12565results about "Measurement instrument housing" patented technology

A housing and a bottom cover are secured together and have pairs of aligned through-apertures, and probe pins are accommodated in respective pairs of through-apertures to provide an IC socket. Each probe pin comprises a tube having a stop flange formed around its outer periphery, a movable plunger accommodated in the tube such that an extension portion of the movable plunger in urged to project out of a narrowed first end portion of the tube by a first coil spring, and a fixed plunger fitted to a second end portion of the tube. Each probe pin is urged by a second coil spring such that the stop flange on the tube is urged into abutment with a shoulder portion of a through-aperture of the bottom cover, whereby a tip end of the fixed plunger is projected beyond the outer surface of the bottom cover and a tip end of the movable plunger is projected beyond the outer surface of the housing.

Methods for processing at least one die which comprises an integrated circuit. In one example of a method of the invention, an identification code is applied to a carrier. A singulated die is deposited into the carrier which holds the singulated die. The singulated die comprises an integrated circuit. The identification code may be applied to the carrier before or after depositing the singulated die into the carrier. The carrier may be used in testing the singulated die and may include a plurality of singulated die or just one singulated die. In another example of a method of the invention, an identification code is applied to a die. The die is deposited into a carrier which holds the die. The die comprises an integrated circuit, and the carrier holds the die in singulated form. Typically the die is placed in the carrier without any packaging which may protect the die. The identification code may be applied to the die before or after it is deposited into the carrier.

For testing electrical properties of packaged IC devices, there is provided an apparatus which includes a test board which is located at a testing station and provided with a plural number of contacting sockets for connecting individual IC devices to an IC tester separately and independently of each other, a loader which is located at a loading station and adapted to feed untested IC devices toward the test board, an unloader which is located at an unloading station and adapted to discharge tested IC devices from the test board at the testing station, and a device transfer mechanism which is movable across the testing station to transfer untested IC devices from the loader to the test board and also to transfer tested IC devices from the test board to the unloader. Upon detecting completion of a test on one of IC devices in one socket of the test board, a fresh untested IC device is transferred to the testing station to replace the tested IC device. As soon as the fresh IC device is set in position in that socket, execution of a test program is started with respect to that socket on the test board.

An electric energy monitor or meter for efficient measuring and recording electrical energy usage data relating to a particular appliance or circuit. One embodiment comprises a thin-profile monitoring device through which an electrical conductor, for example the normal line cord plug of an appliance or the output wire from a circuit breaker to the load, is inserted. A display may be provided to show the accumulated energy usage. In other embodiments a device of the invention can be installed in a light switch, appliance, plug, or receptacle. Data can also be transmitted by various means to a computing device such as a personal computer or the like. The device of the invention allows for interaction with Internet-based information dissemination or gathering, meter distribution by means of incentive or promotional give-away, and control of energy usage through connection to an energy management system.

A probe block assembly has an electrically insulative housing and an electrically conductive plate. The front side of the housing has a forward face and a recessed face. The electrically conductive plate is positioned against the recessed face of the housing. A plurality of probes extend from the forward face of the housing and are electrically isolated from each other and from the conductive plate. A plurality of probes extend from a front surface of the conductive plate and are in electrical contact with each other.

A power meter reader system for automatically reading an indication on a power meter unit having a cyclical property that varies at a rate indicative of power consumption. The system comprises a detection unit that includes a sensor unit for monitoring the cyclical property of the indication and generating a consumption detection signal, a processing unit for generating an information signal based on data related to the consumption detection signal, and a transmitter for transmitting a transmission signal based on the information signal. The processing unit also generates a sensor enable signal to enable the sensor unit for only a portion of the cyclical property of the indication. The system further includes a display unit located remotely with respect to the detection unit for receiving the transmission signal and displaying the power consumption. The detection unit may also employ a prediction model for reducing power consumption in the detection unit.

A power meter reader system for automatically reading an indication on a power meter unit having a cyclical property that varies at a rate indicative of power consumption. The system comprises a detection unit that includes a sensor unit for monitoring the cyclical property of the indication and generating a consumption detection signal, a processing unit for generating an information signal based on data related to the consumption detection signal, and a transmitter for transmitting a transmission signal based on the information signal. The processing unit also generates a sensor enable signal to enable the sensor unit for only a portion of the cyclical property of the indication. The system further includes a display unit located remotely with respect to the detection unit for receiving the transmission signal and displaying the power consumption. The detection unit may also employ a prediction model for reducing power consumption in the detection unit.

