57results about How to "Lower self-esteem" patented technology

A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing helical prongs so as to allow the prongs of the connector to spirally open around the post or ball-like bump and mechanically grip the post or bump as the post or bump is inserted along the longitudinal axis of the tube. The tubular element may be made by forming helical prongs in the end of a tube in helical cuts from about a mid section to one end of the tube.

A method is provided for manufacturing a wind turbine rotor blade in which the blade is formed as a laminated structure by laying a composite material of fiber reinforcement material and / or core material in a mold defining the shape of the blade; evacuating the mold after laying the composite material; introducing a liquid polymer into the evacuated mold and wetting the composite material; curing the liquid polymer after the composite material has been wetted; and removing the mold after curing the liquid. At least one lightning conductor is integrated into the composite material before wetting it with the liquid polymer. Moreover, a wind turbine rotor blade made from a single laminated structure is provided with at least one lightning conductor is integrated into the laminated structure.

The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact. These contact portion and guide projection are set at an interval such that the solder ball may be brought into contact with the both.

The present invention is directed to a socket connector having a plurality of contacts for contacting with a plurality of solder balls arranged on one of the surface of a semiconductor package, and a socket body in which a plurality of mounting holes are provided for mounting respective contacts. The mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole of the contact. Each contact is provided with an upright piece extending through the through-hole, and a support piece extending from the upright piece to be inserted into the support hole. A contact portion for contacting with the solder ball is formed at a tip end portion of the upright piece. The support piece extends from the proximal end portion of the upright piece.

A semiconductor module includes an insulating substrate (200) that is made of AlN and that has a first plane (201) and a second plane (202) both of which face mutually opposite directions, a first conductor layer (210) formed on the first plane (201), a second conductor layer (220) formed on the second plane (202), a semiconductor device (300) bonded to the first conductor layer (210) with a first solder layer (510) interposed therebetween, and a heat dissipation plate (400) that is formed in a rectangular shape when viewed planarly and that is bonded to the second conductor layer (220) with a second solder layer (520) interposed therebetween, and, in this semiconductor module, the heat dissipation plate (400) is deformed so as to become convex in a direction in which the second plane (202) is pointed when viewed from a width direction thereof.

The invention belongs to the technical field of transient electromagnetic explorations and more particularly, to a coil for transient electromagnetic explorations and the application method thereof. The transmitting loops and the receiving loops are arranged on the same plane; among the transmission loops, among the receiving loops and among the transmission loops and the receiving loops, they all share the same central point. The turns of the transmission loops and the turns of the receiving loops are all arranged at some intervals; and the turns are all arranged in a spirally winding manner; and they are mutually embedded and sleeved. The numbers of the turns of the receiving loops are greater or equal to those of the transmitting loops. The turns of the transmitting loops can be either in series connection or in parallel connection; the turns of the receiving loops are in series connection only. The coil of the invention can be independently collected or released. And it is also portable. For the intervals among the receiving loops, under the condition that the number of the turns is a fixed one, it is possible to effectively reduce self-inductance and the distribution capacitance so as to shorten the transient process of the coil. In addition, as the transmitting loops and the receiving loops are mutually embedded and arranged at intervals. The mutual inductance coefficient of the two kinds of loops can be reduced so as to favorably obtain early effective signals, reduce the detection blind area in the shallow part, and improve the exploration in shallow layer, making the coil especially applicable to city engineering geophysical prospecting.

The invention discloses a high-power pulse linear dummy load, which comprises a resistor, outlet connectors connected to two ends of the resistor and an insulating frame for fixing the resistor. The resistor is formed by alternately connected a plurality of bending sections and a plurality of straight sections; the straight sections are parallelly arranged in the insulating frame at certain intervals; and the outlet connectors extend out of the insulating frame. The high-power pulse linear dummy load has the advantages of simple structure, good radiating performance, low manufacturing cost, and suitability for wide application.

The invention discloses a capacitance connecting structure for reducing inductance. The capacitance connecting structure comprises capacitance cores arranged in a layered stacking manner, and busbars used for connecting the capacitance cores, wherein the busbars comprise lead-out parts and connecting parts; the lead-out parts are used for connecting positive and negative lead-out conductors; the connecting parts are used for connecting the capacitance cores; an upper busbar is arranged at the top of each capacitance core; a lower busbar which has vertical flip with each upper busbar is arranged at the bottom of each capacitance core; and connecting parts of the upper busbars and the lower busbars are respectively connected with metal spraying surfaces on the two sides of the capacitance cores. The capacitance connecting structure is an internal structure of a power capacitor; a high-capacity power capacitor can be obtained by adjusting the quantity and an arrangement manner of the capacitance cores as required; self-inductance of the power capacitor can be reduced by a connecting manner of the busbars; circuit equilibrium of the capacitor at high frequency can be ensured; passing current of each capacitance core is stable; and an application characteristic of the capacitor at the high frequency can be greatly improved.

The invention discloses a pulse high-intensity magnetic field generation device, which comprises a power source, a first control unit, an energy storage switch, an energy storage capacitor, a second control unit, an energy discharge switch, an energy transducer, a first sampling unit, a second sampling unit and a main control circuit. The power source, the first control unit, the energy storage switch, the energy storage capacitor, the second control unit, the energy discharge switch and the energy transducer are connected forwards sequentially, and the energy transducer is connected with thefirst control unit through the second sampling unit. The pulse high-intensity magnetic field generation device has the advantages that the device is capable of controlling generation of pulse magnetic fields accurately by means of essential control, the energy storage process and states of the capacitor are mastered properly by sampling voltage of the capacitor, the value required by the energy storage capacity of the capacitor is fed back and controlled by sampling voltage of pulse magnetic fields, different control processes share out the work while cooperating with each other, the device has universality in application, and a control circuit thereof is simple and low in cost.