976results about How to "Improve long-term reliability" patented technology

The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.

A solar tracking system with a torque tube supporting solar panels. Columns support the system and have bearings for rotation of the torque tube. A drive is coupled to the torque tube and is driven by a gearbox, such as a worm gear assembly, for rotating the array of solar panels to follow the sun's diurnal motion. The array can rotate in an opposite direction, or backtrack, to prevent shadowing from one module row to another. Multiple gearboxes can be mechanically linked by drive shafts and driven by a single motor. The drive shafts may incorporate universal joints for uneven terrain or staggered configurations. Harmonic dampers can be affixed to the solar panels to decouple wind forces which allows the use of larger solar panels.

The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.

A photovoltaic element comprising an electrode comprising an electrically conductive core member which is coated with a conductive adhesive fixed on the light incident surface of a photoactive semiconductor layer, via the conductive adhesive, is disclosed.The conductive adhesive is composed of at least two layers. The softening point of the conductive adhesive layer nearer to the core member is higher than the highest temperature encountered in the manufacture of the photovoltaic element.

A semiconductor display device with an interlayer insulating film in which surface levelness is ensured with a limited film formation time, heat treatment for removing moisture does not take long, and moisture in the interlayer insulating film is prevented from escaping into a film or electrode adjacent to the interlayer insulating film. A TFT is formed and then a nitrogen-containing inorganic insulating film that transmits less moisture compared to organic resin film is formed so as to cover the TFT. Next, organic resin including photosensitive acrylic resin is applied and an opening is formed by partially exposing the organic resin film to light. The organic resin film where the opening is formed, is then covered with a nitrogen-containing inorganic insulating film which transmits less moisture than organic resin film does. Thereafter, the gate insulating film and the two layers of the nitrogen-containing inorganic insulating films are partially etched away in the opening of the organic resin film to expose the active layer of the TFT.

A semiconductor device includes a semiconductor element formed on a semiconductor substrate, a first interconnect formed over the semiconductor substrate so as to be electrically connected with the semiconductor element, and a second interconnect formed over the first interconnect with an interlevel insulation film made of an insulator having a lower dielectric constant than a dielectric constant of silicon oxide interposed between the first interconnect and the second interconnect. Furthermore, the semiconductor device includes a first dummy interconnect formed in part of the semiconductor substrate located in the vicinity of the first interconnect or the second interconnect.

Disclosed herein is a thin film transistor including: a semiconductor layer including an amorphous oxide, and a source electrode and a drain electrode which are provided in contact with the semiconductor layer. The source electrode and the drain electrode are formed by use of iridium or iridium oxide.

A semiconductor device includes a semiconductor substrate, a circuit part formed on and above the semiconductor substrate, a passivation film covering the circuit part, an electrode pad provided outside the circuit part in such a manner that the electrode pad is exposed from the passivation film, and a guard ring pattern provided between the electrode pad and the circuit part such that the guard ring pattern surrounds the circuit part substantially. The guard ring pattern extends from a surface of the semiconductor substrate to the passivation film.

A first waveguide has a top face positioned in an oil well borehole for wetting by returning drilling mud from a drill bit as drilling progresses. A second waveguide is positioned in the borehole for wetting by new drilling mud being pumped to the drill bit. MIR light rays are fed from an MIR light source into the first and second waveguides for causing evanescent waves to be generated by each waveguide for reacting with the molecules of the associated drilling mud, respectfully, whereby a modulated optical signal representative of spectra of components and particles in the associated drilling mud, respectively, are emitted from each waveguide. The modulated optical signals are converted to electrical signals, subtracted from one another to remove common mode signals, and passed into a processor programmed for extracting the spectra hydrocarbon components contained in the returning drilling mud as the result of the drilling activity.

A socket housing and method of making the socket housing. A plurality of dielectric layers are printed with a plurality of recesses on a substrate. The dielectric layers include at least two different dielectric materials. A sacrificial material is printed ted in the recesses. The assembly is removed from the substrate and the sacrificial material is removed from the recesses. At least one contact member is located in a plurality of the recesses. Distal ends of the contact members are adapted to electrically couple with circuit members.

In a display device including, a display area having a plurality of organic EL devices on a substrate; a peripheral area having a driving circuit for the organic EL devices and surrounding the display area on the substrate; and an organic insulating film covering at least the driving circuit, the organic insulating film has a separating groove which divides itself into the inner part and outer part at the periphery of the display area.

A self-contained LED lighting assembly for use in a refrigerated cabinet contains a plurality of LEDs mounted upon a substrate, each using a refractive lens designed to evenly disperse the light emitted from each LED into a flat, wide pattern suitable for lighting the contents of the cabinet. Heat is effectively removed from each LED and transported to an interior air space within the LED lighting assembly housing. The system is designed to replace current lighting systems and is sized fit within the space provided for current lighting systems, without the need for substantial modification, cutting, or removal of the current lighting systems. The assembly may be composed of individual LED lighting modules wired end-to-end to provide a desired length of strip lighting. Upon complete installation, the system provides the same or better lighting using only a fraction of the power required by the system replaced.

