor powders are fed together or separately to a plasma system where the feed materials react to form metal carbides in the form of ultrafine particles.
Owner:PPG IND OHIO INC

Multilayer ceramic electronic component and method for making the same

A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surface, an internal conductor including nickel, the internal conductor being disposed in the ceramic body and having an exposed portion exposed at least one of the side surfaces, and an external terminal electrode disposed on at least one of the side surfaces of the ceramic body, the external terminal electrode being electrically connected to the internal conductor. The external terminal electrode includes a first conductive layer including a Sn—Cu—Ni intermetallic compound, the first conductive layer covering the exposed portion of the internal conductor at least one of the side surfaces of the ceramic body.
Owner:MURATA MFG CO LTD
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