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344results about How to "Lower insertion force" patented technology

High density electrical connector with variable insertion and retention force

An interconnection system that includes a daughter card and backplane electrical connectors mounted to printed circuit boards at connector footprints. The spring rate of beam-shaped contacts in the daughter card connector increases while mating with the backplane connector so that the retention force may be greater than the insertion force. Such a change in spring rate may be achieved by positioning the beam-shaped contacts adjacent a surface of a connector housing. That surface may include a projection that aligns with the beam-shaped contact. When the connectors are unmated, the beam-shaped contact may be spaced from the projection. As the connectors begin to mate, a central portion of the beam-shaped contact may be pressed against the projection, which has the effect of shortening the beam length and increasing its stiffness.
Owner:AMPHENOL CORP

Rotating needle driver and apparatuses and methods related thereto

Featured is a medical instrument driver, a robotic apparatus embodying such a medical instrument driver and methods related thereto for inserting a medical instrument into tissue of a mammal (e.g., human). Such medical instruments include medical needles, biopsy needles, trocars, cutters and introducers. Such a medical instrument driver according to the present invention is configured and arranged so that medical instrument is rotated as it is being moved longitudinally for insertion into the tissue such that the medical instrument is spiraling as it pierces and traverses the tissue to the target area.
Owner:THE JOHN HOPKINS UNIV SCHOOL OF MEDICINE

Shielded integrated circuit probe

A test probe consists of an elongated screw machine contact biased by a helical spring and mounted in a through hole of a non-conductive substrate. One end of the contact includes a crown for engaging a solder ball lead of an IC package, and the contact includes an intermediate collar which maintains the contact within the through hole. The helical spring is disposed about the contact, with one end thereof engaging the lower end of the collar. The other end of the helical spring has contiguous coils and is of a reduced diameter so as to extend beyond the lower end of the non-conductive substrate to make electrical contact with a printed circuit board. When the test probe is compressed between the IC package and the printed circuit board, the inherent twisting of the helical spring causes the contact to tilt and make electrical contact with the contiguous coils, thereby establishing a direct electrical path between the IC package and the printed circuit board, with minimum resistance and minimum inductance. In an alternate embodiment, each probe is disposed within a dielectric housing which, in turn, is disposed in a through hole in a conductive substrate to effectively shield the probe from electrical interference.
Owner:ARIES ELECTRONICS

Disposable Pipette Tip

In one aspect, the invention relates to a pipette tip mounting shaft configuration and a disposable pipette tip having a matching configuration. The mounting shaft includes a locking section located above a lower sealing section. The locking section has outwardly extending locking lobes located above a stop member and a lower sealing section located below the stop member. In certain embodiments, the diameter of the mounting shaft below the stop member is reduced in order to lessen insertion and ejection forces, which is particularly helpful for hand-held multi-channel pipettors. In these embodiments, the lower sealing section contains either a frustoconical sealing section, or an annular groove and a sealing ring, such as a flouroelastomeric O-ring seal. When the mounting shaft is fully inserted into the collar of the mating disposable pipette tip, the tip locks onto the mounting shaft. The bore of the pipette tip includes a circumferential shelf or shoulder separating its upper collar from the tip sealing area which is located below the circumferential shelf. The tip collar preferably includes a locking ring located at or near the upper opening for the mounting shaft. The dimensions of the collar, and in particular the distance between its circumferential shelf and the locking ring, are selected to match the dimensions of the mounting shaft between the stop member and the upper end of the locking lobes, thus locking the pipette tip in a secure, reliable position and orientation while using ergonomic insertion and ejection forces. The locking lobes preferably include a ramp portion that gently flexes and distorts the pipette tip collar out of round as the mounting shaft is inserted in the pipette tip, rather than stretching the tip collar. The circumferential shelf on the pipette tip between the tip collar and the barrel isolates the sealing area at the upper end of the barrel from distortion, thus facilitating reliable sealing engagement between the lower sealing section of the mounting shaft and the sealing ring in the upper end of the barrel of the pipette tip.
Owner:INTEGRA BIOSCI CORP

Conductive Material For Connecting Part And Method For Manufacturing The Conductive Material

There is provided a conductive material comprising a base material made up of a Cu strip, a Cu—Sn alloy covering layer formed over a surface of the base material, containing Cu in a range of 20 to 70 at.%, and having an average thickness in a range of 0.1 to 3.0 μm, and an Sn covering layer formed over the Cu—Sn alloy covering layer having an average thickness in a range of 0.2 to 5.0 μm, disposed in that order, such that portions of the Cu—Sn alloy covering layer are exposed the surface of the Sn covering layer, and a ratio of an exposed area of the Cu—Sn alloy covering layer to the surface of the Sn covering layer is in a range of 3 to 75%. The surface of the conductive material is subjected to a reflow process and preferably, an arithmetic mean roughness Ra of the surface of the material in at least one direction, is not less than 0.15 μm while the arithmetic mean roughness Ra thereof, in all directions, is not more than 3.0 μm and the average thickness of the Cu—Sn alloy covering layer is preferably not less than 0.2 μm. The conductive material is fabricated by a method whereby the surface of the base material is subjected to roughening treatment, an Ni plating layer, a Cu plating layer and an Sn plating layer are formed, as necessary, over the surface of the base material, and subsequently, a reflow process is applied.
Owner:KOBE STEEL LTD

High density electrical connector and PCB footprint

An interconnection system that includes a daughter card and backplane electrical connectors, each mounted to a printed circuit board at a connector footprint. The backplane connector has conductive elements with transition regions that allow the mating contact portions to be positioned on a uniform pitch while contact tail portions can be shaped to improve signal integrity or to provide a more compact and / or mechanically robust footprint. The conductive elements in both connectors are configured such that the contact tails of the ground conductors align from column to column, but the planar portions of the ground conductors in one column align with a pair of signal conductors in the other column, which improves mechanical and signal integrity. Mechanical integrity may be improved by forming the connector footprints with pads for the ground conductors that span multiple columns.
Owner:AMPHENOL CORP
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