Embodiments of the invention provide microphone assemblies which are resistant to moisture. One embodiment provides a microphone assembly comprising a housing, a diaphragm disposed in the housing and a backplate disposed in the housing. The housing includes a sound inlet port for the entry of sound waves. The backplate includes a surface and an electret portion having an embedded permanent charge. The diaphragm is configured to vibrate in response to sound waves entering the housing. The vibrations of the diaphragm interact with the electret portion to produce an electrical signal associated with the sound waves entering the housing. A hydrophobic coating can be applied to one or both of the backplate and diaphragm surfaces so as to reduce condensation and / or wetting of the backplate. This minimizes neutralization of an electric field of the backplate surface from condensation preserving the field and the function of the microphone in humid environments.

A plasma space containing an ionized inert gas is formed in contact with a deposition surface and a surface of a sputtering target containing a polycrystalline oxide including a plurality of crystal grains with randomly oriented c-axes. A flat-plate-like sputtered particle is separated from a cleavage plane corresponding to a-b planes of the plurality of crystal grains by collision of the ionized inert gas with the surface of the sputtering target. The flat-plate-like sputtered particle is transferred to the deposition surface through the plasma space with its flat-plate-like shape substantially maintained. The flat-plate-like sputtered particle and another flat-plate-like sputtered particle charged with the same polarity repel each other and are deposited on the deposition surface so as to be adjacent to each other on a plane such that the c-axes are substantially perpendicular to the deposition surface.

In a stacked display device with light-emitting units composed of organic layers and stacked together, the use of a stable material in at least a portion of a charge generation layer makes it possible to achieve improvements in environmental stability and also to attain an improvement in the efficiency of injection of charges from the charge generation layer into the light-emitting units. The display device can be readily fabricated. In a display device (11) provided with a plurality of light-emitting units (14-1)(14-2), each of which includes at least an organic light-emitting layer (14c), stacked together between a cathode (16) and an anode (13), and also with a charge generation layer (15) held between the respective light-emitting units (14-1)(14-2), at least a portion of the charge generation layer (15) is composed of an oxide or fluoride which contains at least one of alkali metals and alkaline earth metals.

Provided is a highly reliable acoustic wave device wherein deterioration of electrical characteristics due to deformation of a protective cover is suppressed. A method for manufacturing such acoustic wave device is also provided. The acoustic wave device has a piezoelectric substrate 1 propagating an acoustic wave; an excitation electrode arranged on a first main surface of the piezoelectric substrate 1; a columnar outside connection-use electrode 10 electrically connected to the excitation electrode; a protective cover 17 having a hollow accommodating space 8 in which the excitation electrode is accommodated on the first main surface; and a conductive layer 18 connected to the electrode 10 on the protective cover 17.

The present invention provides a highly reliable energy storage device capable of preventing a reaction current from flowing in a carbon nanotube electrode by ionizing a catalyst metal or a substrate metal to cause the metal to flow out to an electrolytic solution. An energy storage device of the present invention includes: at least a pair of electrode bodies that are a cathode and an anode; and an electrolytic solution. At least one of the electrode bodies is configured such that a layer of carbon nanotubes is formed on an electric conductor. A coupling region where one ends of the carbon nanotubes are coupled to and electrically connected to the electric conductor and a non-coupling region where ends of the carbon nanotubes are not coupled to the electric conductor are formed on a surface of the electric conductor. The carbon nanotubes having one ends connected to the coupling region are toppled to cover a surface of the non-coupling region.

A pumping machine, that can serve a system as the sole main pump for pressurizing a primary liquid flow, incorporates, in a single machine, a rotor-drum type AP (axial piston) pump and a PX (pressure exchanger) that recovers energy from a secondary liquid flow such as the brine discharge from an RO seawater desalination system, with benefits including fewer moving parts and small machine size along with lower capital and operating costs. A single rotor-drum containing the cylinders and pistons is located between two end blocks, one or both configured with manifold passageways, ports and sliding valves. A swash-plate at one end reciprocates the pistons axially when the rotor-drum is rotated. Two working chambers, primary and secondary, are formed at opposite ends of a single piston in each cylinder, thus enabling the single rotor-drum to function as a primary liquid-pressurizing axial pump (AP) with sliding valves at the primary end enabling primary liquid pumping, and as a secondary outflow-driven pressure exchanger (PX) recovering energy from pressure drop in the secondary liquid flow and thus contributing work to primary pumping, saving energy and reducing operating costs.

