607 results about "Ic devices" patented technology

A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is located on a hotspot of the IC die. The hotspot is thermally coupled to a thermal interconnect member. In an aspect, the package is encapsulated in a mold compound. In a further aspect, a heat spreader is attached to the mold compound, and is thermally coupled to the thermal interconnect member. In another aspect, a thermal interconnect member thermally is coupled between the heat spreader and the substrate.

A wireless IC device includes a wireless IC chip having a power supply circuit including a resonant circuit having a predetermined resonant frequency and a radiation plate that externally radiates a transmission signal supplied from the power supply circuit and that supplies a reception signal externally transmitted to the power supply circuit. The radiation plate is connected to the power supply circuit via an electric field or the radiation plate is coupled to the power supply circuit via a magnetic field. The radiation plate is a two-surface-open type radiation plate including at least one radiation portion arranged to externally exchange a transmission-reception signal and a power supply portion arranged to exchange a transmission-reception signal with the power supply circuit.

An antenna includes a feeder terminal and a resonance circuit. The resonance circuit is defined by a capacitance element and an inductance element and includes first and second radiation plates. The capacitance element is electromagnetically coupled to the first radiation plate, and the inductance element is electromagnetically coupled to the second radiation plate. A radio IC device includes an electromagnetic coupling module including a feeder circuit substrate on which a radio IC chip is mounted, and radiation plates. The feeder circuit substrate includes an inductance element and a capacitance element. One of the radiation plates faces and is magnetically coupled to the inductance element. The other radiation plate faces and is electrically coupled to the capacitance element. The radio IC chip is operated by signals received by the radiation plates, and a response signal from the radio IC chip is radiated from the radiation plates.

A radio frequency IC device includes a radio frequency IC chip, a feeder circuit substrate, and a radiating plate. The feeder circuit substrate includes a feeder circuit that electrically connects to the radio IC chip and that includes a resonance circuit and / or a matching circuit including inductance elements. The feeder circuit substrate is bonded to the radiating plate, which radiates a transmission signal supplied from the feeder circuit and supplies a received signal to the feeder circuit. The inductance elements are arranged in spiral patterns wound in opposite directions and couple to each other in opposite phases. The radio frequency IC device is able to obtain a radio frequency IC device that is not susceptible to being affected by a usage environment, minimizes variations in radiation characteristics, and can be used in a wide frequency band.

An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.

A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

A wireless IC device includes a wireless IC chip for processing a transmission / reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit / receive a radio frequency signal. A feeder circuit board including a resonant circuit and / or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.

A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to radiate a transmission signal supplied from the power-supply circuit board and / or receiving a reception signal to supply the reception signal to the power-supply circuit board. The radiation plate includes an opening provided in a portion thereof and a slit connected to the opening. When viewed in plan from the direction of the winding axis of the coil pattern, the opening in the radiation plate overlaps with an inner area of the coil pattern and the area of the inner area is approximately the same as that of opening.

A semiconductor device includes an integrated circuit (IC) die including a substrate, and at least one through substrate via (TSV) that extends through the substrate to a protruding integral tip that includes sidewalls and a distal end. The protruding integral tip has a tip height between 1 and 50 μm. A metal layer is on the bottom surface of the IC die, and the sidewalls and the distal end of the protruding integral tips. A semiconductor device can include an IC die that includes TSVs and a package substrate such as a lead-frame, where the IC die includes a metal layer and an electrically conductive die attach adhesive layer, such as a solder filled polymer wherein the solder is arranged in an electrically interconnected network, between the metal layer and the die pad of the lead-frame.

A wireless IC device includes an electromagnetic coupling module, which includes a feeder circuit board having a wireless IC chip arranged to process transmission and reception signals mounted thereon, and a radiation plate. Linear loop electrodes provided in the radiation plate are electromagnetically coupled to planar electrodes located on a surface of the feeder circuit board. A signal received by the radiation plate drives the wireless IC chip. A response signal from the wireless IC chip is transmitted to the outside from the radiation plate. A frequency of the transmission and reception signals is substantially determined by inductance of the loop electrodes, capacitance between the loop electrodes and the planar electrodes, and stray capacitance generated between lines of the loop electrodes.

