57results about How to "Lower self-esteem" patented technology

A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing helical prongs so as to allow the prongs of the connector to spirally open around the post or ball-like bump and mechanically grip the post or bump as the post or bump is inserted along the longitudinal axis of the tube. The tubular element may be made by forming helical prongs in the end of a tube in helical cuts from about a mid section to one end of the tube.

A transformer unit and a power converting device, which lessen the influence of noise caused by an external magnetic flux, while reducing the temperature dependency of a coupling coefficient, and which transfer signals while insulating a low-voltage and a high-voltage side electrically. Air-core type insulated transformers have a first and second winding of a primary winding as a sending side and a first and second winding of a secondary winding as a receiving side. The windings of the primary winding are connected in parallel and are wound so that the directions of magnetic fields generated by an exciting current oppose each other. The windings of the secondary winding are wound so that electromotive forces to be generated by an external magnetic flux cancel each other, and are connected in series so as to raise the electromotive forces by a signal magnetic flux generated by the primary winding.

A socket connector for connecting a bulbous terminal or ball wherein the female element grips the terminal with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing prongs of a width that decreases with axial distance from the end of the connector so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.

A semiconductor module includes an insulating substrate (200) that is made of AlN and that has a first plane (201) and a second plane (202) both of which face mutually opposite directions, a first conductor layer (210) formed on the first plane (201), a second conductor layer (220) formed on the second plane (202), a semiconductor device (300) bonded to the first conductor layer (210) with a first solder layer (510) interposed therebetween, and a heat dissipation plate (400) that is formed in a rectangular shape when viewed planarly and that is bonded to the second conductor layer (220) with a second solder layer (520) interposed therebetween, and, in this semiconductor module, the heat dissipation plate (400) is deformed so as to become convex in a direction in which the second plane (202) is pointed when viewed from a width direction thereof.

This capacitor has: a single capacitor block provided with a plurality of capacitor elements electrically connected in parallel, each of said capacitor elements having a terminal part on each end; a first electrode plate that electrically connects the first terminal parts of the capacitor elements; a second electrode plate that electrically connects the second terminal parts of the capacitor elements and continues on to the side where the first terminal parts are; and at least one bypass electrode plate that electrically bypasses the second electrode plate.

A method is provided for manufacturing a wind turbine rotor blade in which the blade is formed as a laminated structure by laying a composite material of fiber reinforcement material and / or core material in a mold defining the shape of the blade; evacuating the mold after laying the composite material; introducing a liquid polymer into the evacuated mold and wetting the composite material; curing the liquid polymer after the composite material has been wetted; and removing the mold after curing the liquid. At least one lightning conductor is integrated into the composite material before wetting it with the liquid polymer. Moreover, a wind turbine rotor blade made from a single laminated structure is provided with at least one lightning conductor is integrated into the laminated structure.

The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switches 13a and 13b, an output terminal, positive / negative polarity DC terminals 2 and 3, and an insulating substrate 15a in which conductor layers 12, 17 and 19 having a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layers 16 and 18 are alternately laminated. The surface and inner-layer conductor layers 12 and 17 which interpose the insulating layer 16 therebetween are electrically connected by a conductor 20 passing through the insulating layer 16 interposed between the conductor layers 12 and 17. A current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layers 12 and 17 which interpose the insulating layer 16 therebetween.

The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact. These contact portion and guide projection are set at an interval such that the solder ball may be brought into contact with the both.

