The invention discloses a heat convertible resin composition, which comprises epoxide resin which can have combined polymerization with bimaleimide, which occupies 1.75%-18.0% weight of solid of composition, bimaleimide compound which occupies 0.15% to 12.5% weight of solid of composition, free radical initiator, whose addition amount occupies 0.01% to 0.15% molecular fraction which reflects the total monomers, inhibitor whose dosage is a half to a time of initiating agent, styrene monomer- maleic anhydride oligomer which occupies 17.5%-47.0% weight of solid of composition, filling material which occupies 20%-60% weight of solid of composition, dissolvent whose addition amount occupies 30%-50% weight of composition, and combustion inhibitor which can be used to the cover-copper board industry. The invention forms homogeneous solution in low boiling point solvent, the cover-copper board which is produced has the advantages of high vitrifying transformation temperature, excellent dielectric property, low expansion coefficient, low water absorption ratio, high heat shock resistance, excellent heat conductivity and the like.