1118 results about "Cooling power" patented technology

The present invention relates to a cold plate for cooling electronic components comprising a base having a top surface onto which at least one electronic component is to be placed; a cooling well formed in the top of the base and open at the top; a feed channel formed in the base for carrying fluid into the cooling well; a drain channel formed in the base for carrying cooling fluid away from the cooling well; cooling well inlets and outlets formed in the cooling well and in communication with the feed channel and drain channels, respectively. The feed and drain channels are sufficiently large relative to the size and flow characteristics of the well and cooling well inlets and outlets such that when the cooling fluid flows through the device, the pressure drop across the feed channel is substantially less than the pressure drop across the well.

A liquid-cooled power semiconductor unit has components to be cooled arranged on the upper side of a plate. The bottom side of the plate is cooled by liquid, which is guided along the plate by means of a distributing element, and the liquid inlet and the liquid outlet of the distributing element are preferably arranged perpendicular to the plate. The distributing element is divided into cells, where each cell has a liquid inlet and a liquid outlet perpendicular to the cooled plate, and the distributing element has multiple cells along the plate.

An electricity-generating backpack that is substantially lighter in weight, has the multiple springs replaced with one large spring whose spring constant can be adjusted in the field in seconds, and replaces a DC generator with a brushless AC generator that permits approximately 70% generator efficiency and the generation of up to 20 W of electrical power by converting mechanical energy to electrical power. A device is provided that always removes some electricity, but not too much, as necessary to extract large levels of the electricity while controlling damping by providing electrical damping circuits including a DC-DC converter designed to emulate a desired load at its input terminals. Additional electricity generating E-MOD devices may be used for generating additional power by hooking an E-Mod device to a generator and to the backpack belt at the wearer's hip and includes a wand that fits against the wearer's femur so as to move through a range of motion as the patient walks. The system also provides multiple possibilities of electricity generation when not walking including a light-weight bicycle ergometer which can be mounted to the backpack frame and generate very high power levels (100 W). The electricity generated and stored by the backpack may be used to charge batteries and to power a number of devices that may be carried by the backpack, such as a Sterling Cooler System that is powered by the backpack's stored power to provide cooling power for cooling items carried by the backpack.

A heat sink for cooling at least one power semiconductor module, and that includes a basin for containing a cooling liquid. The basin has a contact rim for receiving the base plate and that includes a surface that is sloped inwards to the basin.

A system for heat exchange is provided in which process material flows through a heat exchanger comprising multiple heat transfer stages and the heating and or cooling power applied to each stage can be modified independently. The system comprises a unitary heat exchanger comprising a heat transfer surface comprising a plurality of elements or zones over which a process material can flow wherein each element or zone has independent means to set or control the level of heating or cooling within that zone.

A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.

The invention belongs to a containment cooling system, in particular, to a high-capacity and fully passive containment cooling system. The containment cooling system is used for collecting thermotechnical parameters related to the containment by using a sensor and tracking a cooling process; a plurality of storage boxes for storing different coolants is arranged above the containment; the dynamic control of containment cooling power can be realized by choosing the types of the coolants and adjusting the flows of the coolants; and by using a generalized passive control unit, the start-up and the whole running process of the containment cooling system can be completely independent on external power supply, thus the containment cooling system has a characteristic of fully passiveness.

A thermoacoustic refrigerator having a relatively small size which utilizes one or more piezoelectric drivers to generate high frequency sound within a resonator at a frequency of between about 4000 Hz and ultrasonic frequencies. The interaction of the high frequency sound with one or more stacks create a temperature gradient across the stack which is conducted through a pair of heat exchangers located on opposite sides of each stack. The stack is comprised of an open-celled material that allows axial, radial, and azimuthal resonance modes of the resonator within the stack resulting in enhanced cooling power of the thermoacoustic refrigerator.

A system (27) for reducing the temperature of cooling oil for a power transformer (12) includes a heat exchanger (44) interposed in the cooling oil system. The heat exchanger (44) relies upon a liquid-to-liquid exchange of heat from the heated oil to a coolant flowing through the heat exchanger. In one embodiment, the coolant provided to the heat exchanger is obtained from an absorption chiller (65). Heat energy is provided to the chiller (65) from a heat storage device (80). In a specific embodiment, the heat storage source (80) can be a phase change material device. In a preferred cooling system, a programmable controller (55) determines the activation and operation of the system. The controller (55) can sense transformer or cooling oil temperature to trigger activation. In a preferred embodiment, the controller (55) compares a current temperature history against a temperature profile to anticipate increased cooling requirements. In certain embodiment, excess, off-peak or waste heat from the transformer (12) itself is provided to the heat storage device (80) or to the phase change heat exchanger.

A thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. Power electronic circuits are thermally matched, such as between component layers and between the circuits and the support. The support may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI / RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

PCT No. PCT / FI97 / 00515 Sec. 371 Date Mar. 31, 1999 Sec. 102(e) Date Mar. 31, 1999 PCT Filed Sep. 3, 1997 PCT Pub. No. WO98 / 10233 PCT Pub. Date Mar. 12, 1998An apparatus for transferring heating and cooling power by means of two heat transfer media, wherein at least one of the heating media is arranged to be evaporated or condensed. To reduce the need for space, the apparatus includes a shell (3) inside which at least one plate heat exchanger (1,2) is arranged loosely, flow slots (19) of the heat exchanger being arranged to be completely or mainly open towards the shell (3) in such a manner that the evaporating or condensing heat transfer medium can flow to the plate heat exchanger or from the plate heat exchanger from different sides of the plate heat exchanger on the whole length of that slot (19) which is open.

A hermetic Rankine cycle in a sealed casing powers an internal centrifugal condensate pump with an internal vapor turbine during forced convective heat transfer between a heat source and a heat sink. No work is imported into the cycle during operation. A centrifugal pumping disk shears the working fluid against a heating surface, sweeping evolving vapor into radial vortices which provide sink flow conduits to a vapor space at the center of the cylindrical turbine. Convective mass flow through the vapor space to the condensing end of the casing spins the turbine and the centrifugal pumping disk which is connected to it. Vapor is continuously swept from the heating surface, so bubbles do not form and superheat while blocking heat flux into liquid working fluid. Vapor is sucked through the radial vortices into the central vapor space and into the condensing end of the casing along the low pressure gradients in vortex cores established by cooling power. A high heat flux surface is thereby thermally connected to a conventional heat sink having high cooling power, for maximal heat extraction at data centers or other heat sources. Vapor vortices organize counterflow of vapor and condensate in a continuous mass flow cycle, and extract work from heat. Organic working fluids can be used in the casing to make even low temperature waste heat a power source.

Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and / or components. Total cooling power can be increased by employing multiple thermoelectric elements. Indeed, by employing modern semiconductor technologies, including e.g., thin-film technologies, thermoelectric elements may be cost-effectively employed and configured in large arrays.

The present invention relates to novel energy efficient sorption processes and systems for cooling, dehumidifying and heating using multistage liquid desiccant regenerators, or hybrid cooling systems or adsorption cooling systems involving appropriate combinations of rotating contacting devises, adsorption modules with heat transfer passages in thermal contact with the adsorption module wall and switchable heat pipes. The sorption processes of this invention help in flexible designing of compact cooling, dehumidifing, heating systems easy operability. The adsorption module of this invention leads to lower cycle times as low as 5 minutes; makes it possible to achieve high system Coefficient of Performance (COP) up to 0.9 due to reduced thermal mass; offers high specific cooling power in the range of 50 to 750 W / kg of AC; is easy to manufacture and operates at low costs. The refrigeration cum heating system of this invention with heat pipe in thermal contact with the adsorption modules increase the heat transfer rates without increasing the thermal mass leading to increase of COP and the single or multistage pressure equalisation increases the internal regeneration of heat thereby increasing the COP, reducing the cycle time resulting in increased specific cooling power (SCP), reducing the required quantity of adsorbent / refrigerant making the module compact and cost effective.

A power module package including a fully enclosed package comprising sidewalls; wherein at least one of said sidewalls includes a conductive substrate; wherein circuit elements are mounted on said conductive substrate on a first side comprising an inner side of said enclosed package; and, wherein a majority area of a second side of said conductive substrate is exposed, the power package has an improved interconnection configuration and compact power I / O terminals, offering low electrical parasitics, a plurality of individual power module packages can be attached seamlessly and positioned in a liquid coolant with multiple top portion open channels, as well as attached to a laminar power connector (busbar) to form various electrical power conversion topologies, the module offers low thermal resistance and low electrical parasitics, in addition to small volume, light weight and high reliability.

A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded to the semiconductor power devices. The semiconductor power devices, POL, first channel heat sink, and second channel heat sink together form a double side cooled power overlay module. The second channel heat sink is bonded to the POL solely via a compliant thermal interface material without the need for planarizing, brazing or metallurgical bonding.

An electricity-generating backpack that is substantially lighter in weight, has the multiple springs replaced with one large spring whose spring constant can be adjusted in the field in seconds, and replaces a DC generator with a brushless AC generator that permits approximately 70% generator efficiency and the generation of up to 20 W of electrical power by converting mechanical energy to electrical power. A device is provided that always removes some electricity, but not too much, as necessary to extract large levels of the electricity while controlling damping by providing electrical damping circuits including a DC-DC converter designed to emulate a desired load at its input terminals. Additional electricity generating E-MOD devices may be used for generating additional power by hooking an E-Mod device to a generator and to the backpack belt at the wearer's hip and includes a wand that fits against the wearer's femur so as to move through a range of motion as the patient walks. The system also provides multiple possibilities of electricity generation when not walking including a light-weight bicycle ergometer which can be mounted to the backpack frame and generate very high power levels (100 W). The electricity generated and stored by the backpack may be used to charge batteries and to power a number of devices that may be carried by the backpack, such as a Sterling Cooler System that is powered by the backpack's stored power to provide cooling power for cooling items carried by the backpack.