A test probe consists of an elongated screw machine contact biased by a helical spring and mounted in a through hole of a non-conductive substrate. One end of the contact includes a crown for engaging a solder ball lead of an IC package, and the contact includes an intermediate collar which maintains the contact within the through hole. The helical spring is disposed about the contact, with one end thereof engaging the lower end of the collar. The other end of the helical spring has contiguous coils and is of a reduced diameter so as to extend beyond the lower end of the non-conductive substrate to make electrical contact with a printed circuit board. When the test probe is compressed between the IC package and the printed circuit board, the inherent twisting of the helical spring causes the contact to tilt and make electrical contact with the contiguous coils, thereby establishing a direct electrical path between the IC package and the printed circuit board, with minimum resistance and minimum inductance. In an alternate embodiment, each probe is disposed within a dielectric housing which, in turn, is disposed in a through hole in a conductive substrate to effectively shield the probe from electrical interference.

An apparatus for testing semiconductor devices allows various testing processes, including a burn-in process, to be performed at the same testing stage. Test trays which contain the semiconductor devices are used throughout an in-line system so that an entire back-end process can be performed without loading / unloading the semiconductor devices between the various tests. The in-line system includes multiple test and burn-in apparatuses as well as a single sorting unit which performs a composite sorting operation after all the testing processes. A method for testing semiconductor devices in the in-line system includes testing the semiconductor devices in the test trays using the test and burn-in apparatus, transferring the test trays to a different testing apparatus for a second testing, and finally sorting the semiconductor devices after all testing processes have been performed based on a final sorting map created by combining test tray maps generated during each of the tests.

A test and burn-in apparatus for semiconductor chip package devices, an in-line system which includes the test and burn-in apparatus, and a test method which employs the in-line system are provided. A test and burn-in apparatus for testing semiconductor devices allows various testing processes, including a burn-in process, to be performed at the same testing stage. The apparatus employs test trays which contain the semiconductor devices. These test trays are used throughout the in-line system so that an entire back-end process can be performed without the need for loading / unloading the semiconductor devices into and from device trays between the various tests. The test and burn-in apparatus according to this invention can therefore occupy less space than the prior art testing apparatuses. The in-line system includes multiple test and burn-in apparatuses as well as a single sorting unit which performs a composite sorting operation after all the testing processes have been performed. Furthermore, the method for testing the semiconductor devices in the in-line system includes testing the semiconductor devices in the test trays using the test and burn-in apparatus, generating a test tray map corresponding to results of the test, transferring the test trays to a different testing apparatus for a second testing and test tray map generation process, and finally sorting the semiconductor devices in the sorting unit after all testing processes have been performed based on a final sorting map created by combining the test tray maps of each of the tests. The benefits of this invention are reduced time and space requirements because neither transferring the devices to device trays between tests nor performing multiple sorting steps are required.

A power strip is providing including a housing coupled to a first end portion of a power supply cord, the housing having an electrical receptacle mounted thereto and connected to the power supply cord, the power supply cord having a second end connectable to a power source. A current sensor is coupled to the power supply cord between the electrical receptacle and the second end for detecting electrical current flow through the power supply cord and providing an output signal that varies in proportion to the current flow through the power supply cord. A processing circuit coupled to the output of the current sensor includes a display device for displaying at least one of the current, voltage, power, and phase associated with the power supply cord at the current sensor. The display device can be remotely coupled to the power strip for positioning the display in a convenient location.