The invention relates to a total-stroke and total-space transient electromagnetic device and measuring method. The device comprises a transmitting unit and a multi-channel receiving unit, wherein the transmitting unit and the multi-channel receiving unit are respectively connected with a signal processing unit, the signal processing unit is connected with a main engine through a communication unit, relevant parameters are set through operation software of the main engine, the receiving unit and the transmitting unit jointly achieve field source excitation and complete collection, recording and the like of an induction signal and an excitation source signal, the induction signal and the excitation source signal are transmitted to the main engine through an RS485, and the display, storage, management and the like of the data are achieved. According to the total-stroke and total-space transient electromagnetic device and measuring method, the self-induction and mutual induction influences can be effectively reduced, the signal to noise ratio and the sensitivity are improved, receiving coils can be combined into different types according to the detection requirement, the different detection effects can be obtained, and the judgment on the direction of an abnormal body can be achieved under the total-space situation. The number of detection blind zones can be reduced, the superficial zone detection effect can be improved, an ARM quad-core processer hardware platform is adopted, a special embedded type operation system is configured, and real-time imaging, comparison, judgment and subsequent analysis can be conveniently carried out on the measured data.

The present invention is directed to a socket connector having a plurality of contacts for contacting with a plurality of solder balls arranged on one of the surface of a semiconductor package, and a socket body in which a plurality of mounting holes are provided for mounting respective contacts. The mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole of the contact. Each contact is provided with an upright piece extending through the through-hole, and a support piece extending from the upright piece to be inserted into the support hole. A contact portion for contacting with the solder ball is formed at a tip end portion of the upright piece. The support piece extends from the proximal end portion of the upright piece.

The invention discloses a method for preparing a compound bus, which comprises the following steps: 1) A soft gluing insulation film is clipped according to the shape of a finished conductor plate, insulation sealing sides are reserved on the a middle opening of the insulation film and the conductor plate and positions which correspond to side edges. 2) The insulation film of step 1 is correspondingly superimposed on the upper surface and the lower surface of the conductor plate according to shape of the conductor plate. 3) The conductor plate of the step 2 is placed in a die to be thermally pressed, which leads the insulation film and the conductor plate to form an integrated body, simultaneously, the insulation sealing sides which are reserved on the middle opening on the conductor plate and the positions of the side edges are pressed into an integrated body, thereby making to the compound bus. 4) Cooling and mould unloading. The compound bus which is made by the method has the advantages of low product cost, simple process, high production efficiency and excellent insulating property and the like.

The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact. These contact portion and guide projection are set at an interval such that the solder ball may be brought into contact with the both.

The invention belongs to the technical field of transient electromagnetic explorations and more particularly, to a coil for transient electromagnetic explorations and the application method thereof. The transmitting loops and the receiving loops are arranged on the same plane; among the transmission loops, among the receiving loops and among the transmission loops and the receiving loops, they all share the same central point. The turns of the transmission loops and the turns of the receiving loops are all arranged at some intervals; and the turns are all arranged in a spirally winding manner; and they are mutually embedded and sleeved. The numbers of the turns of the receiving loops are greater or equal to those of the transmitting loops. The turns of the transmitting loops can be either in series connection or in parallel connection; the turns of the receiving loops are in series connection only. The coil of the invention can be independently collected or released. And it is also portable. For the intervals among the receiving loops, under the condition that the number of the turns is a fixed one, it is possible to effectively reduce self-inductance and the distribution capacitance so as to shorten the transient process of the coil. In addition, as the transmitting loops and the receiving loops are mutually embedded and arranged at intervals. The mutual inductance coefficient of the two kinds of loops can be reduced so as to favorably obtain early effective signals, reduce the detection blind area in the shallow part, and improve the exploration in shallow layer, making the coil especially applicable to city engineering geophysical prospecting.

An electrical motor or generator comprises a rotor 79 without windings, a stator 78 having armature windings comprising at least two coils A1, A2 having active portions positioned within armature winding slots 81 in a stator iron, and field windings F having active portions positioned within field winding slots 80 in the stator iron. An electronic control circuit is provided for controlling the currents in the coils A1, A2 in synchronism with rotation of the rotor such that periods in which a magnetomotive force is generated in one direction by current flow in one of the coils alternate with periods in which a magnetomotive force is generated in the opposite direction by current flow in another of the coils. The armature winding slots and the field winding slots are equal in number and alternate with one another in the stator iron. Furthermore, considering the width of each slot 80, 81 as being the maximum extent of the slot in the direction of rotation of the rotor and considering the depth of each slot as being the maximum extent of the slot radially of the rotor and the thickness of the back iron behind the slot as being the distance between the maximum extent of the slot and the maximum extent of the armature iron along the same radial direction, the width of each armature slot 81 is greater than the width of each field winding slot 80 and the thickness of the back iron behind each armature winding slot 81 is greater than the thickness of the back iron behind each field winding slot 80. Such an arrangement optimises the power efficiency whilst making best use of the magnetic material.