A power module includes one or more semiconductor power devices having a power overlay (POL) bonded thereto. A first heat sink is bonded to the semiconductor power devices on a side opposite the POL. A second heat sink is bonded to the POL opposite the side of the POL bonded to the semiconductor power devices. The semiconductor power devices, POL, first channel heat sink, and second channel heat sink together form a double side cooled power overlay module. The second channel heat sink is bonded to the POL solely via a compliant thermal interface material without the need for planarizing, brazing or metallurgical bonding.

Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and / or components. Total cooling power can be increased by employing multiple thermoelectric elements. Indeed, by employing modern semiconductor technologies, including e.g., thin-film technologies, thermoelectric elements may be cost-effectively employed and configured in large arrays.

The invention relates to a compact vehicle HVAC system including an evaporator unit, a condenser unit, and a component unit, as well as a refrigerant circuit. The evaporator unit and the condenser unit each are provided with air-passed heat exchangers and a fan in a casing. Further circuit components are displaced within the component unit. The casings of the evaporator unit, the condenser unit, and the component unit advantageously establish a connected compact casing arrangement. The heat exchangers are displaced within the compact casing arrangement. The refrigerant circuit is established for a combined refrigeration plant and heat pump operation as well as an afterheating operation, whereby in the afterheating operational mode the heating power of the afterheater established as condenser / gas cooler and the cooling power of the evaporator are controllable independently of each other.

A cryostat for providing temperature regulation, one purpose being measuring physical properties of materials, the cryostat employing a superconducting magnet assembly for generating variable magnetic field in the sample space and a cryogenic cooler for cooling the sample space. The cryogenic cooler chamber configuration provides for efficient heat exchange between different stages of the cryogenic cooler without the need for physical heat links. This construction enables selective delivery of cooling power from the cryogenic cooler to the desired areas within the cryostat without using flexible physical thermal links. A counter flow exchanger and ambient temperature valves facilitate efficient use of the cryogenic cooler stages. The removal of large heat load generated by the superconducting magnet while operating in the sweeping mode is achieved, in part, by employing a solid plate thermal coupling element between the cryogenic cooler chamber and the magnet assembly.

An air-conditioning system for a building comprises a hot water distribution circuit (10), a cold water distribution circuit (12) and several terminal air conditioning units (14). Each of these terminal air conditioning units (14) comprises a fan (40) for blowing air in a space of the building, a heating coil (42) connected to the hot water distribu-tion circuit (10) and / or a cooling coil (44) connected to the cold water distribution circuit (12). At least one ambient temperature control system allows to control heating power of the heating coils and cooling power of the cooling coils. The system further includes a calorific energy management system (80) with a heat pump for transferring calorific energy: a) from the cold water distribution system to the hot water distribution system; b) from the cold water distribution system to atmosphere; and c) from the atmosphere to the hot water distribution system. The calorific energy management system (80) is capable of managing the calorific energy transfers with a three level control system so as to optimise energy consumption.

The invention relates to a machine for preparing a cooled food product, comprising: a receiving seat (1), for accommodating an essentially cup-shaped container, comprising a heat exchange element (1a) having a heat exchange contact surface (21) arranged to be in contact with an outer surface of a side wall (8d) of the container when the container is placed in the machine, a cooling unit (4) arranged for cooling the heat exchange element (1a) and, a stirring unit (5) connectable to a stirring member (9) and arranged for driving the stirring member (9) in at least one rotational movement; wherein it comprises means for measuring the temperature of the product while being prepared, a control unit for automatically setting output parameters according to input parameters received by the control unit and compared to threshold values stored in the unit; wherein the output parameters comprises: at least one rotational velocity of the stirring member and the cooling power of the cooling unit, and wherein the input parameters comprises any one or more of: the measured product temperature, the stirring time.

One embodiment of the present invention provides a system that cools integrated circuit (IC) chips within a computer system. During operation, the system converts heat generated by a heat-generating-device within the computer system into thermoelectric power. The system then supplies the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.

A data center power cost accounting system uses server and storage and cooling power consumption models and device maps, together with runtime application maps, to estimate the equipment power consumption and cooling power consumption of individual applications. An approximation of the cooling cost over a period of time, for any given application, can be pieced together by adding up the equipment utilized by the application and applying the cooling estimates obtained from computational fluid dynamics (CFD) simulations. The cooling estimates can further account for changes or variability in resource usage over time since the cooling estimates are based directly on utilization. The per application power consumption costs are obtained without having to install or depend on power measurement instruments or other hardware in the datacenters.