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Composite bus bar manufacturing method

A technology of composite busbar and manufacturing method, which is applied in the directions of busbar installation, cable installation, busbar/circuit layout, etc., can solve the problems of suboptimal electrical performance, low production efficiency, heavy weight, etc.

Inactive Publication Date: 2009-03-18
ZHUZHOU CSR TIMES ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The weight of this structure product is heavy, the cost of special molding mold is high, the structure is not compact when the three-dimensional connection is made, and the electrical performance cannot reach the best effect, and the composite busbar is processed by special mold molding technology and insulating glue sealing technology. Low production efficiency

Method used

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  • Composite bus bar manufacturing method
  • Composite bus bar manufacturing method
  • Composite bus bar manufacturing method

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Embodiment Construction

[0029] A method for making a composite busbar includes the following steps:

[0030] 1) According to the conventional processing of the conductor plate, the connecting boss on the conductor plate is stamped and formed by the body material, and the conductor post is welded on the conductor plate and the required coating is plated as required;

[0031] 2) Take the processed conductor plate in step 1), cut the flexible glue-coated insulating film according to the shape of the conductor plate, and reserve 3-15 mm of insulating film on the insulating film corresponding to the middle opening and edge of the conductor plate for edge sealing ;

[0032] 3) The insulating film of step 2) is correspondingly superimposed on the upper and lower sides of the conductor plate according to the shape of the conductor plate;

[0033] 4) Place the conductor plate (single-layer or multi-layer) in step 3) in the flat cavity mold and pressurize and heat (select different parameters according to the...

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Abstract

The invention discloses a method for preparing a compound bus, which comprises the following steps: 1) A soft gluing insulation film is clipped according to the shape of a finished conductor plate, insulation sealing sides are reserved on the a middle opening of the insulation film and the conductor plate and positions which correspond to side edges. 2) The insulation film of step 1 is correspondingly superimposed on the upper surface and the lower surface of the conductor plate according to shape of the conductor plate. 3) The conductor plate of the step 2 is placed in a die to be thermally pressed, which leads the insulation film and the conductor plate to form an integrated body, simultaneously, the insulation sealing sides which are reserved on the middle opening on the conductor plate and the positions of the side edges are pressed into an integrated body, thereby making to the compound bus. 4) Cooling and mould unloading. The compound bus which is made by the method has the advantages of low product cost, simple process, high production efficiency and excellent insulating property and the like.

Description

technical field [0001] The invention relates to a manufacturing method of a composite busbar. Background technique [0002] At present, the general composite busbar adopts the composite structure of rigid or semi-rigid insulating board and conductor plate, and for special-shaped structure products, multiple composite busbars are connected by connecting terminals, or the semi-rigid insulating material and preformed mold are used for complex molding. The conductor plate is compositely molded into a rigid structure, and the port insulation of the composite structure is insulated and sealed by pre-set insulation plugs or opening sealing technology. Reserved insulation can also be used for situations where the size requirements are not strict and the use environment is relatively clean. The distance method ensures electrical insulation. The weight of this structure product is heavy, the cost of special molding mold is high, the structure is not compact when the three-dimensional...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B17/62H01B5/02H02B1/20H02G5/00
Inventor 王忠民张强邵国平李江胜聂赣南颜焱虎
Owner ZHUZHOU CSR TIMES ELECTRIC CO LTD
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