This capacitor has: a single capacitor block (14) provided with a plurality of capacitor elements (12) electrically connected in parallel, each of said capacitor elements (12) having a terminal part (18a, 18b) on each end; a first electrode plate (20a) that electrically connects the first terminal parts (18a) of the capacitor elements (12); a second electrode plate (20b) that electrically connects the second terminal parts (18b) of the capacitor elements (12) and continues on to the side where the first terminal parts (18a) are; and at least one bypass electrode plate (22) that electrically bypasses the second electrode plate (20b).

The invention discloses a superconductor critical current and shunt temperature test device comprising a back field magnet, a temperature-variable sample dewar, a superconducting transformer, a cryogenic system, and a quenching detection and quenching protection system. The cryogenic system comprises a cryogenic refrigerator, a liquid helium storage tank, a superconducting transformer dewar, a back field magnet dewar, and a cryogenic transmission pipeline. The superconductor critical current and shunt temperature test device of the invention is applicable to superconductor critical current and shunt temperature test in a high back field. The maximum test back field is 10T, and the maximum test current is up to 50kA. The superconductor critical current and shunt temperature test device of the invention has the advantages of high test precision, low test cost, convenience of sample replacement, short test cycle, and the like.

The invention discloses an ultra wide band electric field probe using a U-shaped structure. The ultra wide band electric field probe includes arc edge reference planes, a U-shaped signal line, an intermediate signal line and a top layer signal line. The arc edge reference planes include a top layer reference plane and a bottom layer reference plane, and the top layer reference plane and the bottomlayer reference plane are correspondingly of symmetrical similar 'T' shape structures in the central line of the plane of the probe. The U-shaped signal line is located between the top layer reference plane and the bottom layer reference plane, and a narrow handle end located on the intermediate layer of the probe is a transmission line of a strip line structure. Two arms of the open end of the U-shaped signal line are distributed symmetrically in the center line of the plane of the probe. The arc end of the U-shaped signal line is connected with the intermediate layer signal line, and the intermediate layer signal line is connected to the top layer signal line through a connecting hole. The ultra wide band electric field probe has the characteristics of ultra wide band and high sensitivity, the defect that in a traditional test, signals of weak electric fields and ultra wide band testing are not measured are effectively improved, and veracity of testing results is ensured.

A power electronic capacitor with high space utilization rate, comprising a capacitor core assembly (2) located in the inner cavity of a housing (3) and a two-pole electrode assembly (1), the electrode assemblies (1) of each pole include capacitor cores The electrical connecting wires (5) connected to the gold-sprayed layer at one end and the electrode leads (6) connected to these electrical connecting wires, the capacitor core assembly (2) is composed of a plurality of capacitor cores, and between each capacitor core and The gap perfusion filling layer (4) between them and the inner wall of the shell (3) is characterized in that: the capacitor core includes a large capacitor core (7) and a small capacitor core (8), and the small capacitor core ( 8) The space between the major capacitor cores (7). The design reduces the volume and inductance of the capacitor, is beneficial to the heat dissipation of the capacitor, improves the reliability of the capacitor and reduces the cost.

