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Nano intermetallic compound soldering paste and preparation method thereof

A technology of intermetallic compounds and nano-metals, applied in the field of materials, can solve the problems of incompatibility between manufacturability and high temperature reliability, high energy consumption of spray pyrolysis, and decreased reliability of connection interfaces, etc., achieving huge development potential and application Foreground, time-saving interconnection process, good shape effect

Active Publication Date: 2013-02-13
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, too high connection temperature will cause high temperature damage to components, and the excessive reaction of the connection interface at high temperature will easily lead to the formation of excessive intermetallic compounds and the decrease of the reliability of the connection interface, that is, manufacturability and high temperature reliability cannot be achieved at the same time.
[0004] Nano-silver solder paste realizes low-temperature connection and high-temperature service. According to the size effect of nanoparticles, the melting point can be reduced to below 100°C, and the connection can be realized at 150°C, and the service temperature of its joint can reach above 300°C, which realizes low-temperature connection. High temperature service; however, the connection process takes a long time (when the connection temperature is 150°C, the connection time needs to be more than 30 minutes to form a stable connection), the joint is porous structure (the porosity is about 15%, which affects the electrical and thermal conductivity), The high cost restricts the wide application of this material
[0005] Most of the methods for preparing nano-scale intermetallic compounds have certain limitations, such as: the high-energy ball milling method consumes a lot of energy, the particle size of the product is uneven, and impurities are easy to introduce. The product produced by the solution reaction method is mainly dendritic, and the product produced by the inverse microemulsion method It is amorphous, the energy consumption of the electron beam irradiation method is low, and the output is high, while the spray pyrolysis method consumes a lot of energy and the collection rate is low

Method used

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  • Nano intermetallic compound soldering paste and preparation method thereof
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specific Embodiment approach 1

[0021] Specific implementation mode one: as figure 1 and 2 As shown, this embodiment combines the preparation of Cu 6 sn 5 The concrete method of nano solder paste is described in detail to the present invention:

[0022] Step 1: will contain CuCl 2 and SnCl 2 The metal salt of the metal salt is used as a precursor, placed in the polytetrafluoroethylene lining of the autoclave according to the ratio of 2:1~1.2:1;

[0023] Step 2: Add water to the autoclave to 60-80% of its volume;

[0024] Step 3: Add an appropriate amount of reducing agent and complexing agent, immediately seal the autoclave, pressurize to 1.2MPa, and heat to 80~110°C, wherein the reducing agent can be KBH 4 , N 2 h 4 Or Zn, complexing agent can be propylene diamine;

[0025] Step 4: After reacting for 5-20 hours, cool the autoclave to room temperature naturally, and take out the precipitated product for later use;

[0026] Step 5: Place the above precipitated product in a centrifuge for centrifugat...

specific Embodiment approach 2

[0031] Specific embodiment two: This embodiment combines the preparation of Ni 3 sn 4 The concrete method of nano solder paste is described in detail to the present invention:

[0032] Step 1: will contain NiCl 2 and SnCl 2 As a precursor, the metal salt is placed in the polytetrafluoroethylene lining of the autoclave according to the ratio of 3:4;

[0033] Step 2: Add water to the autoclave to 60-80% of its volume;

[0034] Step 3: Add an appropriate amount of reducing agent and complexing agent, immediately seal the autoclave, pressurize to 1.2MPa, and heat to 80~110°C, wherein the reducing agent can be KBH 4 , the complexing agent can be propylene diamine;

[0035] Step 4: After reacting for 5-20 hours, cool the autoclave to room temperature naturally, and take out the precipitated product for later use;

[0036] Step 5: Place the above precipitated product in a centrifuge for centrifugation, wash with deionized water, and then wash with ethanol three times;

[0037]...

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Abstract

The invention discloses nano intermetallic compound soldering paste and a preparation method thereof, belonging to the field of material technologies. The nano intermetallic compound soldering paste disclosed by the invention comprises the following materials in mass ratio: 80-90 of nano intermetallic compound particles, 2-8 of dispersant, 2-8 of binder, 2-8 of thinner and 2-8 of soldering flux. The specific method comprises the following steps of: preparing the nano intermetallic compound particles by using a co-precipitation hydrothermal reduction method; mixing the prepared nano intermetallic compound particles with the dispersant, the binder, the thinner and the soldering flux; uniformly dispersing the obtained mixture in an organic solvent by using an ultrasonic oscillation, manual stirring or mechanical stirring method; and volatilizing an excess solvent, so that the nano intermetallic compound soldering paste is prepared. The soldering paste takes nano intermetallic compound particles as solid components, and by using the size effect of nano materials, an interconnection process at a temperature lower than the melting point temperature of a block is realized, thereby avoiding the high-temperature damages to components, avoiding the overreaction of a connection interface, achieving an effect of long-term high-temperature serving, and reducing the packaging cost.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to a solder paste and a preparation method thereof, in particular to a nano-intermetallic compound solder paste which can be used for the packaging, assembly and interconnection of electronic devices, and whose actual service temperature is higher than its soldering temperature and its preparation method. Background technique [0002] The development of the electronics industry puts forward requirements for multi-functionality, high performance, and high density of electronic components. The continuous miniaturization of solder joints has made the problem of heat dissipation increasingly prominent. Since entering the lead-free era in 2006, lead-free as an alternative material However, lead solder or conductive adhesive exhibits poor high-temperature performance. In order to ensure the reliability of the packaging system, it can only be achieved by limiting the integration density or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B22F9/24B22F1/00
Inventor 王春青钟颖杭春进
Owner HARBIN INST OF TECH
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