4276 results about "Device under test" patented technology

Apparatus and methods facilitating a distributed approach to performance and functionality testing of location-sensitive wireless data communication systems and equipment are described. A plurality of test units, geographically distributed at arbitrary points in a three-dimensional volume surround the system or equipment under test. Each test unit generates test stimuli and records responses from the device under test, and emulates the effects of changes in spatial location within an actual wireless network environment. A central controller co-ordinates the set of test units to ensure that they act as a logical whole, and enables testing to be performed in a repeatable manner in spite of the variations introduced by the location sensitive characteristics of wireless data communication networks. The central controller also maintains a user interface that provides a unified view of the complete test system, and a unified view of the behavior of the system or equipment under test. For diagnostic purposes, the recorded responses may be regenerated to view any defects as many times as necessary to correct them. Alternatively, each test unit may have either wired network interface units, instead of a wireless interface unit to test systems or equipment forming part of a wired network portion in the wireless data communication system.

A main power supply continuously provides a current to a power input terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases during state changes in synchronous logic circuits implemented within the DUT. To limit variation (noise) in voltage at the power input terminal arising from these temporary increases in current demand, a charged capacitor is connected to the power input terminal during each DUT state change. The capacitor discharges into the power input terminal to supply additional current to meet the DUT's increased demand. Following each DUT state change the capacitor is disconnected from the power input terminal and charged to a level sufficient to meet a predicted increase in current demand during a next DUT state change.

A calibration method for a two-port VNA includes presenting a high reflection calibration standard and measuring reflection data for each of the two ports, calculating a location of the high reflection calibration standard at each of the two ports, presenting a load calibration standard and measuring the reflection characteristic for each of the two ports to provide load data, converting the load data to the time domain to provide time domain impulse response load data, and gating the time domain impulse response load data based on the locations of the high reflection calibration standard at each of two ports. The method further includes reconstructing frequency domain load data from the gated time domain data, connecting the two ports together and determining forward and reverse transmission characteristics, and calculating systematic error coefficients for the VNA based on the reconstructed frequency domain data and the forward and reverse transmission characteristics.

A signal integrity network analyzer is provided. The analyzer preferably includes a characterization module for characterizing a device under test, an acquisition module for acquiring a waveform, a de-embedding module for selectively embedding and de-embedding on or more system fixtures, and an analysis module for performing analysis on the acquired waveform, with one or more system features selectively embedded or de-embedded. A single user interface is provided and is adapted to control the characterization module, the acquisition module, the de-embedding module and the analysis module.

Noise reduction for application of structural test patterns to a Device Under Test (DUT) is accomplished with a capacitor “booster” bypass network on the probe card in which the capacitors are charged to a much higher voltage Vboost than the DUT power supply voltage VDD. Charging the capacitors to a voltage N×VDD allows the buster network to store N times the charge of a conventionally configured capacitance network, and effectively provides N times the capacitance of the original network in the same physical space.

In order to characterize the optical characteristics of a device, a source of light having a variable frequency with a polarization state which varies linearly with frequency is provided as an input to the device under test. The input light is also passed through a known reference path and is added to the light output from the device under test in a beam combiner. The combined light for the frequencies of interest is split into two orthogonal polarizations which are then detected in a spectral acquisition apparatus and supplied to a microprocessor. The spectral measurements are digitized and curve-fitted to provide optical power versus optical frequency curves. Fourier transforms of each of the curves are calculated by the microprocessor. From the Fourier transforms, the four arrays of constants are calculated for the Jones matrix characterizing the device under test.

A probe for connecting a device under test to a measurement device that corrects for dc errors and noise generated by the current flowing through the ground shield of a transmission line used by the probe. The probe identifies a voltage drop in the ground preferably using an additional line between the device under test and the measurement device. The signal provided to the measurement device is corrected based on the identified voltage drop.

Complex data is obtained from OFDR backscatter measurements for an optical device under test (DUT). That complex scatter pattern data may be used along with a previously-determined fiber segment pattern to identify the fiber segment within the DUT, even when the DUT is an optical network DUT that includes multiple fibers coupled to perform one or more functions. In other non-limiting example applications, the OFDR scatter pattern data can be used to identify where in the DUT a loss occurred and where in the DUT a temperature change occurred.

Programming a plurality of states having respective threads is achieved by an event engine and a computer controlled GUI causing the event engine to monitor a signal and execute an action based thereon. The GUI programs an event and several states and causes the event engine to traverse between the states upon reaching the event. The GUI further programs a logic chain which unifies the threads. A method unifies several threads by selecting and executing a logic operation. The method further configures several states and causes traversing between them. The GUI may be deployed co-functionally with debuggers, logic analyzers, scopes, utilities, and software development tools. The results of the GUI are automatically transformed into program code which programs the event engine to operate during debug of a device under test by monitoring for events and taking action based thereon.