A method for fabricating microelectronic spring structures is disclosed. In an initial step of the method, a layer of sacrificial material is formed over a substrate. Then, a contoured surface is developed in the sacrificial material, such as by molding the sacrificial material using a mold or stamp. The contoured surface provides a mold for at least one spring form, and preferably for an array of spring forms. If necessary, the sacrificial layer is then cured or hardened. A layer of spring material is deposited over the contoured surface of the sacrificial material, in a pattern to define at least one spring form, and preferably an array of spring forms. The sacrificial material is then at least partially removed from beneath the spring form to reveal at least one freestanding spring structure. A separate conducting tip is optionally attached to each resulting spring structure, and each structure is optionally plated or covered with an additional layer or layers of material, as desired. An alternative method for making a resilient contact structure using the properties of a fluid meniscus is additionally disclosed. In an initial step of the alternative method, a layer of material is provided over a substrate. Then, a recess is developed in the material, and fluid is provided in the recess to form a meniscus. The fluid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to define a spring form in the same manner as the molded surface in the sacrificial material.

A connector includes a connector body including a hole, a contact disposed in the hole and arranged such that, when the connector is connected to a substrate, the contact is connected to a corresponding electrical pad on the substrate, a conductive elastomeric interface arranged such that, when the connector is connected to the substrate, the conductive elastomeric interface is between the connector body and the substrate, and a cable connected to the contact. The contact includes a ground ferrule and a locking ferrule arranged to mate with the hole, and the hole of the connector body and the locking ferrule are at least partially threaded. When the connector is connected to the substrate and when the locking ferrule is threaded with the hole, the ground ferrule contacts at least one of the conductive elastomeric interface and the upper surface of the substrate.

A interconnect structure is inexpensively manufactured and easily insertable into a socket. The interconnect structure is manufactured by forming a sacrificial substrate with cavities that is covered by a masking material having openings corresponding to the cavities. A first plating process is performed by depositing conductive material, followed by coupling wires within the openings and performing another plating process by depositing more conductive material. The interconnect structure is completed by first removing the masking material and sacrificial substrate. Ends of the wires are coupled opposite now-formed contact structures to a board. To complete the socket, a support device is coupled to the board to hold a tested integrated circuit.

A current sensing module for disposal proximate a conductor is disclosed. The current sensing module includes a housing having a first section and a second section that together define an opening for receiving the conductor therethrough. The second section is in operable connection with the first section. The current sensing module further includes a micro-electromechanical system (MEMS) based current sensor disposed within the first section proximate the opening for receiving the conductor.

A method of manufacturing a protruding-volute contact for attaining electrical continuity with an electrode of electronic equipment or inspection equipment, the method comprising the steps of forming a plastic mold (resist structure) with a metal mold; forming a layer consisting of metallic material on the plastic mold (resist structure) by means of electroforming; and performing convex formation of a metal microstructure made from the layer consisting of metallic material so as to form a spiral spring that protrudes volutedly outward. With such method, an inspection contact or coupling contact having high reliability and capable of attaining electrical continuity of large electric current can be produced at low cost.

A probe pod housing is connected by a cable to an active probe. The probe pod housing carries a male push-on precision BNC connector that is also a cross-series adapter. The center conductor of the cable receives a male connector that then mates with the non-BNC end of the cross-series adapter. Auxiliary conductors that may also be carried by the cable are connected to male pins (soldered to a circuit board carried within the probe pod) with a push-on female in-line connector. The active probe itself uses a soldered-to-the-shield threaded nut technique. The nut threads into a metallic body that contains the impedance converter and that is enclosed by the body of the active probe. The cable is replaced by first unsoldering the center conductor (and also any auxiliary conductors). Then the nut (which is still soldered to the shield) is unscrewed from the metallic body, and the cable is free from the probe. At the probe pod end the cable mounted male connector is simply unscrewed from the cross-series adapter, and any auxiliary conductors disconnected by removing the female wire-mounted in-line connector.

A socket for test includes: a support block, having a first face and a second face different from the first face, and formed with through holes; probes, provided in the through holes, and electrically connected to terminals of a device to be tested provided on a side of the first face and to terminals connected to a testing apparatus provided on a side of the second face, the probes including a first probe for grounding and a second probe different from the first probe; and a first plate member, formed with a first hole corresponding to the first probe and having a smaller diameter than a diameter of the first probe, slots radially extended from the first hole, and a second hole corresponding to the second probe and having a larger diameter than a diameter of the second probe, the first plate member being in electrical contact with the support block.