The invention discloses an electric connector which is used for electrically connecting a chip module to a circuit board. The electric connector is characterized by comprising an insulating body and at least one terminal; the insulating body is arranged on the circuit board and provided with at least one containing groove; the at least one terminal is arranged in the containing grooves and electrically connected with the circuit board; and in each terminal, a base is arranged and fixed to the containing groove, an abutting pressing arm is formed by extending upwards from the base to one side of the corresponding containing groove, a first elastic arm is formed by extending upwards from the base to the other end of the containing groove, a second elastic arm is connected with the first elastic arm and extends downwards, the first elastic arm is exposed to the insulating body and used for being connected with the chip module, a third elastic arm is formed by extending to the abutting pressing arm, and when the chip module presses the terminal, the third elastic arm moves and abuts against the abutting pressing arm. According to the electric connector, by obliquely arranging the abutting pressing arms, the positive force between the third elastic arms and the abutting pressing arms is greater, therefore, abutting between the third elastic arms and the abutting pressing arms is more reliable, and then stable contact between the terminals and the chip module is guaranteed.

The invention provides a variable-frequency power electronic capacitor and relates to the technical field of organic medium fixed capacitors. The variable-frequency power electronic capacitor comprises a shell, wherein the shell is internally provided with a core body; both ends of the core body are connected with a metal spraying layer; the outer side of the metal spraying layer is connected with a soldering lug; filling materials are filled into the shell; the shell is made from none-ferromagnetic material with low high-frequency eddy current heating; the none-ferromagnetic material shell is of an aluminum or copper shell; and a polypropylene film is used as medium of the core body. The capacitor has the advantages that the inner structure is more reasonable, the high-frequency large current is adapted by using the low ESL (equivalent series inductance) and ESR (equivalent series resistance) technologies, the self-inductance and the equivalent series resistance are reduced, and the heating loss is decreased; the partial discharge voltage under high frequency is enhanced and the radiating condition is improved, so that the high-frequency property is more excellent and the service life is longer.

The invention belongs to the technical field of transient electromagnetic explorations and more particularly, to a coil for transient electromagnetic explorations and the application method thereof. The transmitting loops and the receiving loops are arranged on the same plane; among the transmission loops, among the receiving loops and among the transmission loops and the receiving loops, they all share the same central point. The turns of the transmission loops and the turns of the receiving loops are all arranged at some intervals; and the turns are all arranged in a spirally winding manner; and they are mutually embedded and sleeved. The numbers of the turns of the receiving loops are greater or equal to those of the transmitting loops. The turns of the transmitting loops can be either in series connection or in parallel connection; the turns of the receiving loops are in series connection only. The coil of the invention can be independently collected or released. And it is also portable. For the intervals among the receiving loops, under the condition that the number of the turns is a fixed one, it is possible to effectively reduce self-inductance and the distribution capacitance so as to shorten the transient process of the coil. In addition, as the transmitting loops and the receiving loops are mutually embedded and arranged at intervals. The mutual inductance coefficient of the two kinds of loops can be reduced so as to favorably obtain early effective signals, reduce the detection blind area in the shallow part, and improve the exploration in shallow layer, making the coil especially applicable to city engineering geophysical prospecting.

The invention discloses a pulse high-intensity magnetic field generation device, which comprises a power source, a first control unit, an energy storage switch, an energy storage capacitor, a second control unit, an energy discharge switch, an energy transducer, a first sampling unit, a second sampling unit and a main control circuit. The power source, the first control unit, the energy storage switch, the energy storage capacitor, the second control unit, the energy discharge switch and the energy transducer are connected forwards sequentially, and the energy transducer is connected with thefirst control unit through the second sampling unit. The pulse high-intensity magnetic field generation device has the advantages that the device is capable of controlling generation of pulse magnetic fields accurately by means of essential control, the energy storage process and states of the capacitor are mastered properly by sampling voltage of the capacitor, the value required by the energy storage capacity of the capacitor is fed back and controlled by sampling voltage of pulse magnetic fields, different control processes share out the work while cooperating with each other, the device has universality in application, and a control circuit thereof is simple and low in cost.

