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126 results about "Low insertion force" patented technology

Low insertion force (LIF) is a technology used in integrated circuit sockets that are designed so the force required to insert or remove a package is low. Initially, the LIF connectors were designed as a cheaper alternative compared to zero insertion force (ZIF) connectors, to facilitate programming and testing of equipment. Compared with standard IC sockets, they achieve a lower friction force between the contacts of the device and the socket, making insertion and removal of the device easier, while at the same time eliminating the need for the complex mechanism that is used in ZIF sockets.

Thin multichip flex-module

A low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins. Alternatively, a low insertion force multichip in-line module comprises: a substantially rigid frame; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit having contacts at least partially exposed along one edge of the frame; a socket configured to matably engage the module; and, a compliant layer disposed between the exposed flex circuit and the rigid frame, whereby controlled deformation of the compliant layer enhances electrical continuity between the contacts and corresponding external electrical pins.
Owner:MICROELECTRONICS ASSEMBLY TECH

Push-in removable fastener

A plastic push-in or drive fastener having a enlarged head and a shank is disclosed. The fastener is configured to allow the shank to be pushed through a complementary shaped aperture or opening in an article using a relatively low insertion force. A helical screw or rib formation on the fastener shank provides a retention force opposing the fastener from being axially withdrawn from the article while readily permitting withdrawal of the fastener from the article in response to rotation of the fastener about its axis. Moreover, the fastener shank is configured to prevent inadvertent separation of the fastener from the article through which it passes.
Owner:ILLINOIS TOOL WORKS INC

Low insertion force grommet

A grommet mainly made of soft, pliable material has a flange section for sealing against a first side of a vehicle panel around an aperture through the panel. A groove separates the flange section from a conical section that tapers from the groove to a narrower tubular section for tightly fitting around a wire harness passed through the grommet. The conical section has a wider end adjacent the groove that presses against a second, opposite side of the panel when the groove receives an edge of the aperture and the grommet is seated on the panel. The conical section has a region that engages the edge of the aperture as the grommet is pulled to an installed position. A plurality of raised, hard, rigid contact pads are arranged in a circumferential row around the engagement region to provide low friction while sliding past the edge of the aperture when the grommet is pulled through the aperture. The contact pads are spaced apart by recesses that maintain the compressibility of the grommet and keep the soft grommet material between the pads from contacting the edge of the aperture during installation. Angled tabs extend from undersides of the contact pads to help secure the pads on the grommet. The contact pads are connected by a ring structure embedded in the conical section.
Owner:YAZAKI NORTH AMERICA

Cap and low insertion force connector for printed circuit board

A cap that is to be fitted to a printed circuit board, which has a conductive pad on the front side of the rectangular board thereof and which is to be connected to the connector. The cap is formed into a bag and is shaped into a wedge that gets thinner towards the front, and the cap has a window for exposing the conductive pad of the printed circuit board. A low insertion force connector that connects a printed circuit board having conductive pads on the front side of the rectangular board thereof. This low insertion force connector comprises a connector body having at least a pair of contacts that contact the conductive pads and clamp the printed circuit board, a slider that carries the printed circuit board and advances to and retreats from the contact, and a guide that is provided at the front end of the slider and is formed into a wedge-shape, which gets thinner towards the front. The present invention reduces the insertion force of the printed circuit board, enhances the connection workability, and eliminates damages or the like to the contacts and the conductive pad to enhance the reliability. The present invention provides a connector that is also effective in countermeasures against heat and electromagnetic waves.
Owner:JST MFG CO LTD

Press-fit terminal and electronic component using the same

There are provided a press-fit terminal which has an excellent whisker resistance and a low inserting force, is unlikely to cause shaving of plating when the press-fit terminal is inserted into a substrate, and has a high heat resistance, and an electronic component using the same. A press-fit terminal comprises: a female terminal connection part provided at one side of an attached part to be attached to a housing; and a substrate connection part provided at the other side and attached to a substrate by press-fitting the substrate connection part into a through-hole formed in the substrate. At least the substrate connection part has the surface structure described below, and the press-fit terminal has an excellent whisker resistance. The surface structure comprises: an A layer formed as an outermost surface layer and formed of Sn, In, or an alloy thereof; a B layer formed below the A layer and constituted of one or two or more selected from the group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir; and a C layer formed below the B layer and constituted of one or two or more selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu. The A layer has a thickness of 0.002 to 0.2 μm. The B layer has a thickness of 0.001 to 0.3 μm. The C layer has a thickness of 0.05 μm or larger.
Owner:JX NIPPON MINING& METALS CORP
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