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845results about How to "Reduce the possibility of damage" patented technology

Mobile device with cushion devices

ActiveUS8509865B1Reduce possibility of damageGreat impact resistanceOther accessoriesTransmissionCushionBiomedical engineering
A case for a mobile device including a base wall and a plurality of side walls extending from the base wall to cover side surfaces of the mobile device. A plurality of cushion devices may pass through the side surfaces to cushion the mobile device from a force exerted upon the case.
Owner:SUPERIOR COMM

Sport helmet

A helmet padding consists of sets of one or more tubes, with each set of tubes located at a crucial area of the shell of the helmet. An armature and tubes are connected together and mounted within the inner shell of the helmet. The helmet uses a new fastener to fasten a cage to the helmet shell allowing sides of the cage to be mounted directly against the shell, reducing the width of the shell on each side. A ball is attached to a portion of a bar of the cage to act as a limit stop precluding movements of the cage with respect to the helmet. A chin bar is fastened to the helmet at two points on each side of the shell. The shell is molded with recessed portions designed to receive the two branches of the chin bar on each side where they will be fastened to the shell so that the outer surfaces of the chin guard are flush with the shell at the locations of attachment to provide a smooth transition and reduce weight. An adjustment device to adjust the fit of the helmet to the user includes a star wheel on each side of the helmet attached to an arcuate flexible strip extending rearwardly around the occipital area of the skull. A sliding mechanism attached to the strip allows the strip to be moved forward and backward to allow it to be tightened or loosened, respectively, with respect to the player's head. A ratcheting lateral adjustment device is also disclosed.
Owner:CASCADE MAVERIK LACROSSE LLC

Method for molding a small form factor digital memory card

ActiveUS20060281229A1Reduce possibility of damageReinforce solder connectionSemiconductor/solid-state device detailsPrinted circuit aspectsDigital memoryMelt flow index
A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash IC and a (e.g., land grad array) controller package for enclosing a controller IC are mounted on a printed wiring board within a mold cavity. A high melt flow index resin is injected into the mold cavity to form an integral, solid body within which to completely encapsulate the flash IC and controller packages and form a cover over top the flash IC package so as to maintain the required memory card height tolerance. In one embodiment, the resin material is injected downwardly into the mold cavity from locations above the respective rows of leads of the flash IC package. In another embodiment, the resin material is injected laterally into the mold body from locations at opposite sides thereof adjacent the respective rows of leads of the flash IC package.
Owner:KINGSTON DIGITAL CO LTD
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