The present invention is directed to a socket connector having a plurality of contacts for contacting with a plurality of solder balls arranged on one of the surface of a semiconductor package, and a socket body in which a plurality of mounting holes are provided for mounting respective contacts. The mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole of the contact. Each contact is provided with an upright piece extending through the through-hole, and a support piece extending from the upright piece to be inserted into the support hole. A contact portion for contacting with the solder ball is formed at a tip end portion of the upright piece. The support piece extends from the proximal end portion of the upright piece.

A method of integrating a top surface optical device having electrical contacts on the top surface with an electronic chip (324) having electrical contacts on a connection surface comprising forming a trench (308) bounded by walls, the trench Extending from the top surface of the wafer containing the top optics into the wafer substrate (304), making a portion of the wall conductive by applying a conductive material to the portion; and thinning the substrate to expose the conductive material.

The invention relates to a photovoltaic wind-powered dry type direct current filter capacitor which comprises a capacitor core group, an insulating layer, a perfusion material, a metal shell, a shell cover and a lead-out terminal, wherein the capacitor core group is arranged in the metal shell; the insulating layer is arranged between the capacitor core group and the metal shell; the perfusion material is filled in gaps of the metal shell; the lead-out terminal penetrates through the shell cover and is connected with the capacitor core group; the shell cover is buckled on the metal shell, so that the perfusion material is completely sealed. According to the photovoltaic wind-powered dry type direct current filter capacitor, the shell cover is buckled on the metal shell, so that the perfusion material is completely sealed and is not directly contacted with an external environment, and thus external moisture is prevented from influencing the internal capacitor core group by virtue of small holes in the perfusion material. The filter capacitor has the advantages of small size, less self inductance and the like, meets the in-service use requirements and has better market value.

The invention discloses a high-power pulse linear dummy load, which comprises a resistor, outlet connectors connected to two ends of the resistor and an insulating frame for fixing the resistor. The resistor is formed by alternately connected a plurality of bending sections and a plurality of straight sections; the straight sections are parallelly arranged in the insulating frame at certain intervals; and the outlet connectors extend out of the insulating frame. The high-power pulse linear dummy load has the advantages of simple structure, good radiating performance, low manufacturing cost, and suitability for wide application.

The invention discloses a capacitance connecting structure for reducing inductance. The capacitance connecting structure comprises capacitance cores arranged in a layered stacking manner, and busbars used for connecting the capacitance cores, wherein the busbars comprise lead-out parts and connecting parts; the lead-out parts are used for connecting positive and negative lead-out conductors; the connecting parts are used for connecting the capacitance cores; an upper busbar is arranged at the top of each capacitance core; a lower busbar which has vertical flip with each upper busbar is arranged at the bottom of each capacitance core; and connecting parts of the upper busbars and the lower busbars are respectively connected with metal spraying surfaces on the two sides of the capacitance cores. The capacitance connecting structure is an internal structure of a power capacitor; a high-capacity power capacitor can be obtained by adjusting the quantity and an arrangement manner of the capacitance cores as required; self-inductance of the power capacitor can be reduced by a connecting manner of the busbars; circuit equilibrium of the capacitor at high frequency can be ensured; passing current of each capacitance core is stable; and an application characteristic of the capacitor at the high frequency can be greatly improved.

The invention discloses a magnetic field precision compensation and adjustment system and a construction method thereof. The magnetic field precision compensation and adjustment system comprises selecting three pairs of sheets to be served as magnetic field adjusting panels, wherein every pair of sheets comprise two thin panels; setting the length of every thin panel to be s and the width to be b, wherein the magnitude of s is from 10 to 1m and the magnitude of b is from 10 to 2m; sequentially arranging the two thin panels of every pair of sheets in a parallel mode to obtain cubic space which is formed by the three pairs of sheets to be served as magnetic field space, wherein the vertical distance between the two thin panels of any pair of sheets is h and the magnitude of h is from 10 to 2m. The magnetic field precision compensation and adjustment system has the advantages of not only reducing a self-inductance and mutual inductance effect caused by a coil but also being simple in operation structure and high in testing accuracy.