The invention relates to an experimental facility and method for electric heating combined stress aging with oil-paper insulation of a transformer, wherein the facility has the advantages of simple structure and good use effect, is safe in running and convenient in sampling. The experimental facility comprises an outer cavity which is internally provided with at least one sealed inner cavity; theinner cavity is internally provided with a testing device which is provided with a high-voltage electrode and a low-voltage electrode; a sample is arranged between the high-voltage electrode and the low-voltage electrode which are mutually pressed; and the high-voltage electrode is connected with a high-voltage power supply and a current measurement and display system outside the outer cavity respectively.

A socket signal extender (SSE), and a system and method of testing an assembled device under test (DUT) board employing an SSE. In one embodiment, the SSE includes a cover having a portion configured to fit within a test socket. The portion is free of logic and includes electrical conductors configured to provide an electrical connection to contacts of the test socket.

A compact line illuminator for applying an oscillating signal to buried or otherwise inaccessible pipes, cables and conductors so that their location can be traced by detecting an electromagnetic signal emitted by these buried objects. The illuminator includes a circuit for generating a signal suitable for tracing a buried conductor and a holder for a portable power source that can energize the circuit. First and second leads each have a first end connected to the circuit and a second end connected to a corresponding mechanism such as an alligator clip for attaching to a buried conductor. A case encloses the circuit and the portable power source holder and is configured for having the first and second leads wrapped around an exterior of the case. Mechanisms are provided for holding the leads wrapped around the exterior of the case.

The electrical measuring apparatus (17) and temperature sensing apparatus minimises the number of connections required for each contact (30, 31) of a battery (18). The present invention measures the core temperature of the battery (18) which is useful in monitoring the health of the battery (18). The apparatus comprises first connection means to connect to the first contact (30) of the battery (18) and second connection means to connect to the second contact (31) of the battery (18). The apparatus includes a thermistor (36) which connects in series with one lead (32) of the connecting means. Accordingly, the apparatus does not require the temperature sensor (36) to be independently connected to the battery (18).

An electric energy monitor or meter for efficient measuring and recording electrical energy usage data relating to a particular appliance or circuit. One embodiment comprises a thin-profile monitoring device through which an electrical conductor, for example the normal line cord plug of an appliance or the output wire from a circuit breaker to the load, is inserted. A display may be provided to show the accumulated energy usage. In other embodiments a device of the invention can be installed in a light switch, appliance, plug, or receptacle. Data can also be transmitted by various means to a computing device such as a personal computer or the like. The device of the invention allows for interaction with Internet-based information dissemination or gathering, meter distribution by means of incentive or promotional give-away, and control of energy usage through connection to an energy management system.

A hand held testing meter is provided which allows the meter to be viewed and securely supported on the user's hand, while the user's fingers are free to hold and manipulate test instruments. An elastomeric band is provided which is engageable to the meter extending substantially across the meter rear surface. The elastomeric band is resiliently extendable to securely receive a user's hand intermediate the meter rear surface and the elastomeric band.

A test apparatus for testing electrical devices such as ICs is provided. The test apparatus includes a test socket mounted on a DUT board in which a contact plunger assembly is at least partially positioned.

A forced air heat exhaust type of burn-in test apparatus for packages: A first air supply duct provides air to the burn-in chamber and a second air supply duct provides air to supply tubes that direst air into the test sockets that hold the packages. The test sockets have a structure that allows air ventilation of the conductive balls. Accordingly, the apparatus can control the temperature around the packages as well as the temperature in the burn-in chamber, thus preventing conductive ball-melting.

An interconnect for testing semiconductor components includes a substrate, and contacts on the substrate for making temporary electrical connections with bumped contacts on the components. Each contact includes a recess and a support member over the recess configured to electrically engage a bumped contact. The support member is suspended over the recess on spiral leads formed on a surface of the substrate. The spiral leads allow the support member to move in a z-direction within the recess to accommodate variations in the height and planarity of the bumped contacts. In addition, the spiral leads twist the support member relative to the bumped contact to facilitate penetration of oxide layers thereon. The spiral leads can be formed by attaching a polymer substrate with the leads thereon to the substrate, or by forming a patterned metal layer on the substrate. In an alternate embodiment contact, the support member is suspended over the surface of the substrate on raised spring segment leads.