A semiconductor device includes a peripheral voltage withstanding structure, which includes an n− SiC layer, an n SiC layer and a p SiC layer are provided successively on an n+ SiC layer. A trench is formed in the peripheral voltage withstanding structure portion so that the trench passes through the p SiC layer 15 and the n SiC layer 14 and reaches the n− SiC layer. This trench is wider than a trench having a trench gate structure in the active region portion. A p+ SiC region is provided along a bottom of the trench so as to be located under the trench. A sidewall and the bottom of the trench are covered with an oxide film and an insulating film having a total thickness not smaller than 1.1 μm. The oxide film and insulating film absorb a large part of a voltage applied between a source and a drain.

A semiconductor device includes a substrate for transmitting light, a wiring layer provided on the substrate, a semiconductor chip formed on the wiring layer, a columnar electrode, a sealant, and an external connection terminal electrically connected to the semiconductor chip via the wiring layer and protruding electrode. The device includes a cut surface formed by dicing and constituted by only the substrate and the sealant. Since the cut surface has a single-layer structure as a result of forming the sealant in a single step, moisture cannot infiltrate through the sealant, hence a device resistant to corrosion and operational defects is provided.

A bonding structure and a copper bonding wire for semiconductor device include a ball-bonded portion formed by bonding to the aluminum electrode a ball formed on a front end of the copper bonding wire. After being heated at any temperature between 130° C. and 200° C., the ball-bonded portion exhibits a relative compound ratio R1 of 40-100%, the relative compound ratio R1 being a ratio of a thickness of a Cu—Al intermetallic compound to thicknesses of intermetallic compounds that are composed of Cu and Al and formed on a cross-sectional surface of the ball-bonded portion.

Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.

The present invention relates to the field of solar cells, and in particular to a main-gate-free and high-efficiency back-contact solar cell module, a main-gate-free and high-efficiency back-contact solar cell assembly, and a preparation process thereof. The solar cell module, comprising cells and an electrical connection layer, a backlight side of the cells having P-electrodes connected to a P-type doping layer and N-electrodes connected to a N-type doping layer, is characterized in that the electrical connection layer comprises a number of parallel leads each electrically connected to the P-electrodes or the N-electrodes. The present invention has the beneficial effect that a main-gate-free and high-efficiency back-contact solar cell module, a main-gate-free and high-efficiency back-contact solar cell assembly, and a preparation process thereof are provided, which can effectively the short-circuiting of the P-electrodes and the N-electrodes and has the advantages of low cost, high hidden-cracking resistance, high efficiency and high stability.

A light extraction product (1) for a semiconductor light emitting device is provided with a concavo-convex structure layer (11), provided with a concavo-convex structure (11a) on a surface thereof, having a first refractive index (n1) and a light extraction layer (12), provided on the convex portion of the concavo-convex structure (11a), having a second refractive index (n2), where in a first light extraction layer (12a) a distance Lcv between an average position Sh of tops of the convex-portions and a convex-portion upper interface average position Scv of the first light extraction layer (12a) meets equation (1) 10 nm≦Lcv≦5000 nm, in the concavo-convex structure (11a) a convex-portion average height H meets equation (2) 10 nm≦H≦5000 nm, an average pitch P meets equation (3) 50 nm≦P≦5000 nm, and the distance Lcv and the convex-portion average height H meet equation (4) 50 nm≦Lcv+H≦6000 nm. It is possible to improve light extraction efficiency from the semiconductor light emitting device using the light extraction product (1), and further to enhance long-term reliability of the semiconductor light emitting device.

The invention is generally related to a polymer / liquid crystal composite, which includes a liquid crystal material which exhibits an optically isotropic liquid crystal phase in the temperature range of approximately 5° C. or more in the elevated temperature process but does not exhibit a nematic phase; and a polymer, and which is used for an element driven in a state of the optically isotropic liquid crystal phase.

A binder resin emulsion for energy device electrodes is provided that is used in energy device electrodes and more particularly that is used as a binder to dispose an active material on the current collector of such an electrode. An energy device electrode and energy device that use this emulsion are also provided. A binder resin emulsion for energy device electrodes is used that comprises: a copolymer of an α,β-unsaturated carboxylic acid and an α-olefin that has been neutralized with a neutralizing agent; and water. Also, an energy device electrode and an energy device that use this binder resin emulsion are utilized.

An electronic package for containing at least a top packaging module vertically stacked on a bottom packaging module. Each of the packaging modules includes a semiconductor chip packaged and connected by via connectors and connectors disposed on a laminated board fabricated with a standard printed-circuit board process wherein the top and bottom packaging module further configured as a surface mountable modules for conveniently stacking and mounting to prearranged electrical contacts without using a leadframe. At least one of the top and bottom packaging modules is a multi-chip module (MCM) containing at least two semiconductor chips. At least one of the top and bottom packaging modules includes a ball grid array (BGA) for surface mounting onto the prearranged electrical contacts. At least one of the top and bottom packaging modules includes a plurality of solder bumps on one of the semiconductor chips for surface mounting onto the prearranged electrical contacts. The laminated board of the bottom packaging modules further has a thermal expansion coefficient substantially the same as a printed circuit board (PCB) whereby a surface mount onto the PCB is less impacted by a temperature change