The invention discloses a high thermal conductivity epoxy few adhesive mica tape and a preparation method of the high thermal conductivity epoxy few adhesive mica tape. The high thermal conductivity epoxy few adhesive mica tape is composed of mica paper, an epoxy adhesive layer filled with high thermal conductivity filler, and alkali-free glass cloth. The volume of the high thermal conductivity filler is 20%-40% of the volume of an epoxy adhesive. The high thermal conductivity filler is prepared through the steps of preprocessing with a solution of a silane coupling agent and an absolute ethyl alcohol solution, dispersion, scatter of adhesive powder, press roller hot press composition, cooling, secondary adhesive sizing, baking, rolling-up, cutting and the like. Due to the fact that the inorganic high thermal conductivity filler is used for filling an adhesive of the high thermal conductivity epoxy few adhesive mica tape, a heat conduction network chain is formed inside the adhesive between the mica paper and glass fiber cloth in a high thermal conductivity epoxy few adhesive mica tape system, not only can the temperature of a winding bar be effectively reduced, but also influence on electrical performance and mechanical performance of the high thermal conductivity epoxy few adhesive mica tape is small. The preparation method of the high thermal conductivity epoxy few adhesive mica tape greatly reduces consumption of solvent, and has the advantages of reducing production cost, being energy-saving, reducing emission, and reducing environmental pollution.