Method and apparatus for cooling integrated circuit chips using recycled power

Abstract

One embodiment of the present invention provides a system that cools integrated circuit (IC) chips within a computer system. During operation, the system converts heat generated by a heat-generating-device within the computer system into thermoelectric power. The system then supplies the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.

Description

BACKGROUND[0001]1. Field of the Invention[0002]The present invention relates to techniques for improving energy efficiency within computer systems. More specifically, the present invention relates to a method and an apparatus that recycles heat dissipated within a computer system and converts the heat into cooling power for integrated circuit (IC) chips within the same computer system.[0003]2. Related Art[0004]Rapid advances in computing technology presently make it possible to perform trillions of operations each second on data sets as large as a trillion bytes. These advances can be largely attributed to an exponential increase in the density and complexity of integrated circuits (ICs). Unfortunately, in conjunction with this increase in computational power, power consumption and heat dissipation of ICs has also increased dramatically.[0005]Specifically, high-end computer servers can easily generate 20 kilowatts or more heat. Consequently, some power-demanding system components, s...

AI Technical Summary

Benefits of technology

[0010]One embodiment of the present invention provides a system that cools integrated circuit (IC) chips within a computer system. During operation, the system converts heat generated by a heat-generating-device within the computer system into thermoelectric power. The system then supplies the thermoelectric power to an IC chip as a cooling power to reduce the operating temperature of the IC chip, thereby recycling wasted energy within the computer system.

[0013]In a further variation, the system increases the temperature difference by reducing the temperature of the second temperature reference.

[0014]In a further variation, the system reduces the temperature of the second temperature reference by using heat pipes to reduce the temperature.

Problems solved by technology

These advances can be largely attributed to an exponential increase in the density and complexity of integrated circuits (ICs).

Unfortunately, in conjunction with this increase in computational power, power consumption and heat dissipation of ICs has also increased dramatically.

Consequently, some power-demanding system components, such as a CPU or a graphics processing unit (GPU), can quickly reach unsafe operating temperatures.

Meanwhile, companies that operate servers are experiencing soaring energy costs because of the ever-increasing power consumption of the servers.

Unfortunately, conventional cooling techniques require additional electrical power and therefore increase power consumption problems.

However, this approach may significantly restrict computational power and other aspects of server performance.

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