A system and method is disclosed for testing components used in the manufacture of information handling systems. In embodiments of the invention, a device-under-test (DUT) comprises a DUT identifier code. The DUT is operably coupled to a test bed. An information handling system is operable to use the identifier code to select and execute a predetermined test program to generate a plurality of test commands. A test bed interface is operable to receive the test commands and to generate a plurality of test control signals therefrom to perform a predetermined set of tests of said DUT.

A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.

A distributed operating system for a semiconductor test system, such as automated test equipment (ATE), is described. The operating system includes a host operating system for enabling control of one or more site controllers by a system controller. One or more local operating systems, each associated with a site controller, enable control of one or more test modules by an associated site controller. Each test module performs testing on a corresponding device-under-test at a test site.

A co-verification system includes a computer programmed to act as a simulator for simulating behavior of a first portion of an electronic device under test (DUT) by acquiring, processing and generating data representing DUT signals. The co-verification system also includes emulation resources programmed to emulate a second portion of the DUT by receiving, processing and generating emulation signals representing DUT signals. The signals of the DUT are mapped to separate addresses within a memory space, and the simulator controls and reads states of emulation signals by writing data to and reading data from addresses of the memory space states mapped to the DUT signals the emulation signals represent. The computer and the emulation resources are also programmed to implement transactors communicating with one another through a packet routing network. The transactors set states of the emulation signals when the simulator writes to memory space addresses and for reading states of the emulation signals. The transactors monitor states of emulation signals and return data indicating those states to the simulator when the simulator reads memory space addresses mapped to DUT signals represented by the emulation signals.

A wireless integrated circuit test method and system is presented. The invention allows testing of one or more integrated circuits configured with a wireless interface and a test access mechanism which controls input of test data received over a wireless connection from a test station to test structures which test functional blocks on the integrated circuit. Via the wireless connection, multiple integrated circuits or similarly equipped devices under test can be tested simultaneously. The invention also enables concurrent testing of independently testable functional blocks on any given integrated circuit under test.

Systems and methods are described for translating detected wafer defect coordinates to reticle coordinates using CAD data. A wafer inspection image is provided and coordinates of potential defects in the wafer are determined. Then the wafer inspection image is converted into a predetermined image format. CAD data for the device under test is then used to produce a second image, also in the predetermined image format. The CAD-derived image and the wafer-derived image are then aligned, and the coordinates of potential defects in the wafer are converted into CAD coordinates. The CAD coordinates are then used to navigate through the reticle for the wafer in order to locate reticle defects corresponding to the detected wafer defects.

An integrated circuit tester produces an output TEST signal following a pulse of a reference CLOCK signal with a delay that is a sum of an inherent drive delay and an adjustable drive delay. The tester also samples an input RESPONSE signal following a pulse of the reference CLOCK signal with a delay that is a sum of an inherent compare delay and an adjustable compare delay. The inherent drive and compare signal path delays within an integrated circuit tester are measured by first connecting a salphasic plane to transmission lines that normally convey signals between the tester and terminals of an integrated circuit device under test. A standing wave signal appearing on that salphasic plane is phase locked to the CLOCK signal so that a zero crossing of the standing wave occurs at a fixed interval after each pulse of the CLOCK signal. Each transmission line concurrently conveys the standing wave to the tester to provide timing references for measuring the inherent drive and compare signal path delays within the tester. Transmission line signal paths are also measured. Delays are added to the drive and compare signal paths to compensate for the measured inherent drive, compare and transmission line delays.

A test manager software program includes an interactive test graphical-user-interface (GUI) for testing network devices using high-level networking commands. The test GUI allows the test engineer user to enter high-level commands such as Simple Networking Management Protocol (SNMP) commands that read values in a management information database in a network device under test. The high-level commands can be sent from the test manager using a command-line interface (CLI) in a telnet session opened to the network device during testing. The user specifies high-level test, analyze, and restore commands in test cases that are collected into test suites. Rules for logging on to the network device under test are stored that include expected prompts from the network device and user responses such as passwords. Addresses of the network device under test can be re-mapped for testing other devices so the test suites can be reused.

