458results about How to "Improve signal integrity" patented technology

Methods and apparatus for a gate-length biasing methodology for optimizing integrated digital circuits are described. The gate-length biasing methodology replaces a nominal gate-length of a transistor with a biased gate-length, where the biased gate-length includes a bias length that is small compared to the nominal gate-length. In an exemplary embodiment, the bias length is less than 10% of the nominal gate-length.

A method and associated apparatus is provided for improving the performance of a high speed memory bus using switches. Bus reflections caused by electrical stubs are substantially eliminated by connecting system components in a substantially stubless configuration using a segmented bus wherein bus segments are connected through switches. The switches disconnect unused bus segments during operations so that communicating devices are connected in an substantially point-to-point communication path.

An electrical interconnection system with high speed, differential electrical connectors. The connectors are formed with columns of conductive elements, some of which carry signals some of which act as ground conductors. The conductive elements may contain projections to secure the conductive elements in a housing or to facilitate desirable current flow patterns. To avoid impedance discontinuities caused by the projections, adjacent conductive elements may be formed with complementary portions to provide a relatively uniform edge-to-edge spacing between signal and ground conductors along the length of the signal conductor. To manufacture such a connector in which both the signal and the ground conductive elements contain projections, the conductive elements carrying signals may be inserted into a housing from one side and the conductive elements acting as ground conductors may be inserted from an opposite side.

An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.

An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and / or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.

Resistive elements include a patterned region of nanofabric having a predetermined area, where the nanofabric has a selected sheet resistance; and first and second electrical contacts contacting the patterned region of nanofabric and in spaced relation to each other. The resistance of the element between the first and second electrical contacts is determined by the selected sheet resistance of the nanofabric, the area of nanofabric, and the spaced relation of the first and second electrical contacts. The bulk resistance is tunable.

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

A standard cell library is disclosed. The standard cell library contains cells wherein at least one transistor in at least one cell is annotated for gate length biasing. Gate length biasing includes the modification of the gate length, so as to change the speed or power consumption of the modified gate length. The standard cell library is one used in the manufacturing of semiconductor devices (e.g., that result as semiconductor chips), by way of fabricating features defined on one or more layouts of geometric shapes. The annotations serve to identify which ones of the transistor gate features are to be modified before using the geometric shapes for manufacturing the semiconductor device.

A backshell device and assembly are provided for achieved improved signal integrity, wherein the design of the backshell device is less complicated, more light weight, and easier to build and use than existing devices. In one embodiment, the backshell device can be coupled to adaptor which is coupled to a connector. The backshell device generally comprises a mounting section coupled to the adaptor, and an extension section extending from the mounting section. The extension section preferably comprises an increased-diameter section configured to accommodate a non-staggered or aligned arrangement of a plurality of solder sleeves of the wiring harness.

The invention relates to a connector socket capable of protecting a jack terminal, wherein the socket comprises a module base and m jack modules, wherein the jack modules are composed of jack bases, jacks and jack shielding plates; one end of the jack base is provided with n plugs which are arranged in order; each plug is composed of two side columns and a central column disposed between the two side columns; the gaps formed among the two side columns and the central column are used for containing the jack terminal on the jack; and the outlines of the two side columns, the central column and the jack terminal within the plug are linear; the module base comprises n*m plug cavities which are used for installing n*m plugs and jack terminals contained in the plugs, wherein each plug cavity isinternally provided with a side wall and a central wall, and the plug and the jack terminal are arranged in the cavity between the side wall and the central wall. The connector socket capable of protecting a jack terminal provided by the invention has the advantages that the jack modules can be prevented from damaging while assembling by providing the plugs which are used for protecting the jacks, the jack bases and the jacks are integrated by means of injection molding, and the production and assembly efficiencies are improved.

Coaxial and twisted pair conductive yarn structures reduce signal crosstalk between adjacent lines in woven electrical networks. A coaxial conductive yarn structure includes an inner conductive yarn having a plurality of conductive strands twisted together. An outer conductive yarn is wrapped around the inner conductive yarn. An insulating layer separates the inner and outer yarns. A twisted pair conductive yarn structure includes first and second conductive yarns, each including a plurality of conductive strands being twisted together. The first and second conductive yarns are twisted together to form a helical structure. In a woven electrical network, at least one conductor of adjacent conductive yarn structures is connected to ground to reduce signal crosstalk. Coaxial and twisted pair yarn structures may also be formed simultaneously with weaving or knitting the threads that make up the structures into a fabric.