A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.

For testing electrical properties of packaged IC devices, there is provided an apparatus which includes a test board which is located at a testing station and provided with a plural number of contacting sockets for connecting individual IC devices to an IC tester separately and independently of each other, a loader which is located at a loading station and adapted to feed untested IC devices toward the test board, an unloader which is located at an unloading station and adapted to discharge tested IC devices from the test board at the testing station, and a device transfer mechanism which is movable across the testing station to transfer untested IC devices from the loader to the test board and also to transfer tested IC devices from the test board to the unloader. Upon detecting completion of a test on one of IC devices in one socket of the test board, a fresh untested IC device is transferred to the testing station to replace the tested IC device. As soon as the fresh IC device is set in position in that socket, execution of a test program is started with respect to that socket on the test board.

A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted / received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and / or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a ground electrode provided on a printed wiring circuit board, and in which a wireless IC chip that processes a transmission / reception signal or an electromagnetic coupling module is coupled to the loop electrode. The ground electrode is coupled to the wireless IC chip or the electromagnetic coupling module via the loop electrode, and transmits or receives a high-frequency signal. The ground electrode is formed with a slit for adjusting a resonant frequency thereof.

An integrated circuit (IC) device fabrication process may be monitored by processing product wafers to fabricate product IC devices, collecting process tool data from tools used to fabricate the product IC devices, and testing the product IC devices. To predict and monitor yield, the process tool data collected during processing and the defectivity data from testing the product IC devices may be input to a yield model that also takes into account design information particular to the product devices. The design information may comprise layout attributes of the product devices. The yield model may be generated from a defectivity model created by processing test wafers to fabricate test structures, collecting process tool data from tools used to fabricate the test structures, and testing the test structures. The test structures may have varying layout attributes to cover a design space allowed by design rules for particular product IC devices.

A radio IC device that is highly efficient in transmitting signals from a radio IC to a radiation pattern includes a radio IC chip arranged to processes radio signals, an auxiliary electrode pattern that is connected to the radio IC chip and includes a loop-shaped electrode, and a radiation electrode pattern that includes a magnetic-field radiation electrode having a resonant frequency and an electric-field radiation electrode having a resonant frequency. The loop-shaped electrode of the auxiliary electrode pattern is coupled to a maximum-voltage section of the magnetic-field radiation electrode through a capacitor.

The present invention provides a flexible circuit connector for electrically coupling IC devices to one another in a stacked configuration. Each IC device includes: (1) a package having top, bottom, and peripheral sides; and (2) external leads that extend out from at least one of the peripheral sides. In one embodiment, the flexible circuit connector comprises a plurality of discrete conductors that are adapted to be mounted between the upper side of a first package and the lower side of a second package. The flexible circuit connector also includes distal ends that extend from the conductors. The distal ends are adapted to be electrically connected to external leads from the first and second packages to interconnect with one another predetermined, separate groups of the external leads. In this manner, individual devices within a stack module can be individually accessed from traces on a circuit card. This flexible capability is beneficial in modules such as memory modules with multiple, stacked memory devices.

A composite antenna achieves favorable radiation characteristics and favorable communication performance, and can be used in short distance communication as well as long distance communication. The composite antenna includes a dipole antenna having an elongated shape, a loop antenna including at least one pair of opposing end portions, and a connection portion arranged to connect the dipole antenna and a point of the loop antenna at which the amplitude of a current flowing in the loop antenna has a maximum value. The dipole antenna performs long distance communication utilizing an electric field, and the loop antenna performs short distance communication utilizing a magnetic field. This composite antenna may be used as a wireless IC device in RFID systems.

An integrated circuit (IC) package for an IC device, and a method of making the same. The IC package includes an interconnect assembly with at least one printed compliant layer, a plurality of first contact members located along a first major surface, a plurality of second contact members located along a second major surface, and a plurality of printed conductive traces electrically coupling a plurality of the first and second contact members. The compliant layer is positioned to bias at least the first contact members against terminals on the IC device. Packaging substantially surrounds the IC device and the interconnect assembly. The second contact members are accessible from outside the packaging.