Coverage metrics are expressed with an intuitive graphical interface based upon data flow. Coverage analysis and presentation objects are integrated to produce coverage results which enable device functionality in a device under test to be modeled as objects, subject to event occurrence. Event objects are introspected at run-time, allowing the user to determine the event object's attributes with specification of coverage metrics subject to a selected combination of the event object's attributes. The event objects are serialized into permanent storage, allowing the user to specify and execute new coverage metrics at any time after simulation. Operations used to describe coverage metrics are modeled as analysis objects. Such analysis objects accept event objects as inputs, using a predetermined, well-defined interface. The combination of event objects and analysis objects allows coverage metrics to be specified in a simple data flow manner. With such a coverage metric, the user attaches or wires (metaphorically) the analysis objects together in a visual builder environment. Using the analysis objects, the user specifies desired coverage metrics, such as coverage of sequences of events and / or coverage of events that occur during the same time window of a simulation. The display functionality of the coverage tool is expandable because the presentation objects use the same event object interface as the analysis operator objects. Coverage metrics are subject to specification either before or after event occurrence. The user specifies coverage metrics using an intuitive graphical interface based upon data flow, without any specific programming language skills being necessary. Functional events in the device under test are treated as event objects. Each event object may be passed to selected analysis tools chosen by the user, such as analyzers, logic gates, and coincidence counters.

A method of analyzing power consumption for a DUT (device under test) that includes an integrated circuit or an electronic system includes: providing emulation data for states of the DUT in one or more time windows; determining operational mode values from the emulation data and a selection of operational modes that characterize circuit behavior in the one or more time windows; dividing each time window into one or more segments based on at least one power criterion; determining power-activity values for the one or more segments; determining power-consumption values for the one or more segments from the power-activity values; using the power-activity values and the power-consumption values to determine relative power activity across the one or more segments and adjusting the one or more segments to target high power activity over operational modes in the one or more time windows; and saving one or more values for power activity of the DUT in a computer-readable medium.

A probe card of a wafer test system includes one or more programmable ICs, such as FPGAs, to provide routing from individual test signal channels to one of multiple probes. The programmable ICs can be placed on a base PCB of the probe card, or on a daughtercard attached to the probe card. With programmability, the PCB can be used to switch limited test system channels away from unused probes. Programmability further enables a single probe card to more effectively test devices having the same pad array, but having different pin-outs for different device options. Reprogrammability also allows test engineers to re-program as they are debugging a test program. Because the programmable IC typically includes buffers that introduce an unknown delay, in one embodiment measurement of the delay is accomplished by first programming the programmable IC to provide a loop back path to the test system so that buffer delay can be measured, and then reprogramming the programmable IC now with a known delay to connect to a device being tested.

A characterization method for a device under test includes applying a bias voltage to a test circuit. The test circuit includes a first transistor coupled to the device under test, a second transistor coupled to the device under test and to the first transistor. A third transistor is coupled to a dummy device, a fourth transistor is coupled to the dummy device and to the third transistor. The transistors are of a common type. The characterization method further includes applying non-overlapping clocking signals to transistors of the test circuit to produce test signals for application to the device under test and detecting a current in one or more transistors from the device under test. The bias voltage is further varied to characterize the device under test.

Counterfeit electronic devices are detected by comparing a thermal profile of the counterfeit device and an authentic device under predetermined operating conditions. A thermal profile for an authentic electronic device is recorded executing an instruction set over time, such as with static infrared images at predetermined times, video infrared images over a predetermined time period or temperature measurements made at predetermined locations of the electronic device. In one embodiment, a thermal profile indicates that a processor device has been used in the place of a field programmable grid array device. In an alternative embodiment, an electromagnetic profile is detected instead of or in addition to the thermal profile. The electromagnetic profile of an authentic device is used to create an expected profile for comparison with an electromagnetic profile of electronic devices under test.

Provided is a method and system for distributing a test recipe to a tester for conducting a test to determine if a device under test operates as designed. The method includes storing an active test recipe in an active memory in local communication with the tester, and initiating the test of the device under test to be performed by the tester according to a parameter included in the active test recipe stored in the active memory. A second parameter included in a second test recipe is received by the tester while conducting the test of the device under test according to the parameter included in the active test recipe. The method further includes storing the second parameter in a buffer memory in local communication with the active memory, and initiating a transfer of the second parameter from the buffer memory to the active memory. After initiation of the transfer of the second parameter to the active memory, a subsequent test to be performed by the tester according to the second parameter included in the second test recipe is initiated.

Methods and systems to provide baseline measurements for aging compensation for a display device are disclosed. An example display system has a plurality of active pixels and a reference pixel. Common input signals are provided to the reference pixel and the plurality of active pixels. The outputs of the reference pixel is measured and compared to the output of the active pixels to determine aging effects. The display system may also be tested applying a first known reference current to a current comparator with a second variable reference current and the output of a device under test such as one of the pixels. The variable reference current is adjusted until the second current and the output of the device under test is equivalent of the first current. The resulting current of the device under test is stored in a look up table for a baseline for aging measurements during the display system operation. The display system may also be tested to determine production flaws by determining anomalies such as short circuits in pixel components such as OLEDs and drive transistors.