23433 results about "Solid-state" patented technology

A solid-state image-sensing device that compensates for brightness at edges of a screen and a method of driving the device are provided. The solid-state image-sensing device comprises: an active pixel sensor (APS) array including pixels disposed in a two-dimensional matrix, each pixel for outputting a photoelectrically converted image signal generated by a photodiode in response to one of a plurality of transmission control signals transmitted to a selected row of the APS array, and for generating and outputting a reset signal in response to a reset control signal; a row driver for selecting a row of the APS array by generating row selection signals and for generating the reset control signal; an integration time control driver for generating the transmission control signals for setting non-uniform integration times of the photodiodes in each pixel; and an analog-digital converter for converting an analog signal corresponding to a difference between the image signal and the reset signal into a digital signal.

In a multi-layer interconnection structure, the wiring length is to be reduced, and the interconnection is to be straightened, at the same time as measures need to be taken against radiation noise. To this end, there is disclosed a semiconductor device in which plural semiconductor substrates, each carrying semiconductor elements, are bonded together. On each semiconductor substrate is deposited an insulating layer through which is formed a connection wiring passed through the insulating layer so as to be connected to the interconnection layer of the semiconductor element. On a junction surface of at least one of the semiconductor substrates is formed an electrically conductive layer of an electrically conductive material in which an opening is bored in association with the connection wiring. The semiconductor substrates are bonded together by the solid state bonding technique to interconnect the connection wirings formed on each semiconductor substrate.

A solid-state image sensor of a charge sorting method used in a time-of-flight measurement method, in which noise derived from background light, which is caused by the reflection light from the subject derived from background light is eliminated, reflection light from the subject derived from a predetermined light source, which is previously set in the solid-state image sensor, is effectively extracted as a signal component to achieve high sensitivity and low noise, which is a solid-state image sensor that is equipped with a plurality of charge-storage sections, discriminates photoelectrons generated by incoming light on the incoming timing and sort to the above-described plurality of charge-storage sections, and measures the timing of the incoming light, in which the sensor has: a plurality of capacitors that capable of conducting to the plurality of charge-storage sections; and a control section that controls a conducted state between the above-described plurality of charge-storage sections and the above-described plurality of capacitors, in which by selectively conducting the above-described plurality of charge-storage sections and the above-described plurality of capacitors by the control of the above-described control section, the difference component of charge stored in the above-described plurality of charge-storage sections is extracted.

A light engine assembly, comprising at least one trim element, a light engine housing, and a light engine comprising at least one solid state light emitter. In some embodiments, an external surface of the light engine housing is in contact with an internal surface of the trim element. In some embodiments, the light engine assembly further comprises at least one thermal interface element positioned between and in contact with the light engine housing and the trim element. In some embodiments, the light engine assembly further comprises light engine housing fins which are in contact with the light engine housing and the trim element.

A method for improving source / drain performance through conformal solid state doping and its resulting device are disclosed. Specifically, the doping takes place through an atomic layer deposition of a dopant layer. Embodiments of the invention may allow for an increased doping layer, improved conformality, and reduced defect formation, in comparison to alternate doping methods, such as ion implantation or epitaxial doping.