Methods and circuitry for reducing ground bounce and VCC sag effects in integrated circuit (“IC”) devices is provided. In particular, a via-programmable design for I / O circuitry in IC devices is provided. The via-programmable I / O circuitry is used to disconnect I / O pin driver circuitry from and create a substantially direct connection between unused I / O pins and the ground and / or VCC signals of an IC device to reduce ground bounce and VCC sag, respectively.

Semiconductor devices (300, 400, and 500) including an integrated circuit (IC) device (100) coupled to a micro-electro-mechanical systems (MEMS) device (200) and a method (600) for producing same are disclosed. The IC device includes a die seal ring (130) and the MEMS device includes a MEMS seal ring (230), and the IC device is coupled to the MEMS device via the die seal ring and the MEMS seal ring. The MEMS device may include one or more passive devices (450, 475) coupled to it. Moreover, a substrate (510) including an aperture (550) may be coupled to the passive device, wherein the aperture enables the passive device to be trimmed after being disposed on the MEMS device. The semiconductor devices include an RF signal path (486) and at least one other signal path (482 and 484), wherein the other signal path(s) may be an analog and / or a digital signal path.

The present invention relates to one kind of protection device and IC manufacturing process. The protection device includes one NMOS / PMOS pair with a dynamic initial voltage, and the NMOS and the PMOS have separate grids coupled to the semiconductor in the channel area. Cooperating with proper metal connection, the said structure can protect IC in manufacture from plasma and charge damage and protect IC in operation from abnormal voltage.

Data digits and correction digits are received in each of a number of integrated circuit (IC) devices. Apparatus, systems, and methods are disclosed that operate to check the data digits for error in each IC device according to an algorithm associated with the IC device, the algorithm being different for each IC device. Each IC device will act in response to the data digits if no error is detected in the data digits. Additional apparatus, systems, and methods are disclosed.

An electrical interconnect for providing a temporary interconnect between terminals on an IC device and contact pads on a printed circuit board (PCB). The electrical interconnect includes a substrate with a first surface having a plurality of openings arranged to correspond to the terminals on the IC device. A compliant material is located in the openings. A plurality of conductive traces extend along the first surface of the substrate and onto the compliant material. The compliant material provides a biasing force that resists flexure of the conductive traces into the openings. Conductive structures are electrically coupled to the conductive traces over the openings. The conductive structures are adapted to enhance electrical coupling with the terminals on the IC device. Vias electrically extending through the substrate couple the conductive traces to PCB terminals located proximate a second surface of the substrate.

A method provides electrical connections to a stack of contact levels of an interconnect region for a 3-D stacked IC device. Each contact level comprises conductive and insulation layers. A portion of any upper layer is removed to expose a first contact level and create contact openings for each contact level. A set of N masks is used to etch the contact openings up to and including 2N contact levels. Each mask is used to etch effectively half of the contact openings. When N is 3, a first mask etches one contact level, a second mask etches two contact levels, and a third mask etches four contact levels. A dielectric layer may be formed on the sidewalls of the contact openings. Electrical conductors may be formed through the contact openings with the dielectric layers electrically insulating the electrical conductors from the sidewalls.

A surface mount electrical interconnect adapted to provide an interface between contact pads on an LGA device and a PCB. The electrical interconnect includes a socket substrate having a first surface with a plurality of first openings having first cross-sections, a second surface with a plurality of second openings having second cross-sections, and center openings connecting the first and second openings. The center openings include at least one cross-section greater than the first and second cross-sections. A plurality of contact members are located in the socket substrate such that first contact tips are located proximate the first openings, second contact tips are located proximate the second openings, and center portions located in the center openings.

A surface mount electrical interconnect is disclosed that provides an interface between a PCB and solder balls of a BGA device. The electrical interconnect includes a socket substrate and a plurality of electrically conductive contact members. The socket substrate has a first layer with a plurality of openings configured to receive solder balls of the BGA device and has a second layer with a plurality of slots defined therethrough that correspond to the plurality of openings. The contact members may be disposed in the openings in the first layer and through the plurality of slots of the second layer of the socket substrate. The contact members can be configured to engage a top portion, a center diameter, and a lower portion of the solder ball of the BGA device. Each contact member electrically couples a solder ball on the BGA device to the PCB.